NXP Semiconductors - S9S08DV60F2MLH

S9S08DV60F2MLH by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number S9S08DV60F2MLH
Description MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
Datasheet S9S08DV60F2MLH Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 40
Surface Mount: YES
Terminal Finish: TIN
ADC Channels: YES
No. of Terminals: 64
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK
No. of I/O Lines: 54
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G64
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: QFP
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 935322309557
Speed: 40 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 5.5 V
External Data Bus Width: 0
Bit Size: 8
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Length: 10 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
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