| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
2.16 V |
500 MHz |
1 |
14 |
0.0311 % |
975 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.16 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.416 ns |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
2.16 V |
500 MHz |
1 |
14 |
0.0311 % |
975 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.16 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.416 ns |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
25 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
50 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
80 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
125 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
64 |
LFBGA |
Square |
Plastic/Epoxy |
16 |
Yes |
100 kHz |
1 |
16 |
0.0244 % |
5 V |
Binary, Offset Binary |
Grid Array, Low Profile, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B64 |
3 |
0.057 in (1.45 mm) |
0.315 in (8 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.35 V |
2600 MHz |
1 |
14 |
1.969 A |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.35 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.35 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.35 V |
2600 MHz |
1 |
14 |
1.969 A |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.35 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.35 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
860 mV |
4000 MHz |
1 |
12 |
2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-860 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
e2 |
30 s |
250 °C (482 °F) |
1.063 in (27 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
860 mV |
4000 MHz |
1 |
12 |
2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-860 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
20 s |
220 °C (428 °F) |
1.063 in (27 mm) |
||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
1.7 V |
3000 MHz |
1 |
14 |
0.1282 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.7 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.06 in (1.53 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
1.7 V |
3000 MHz |
1 |
14 |
0.1282 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.7 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.06 in (1.53 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
3200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
3200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Butt |
256 |
LGA |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
800 mV |
1600 MHz |
1 |
CMOS |
12 |
6 mA |
0.1831 % |
1.9 V |
Offset Binary |
Grid Array |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-55 °C (-67 °F) |
Track |
Bottom |
S-CBGA-B256 |
1 |
0.163 in (4.13 mm) |
1.1 in (27.94 mm) |
Peak-to-peak input voltage range: 0.8 V |
1.1 in (27.94 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Butt |
256 |
LGA |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
800 mV |
1600 MHz |
1 |
CMOS |
12 |
6 mA |
0.1831 % |
1.9 V |
Offset Binary |
Grid Array |
0.05 in (1.27 mm) |
-800 mV |
Serial |
Track |
Bottom |
S-CBGA-B256 |
1 |
0.163 in (4.13 mm) |
1.1 in (27.94 mm) |
Peak-to-peak input voltage range: 0.8 V |
1.1 in (27.94 mm) |
||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.35 V |
1500 MHz |
1 |
14 |
1.969 A |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.35 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.35 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.35 V |
1500 MHz |
1 |
14 |
1.969 A |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.35 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.35 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
2600 MHz |
1 |
14 |
0.0793 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.062 in (1.57 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
2600 MHz |
1 |
14 |
0.0793 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.062 in (1.57 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
1.1 V |
1000 MHz |
1 |
14 |
1.95 mA |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.1 V |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.1 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
1.1 V |
1000 MHz |
1 |
14 |
1.95 mA |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.1 V |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.1 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
950 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.04 V |
625 MHz |
1 |
14 |
0.0305 % |
950 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
950 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
500 kHz |
1 |
18 |
30.8 mA |
0.0021 % |
5 V |
2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
2.3 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Quad |
126.2 ms |
S-PQFP-G64 |
3 |
0.057 in (1.45 mm) |
0.394 in (10 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
500 kHz |
1 |
18 |
30.8 mA |
0.0021 % |
5 V |
2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
2.3 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Quad |
126.2 ms |
S-PQFP-G64 |
3 |
0.057 in (1.45 mm) |
0.394 in (10 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
32 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4 V |
10 MHz |
1 |
CMOS |
12 |
39 mA |
0.0366 % |
5 V |
Offset Binary |
Flatpack, Low Profile |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-4 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
60 µs |
S-PQFP-G32 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
Peak-to-peak input voltage range: 4 V |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
2000 MHz |
1 |
14 |
0.0494 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
0.062 in (1.57 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2.2 V |
2 V |
80 MHz |
1 |
AEC-Q100 |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
-300 mV |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
30 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
192 kHz |
1 |
AEC-Q100 |
24 |
3.3 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
125 °C (257 °F) |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G30 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.35 V |
2600 MHz |
1 |
14 |
1.969 A |
1.15 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.35 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.35 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
8 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
8 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
0.714 ns |
S-XQCC-N64 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
0.354 in (9 mm) |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
0.714 ns |
S-XQCC-N64 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
0.354 in (9 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
3200 MHz |
1 |
12 |
1.3 A |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array |
BGA256,16X16,39 |
0.039 in (1 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
3 |
0.13 in (3.31 mm) |
0.669 in (17 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.669 in (17 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
16 |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
Peak-to-peak input voltage range: 2 V |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
105 MHz |
1 |
CMOS |
10 |
0.2637 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
105 °C (221 °F) |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
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|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2 V |
Serial, Parallel, Word |
-50 °C (-58 °F) |
Nickel Palladium Gold Silver |
Quad |
S-PQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
5200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.825 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
0.1807 % |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Parallel, Word |
-20 °C (-4 °F) |
Bottom |
0.4 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
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Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
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|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.