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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC9S08DV16MLF |
| Description | MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE; |
| Datasheet | MC9S08DV16MLF Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 24 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 48 |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK |
| Technology: | CMOS |
| JESD-30 Code: | S-PQFP-G48 |
| Package Shape: | SQUARE |
| ROM Words: | 16896 |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | QFP |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 40 rpm |
| Peripheral IC Type: | MICROCONTROLLER |
| RAM Bytes: | 1024 |
| Bit Size: | 8 |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP48,.35SQ,20 |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 3/5 |
| CPU Family: | HCS08 |
