NXP Semiconductors - PXAG37KFBD,157

PXAG37KFBD,157 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PXAG37KFBD,157
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet PXAG37KFBD,157 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 80 mA
Terminal Finish: TIN
No. of Terminals: 44
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G44
Package Shape: SQUARE
ROM Words: 32768
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Moisture Sensitivity Level (MSL): 1
Other Names: 568-7894
2156-PXAG37KFBD157-NX
NXPNXPPXAG37KFBD,157
935263504157
PXAG37KFBD157
Speed: 30 rpm
RAM Bytes: 512
Bit Size: 16
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP44,.47SQ,32
Peak Reflow Temperature (C): 260
ROM Programmability: UVPROM
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: XA
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