| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
56 |
HVQCCN |
Square |
4 |
Yes |
2 V |
25 MHz |
1 |
AEC-Q100 |
12 |
71 mA |
800 mV |
Offset 2's Complement |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Quad |
S-XQCC-N56 |
3 |
0.035 in (0.9 mm) |
0.315 in (8 mm) |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
52 |
GQFF |
Square |
50k Rad(Si) |
Plastic/Epoxy |
1 |
Yes |
400 mV |
80 MHz |
1 |
MIL-PRF-38535 Class V |
14 |
5 V |
Binary |
Flatpack, Guard Ring |
0.04 in (1.016 mm) |
125 °C (257 °F) |
-400 mV |
-55 °C (-67 °F) |
Quad |
S-PQFP-F52 |
0.131 in (3.327 mm) |
0.58 in (14.732 mm) |
0.58 in (14.732 mm) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
12 |
1.3 A |
1.1 V |
2's Complement Binary |
Grid Array |
BGA256,16X16,39 |
0.039 in (1 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
0.13 in (3.31 mm) |
0.669 in (17 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
0.669 in (17 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
196 |
CGA |
Square |
300k Rad(Si) |
Ceramic |
2 |
No |
800 mV |
3200 MHz |
1 |
12 |
1 A |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array |
0.039 in (1 mm) |
-800 mV |
Serial |
Track |
Bottom |
S-CCGA-X196 |
0.244 in (6.194 mm) |
0.591 in (15 mm) |
Peak-to-peak input voltage range: 0.8 V |
0.591 in (15 mm) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
100 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
100 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Microchip Technology |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
121 |
TFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.975 V |
80 MHz |
1 |
AEC-Q100 |
12 |
173 mA |
1.2 V |
2’s Complement, Offset Binary |
Grid Array, Thin Profile, Fine Pitch |
BGA121,11X11,25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.975 V |
Serial |
-40 °C (-40 °F) |
Bottom |
4 ns |
S-PBGA-B121 |
0.043 in (1.08 mm) |
0.315 in (8 mm) |
0.315 in (8 mm) |
|||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
HFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
0.04638 % |
1.9 V |
Offset Binary |
Grid Array, Heat Sink/Slug, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
HFBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
0.046387 % |
1.9 V |
Offset Binary |
Grid Array, Heat Sink/Slug, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
HFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
0.04638 % |
1.9 V |
Offset Binary |
Grid Array, Heat Sink/Slug, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
HFBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
0.046387 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.09765 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
78 mA |
0.006866455 % |
1.8 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
78 mA |
0.006866455 % |
1.8 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2.25 V |
65 MHz |
1 |
14 |
78 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-2.25 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 2.25 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2.25 V |
65 MHz |
1 |
14 |
78 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-2.25 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 2.25 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.09765 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
Square |
2 |
Yes |
3.2 V |
125 MHz |
1 |
14 |
80 mA |
0.04577 % |
1.8 V |
2's Complement Binary |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N40 |
3 |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/ Epoxy |
2 |
Yes |
3.2 V |
125 MHz |
1 |
14 |
80 mA |
0.04577 % |
1.8 V |
Offset Binary, 2’s Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
18 |
0.002670288 % |
1.8 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
18 |
82 mA |
0.00724 % |
1.8 V |
Offset Binary, 2’s Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Dual |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
51 mA |
0.00762 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
82 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
82 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
51 mA |
0.00762 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
3.2 V |
65 MHz |
1 |
18 |
53 mA |
0.00724 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
3.2 V |
65 MHz |
1 |
18 |
53 mA |
0.00724 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Ball |
324 |
HFBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
1.4 V |
4000 MHz |
1 |
12 |
0.12207 % |
2 V |
Binary |
Grid Array, Heat Sink/Slug, Fine Pitch |
BGA324,18X18,32 |
0.031 in (0.8 mm) |
120 °C (248 °F) |
-1.4 V |
Serial |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B324 |
0.068 in (1.72 mm) |
0.591 in (15 mm) |
0.591 in (15 mm) |
||||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.475 V |
6000 MHz |
1 |
12 |
350 mA |
0.033691 % |
1 V |
Binary |
Grid Array |
BGA324,18X18,32 |
0.031 in (0.8 mm) |
120 °C (248 °F) |
-1.475 V |
Serial |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B324 |
3 |
0.068 in (1.72 mm) |
0.591 in (15 mm) |
260 °C (500 °F) |
0.591 in (15 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
2.16 V |
1000 MHz |
1 |
8 |
575 mA |
0.11718 % |
900 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.16 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
2.16 V |
1000 MHz |
1 |
8 |
575 mA |
0.11718 % |
900 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.16 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.06445 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.06445 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.06445 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.06445 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Ball |
196 |
HLFBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.54 V |
3000 MHz |
1 |
14 |
408.5 mA |
0.11047 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch |
BGA196,14X14,32 |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-1.54 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
0.06 in (1.53 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Ball |
196 |
HLFBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.54 V |
3000 MHz |
1 |
14 |
408.5 mA |
0.11047 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch |
BGA196,14X14,32 |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-1.54 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
0.06 in (1.53 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
8000 MHz |
1 |
12 |
0.024414063 % |
1.1 V |
2’s Complement, Offset Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
8000 MHz |
1 |
12 |
0.024414063 % |
1.1 V |
2’s Complement, Offset Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
825 mV |
5200 MHz |
1 |
12 |
950 μA |
0.048828125 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-825 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.825 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
825 mV |
5200 MHz |
1 |
12 |
950 μA |
0.048828125 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-825 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.825 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
800 mV |
4000 MHz |
1 |
12 |
850 μA |
0.024414063 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.8 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
800 mV |
4000 MHz |
1 |
12 |
850 μA |
0.024414063 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.8 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
198 |
Rectangular |
Plastic/Epoxy |
32 |
Yes |
2 V |
65 MHz |
1 |
14 |
0.018310547 % |
1.8 V |
Binary |
70 °C (158 °F) |
-2 V |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B198 |
3 |
Peak-to-peak input voltage range: 2 V |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
800 MHz |
1 |
AEC-Q100 |
9 |
0.09765 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
800 MHz |
1 |
AEC-Q100 |
9 |
0.09765 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
800 MHz |
1 |
AEC-Q100 |
12 |
0.046386 % |
1.1 V |
2’s Complement, Offset Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
800 MHz |
1 |
AEC-Q100 |
9 |
0.09765 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.