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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LE24CBK23MC-AH |
| Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; |
| Datasheet | LE24CBK23MC-AH Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000005 Amp |
| Organization: | 256X8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | EEPROMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 8 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| No. of Words: | 256 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 1000000 Write/Erase Cycles |
| Package Code: | SOP |
| Moisture Sensitivity Level (MSL): | 3 |
| No. of Ports: | 2 |
| Memory Density: | 4096 bit |
| Memory IC Type: | EEPROM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP8,.25 |
| No. of Words Code: | 256 |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
