UPD70F3033BYGC-8EU-A by Renesas Electronics | Peripheral ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	UPD70F3033BYGC-8EU-A
Description	Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
Datasheet	UPD70F3033BYGC-8EU-A Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	10
Sub-Category:	Microcontrollers
Surface Mount:	YES
Terminal Finish:	TIN BISMUTH
No. of Terminals:	100
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Technology:	CMOS
JESD-30 Code:	S-PQFP-G100
Package Shape:	SQUARE
ROM Words:	65536
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	QFP
Moisture Sensitivity Level (MSL):	3
Speed:	20 rpm
RAM Bytes:	16384
Bit Size:	32
JESD-609 Code:	e6
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	QFP100,.63SQ,20
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3.3/5,5
CPU Family:	V850

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