Analog Devices Analog-to-Digital Converters 2,314

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7891YSZ-1

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

10 V

454 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Matte Tin

Track

Quad

1.6 µs

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

0.394 in (10 mm)

AD7891YSZ-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

105 °C (221 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Matte Tin

Track

Quad

1.6 µs

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9262BCPZRL7-10

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

640 MHz

1

16

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

1.645 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9262BCPZRL7-5

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

640 MHz

1

16

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

1.645 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9262BCPZRL7

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

640 MHz

1

16

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

1.645 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9626BCPZRL7-210

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0269 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4.762 ns

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD9626BCPZRL7-250

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

1.5 V

250 MHz

1

CMOS

12

0.0415 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4 ns

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD9640ABCPZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

50 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7173-8BCPZ-RL

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

40

HVQCCN

Square

16

Yes

2.5 V

31.25 kHz

1

24

0.00075 %

3.3 V

Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

105 °C (221 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9249BBCZ-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

CMOS

14

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

No

e1

0.394 in (10 mm)

AD9249BBCZRL7-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

CMOS

14

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

No

e1

0.394 in (10 mm)

AD7903BRQZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

2

Yes

5.1 V

1 MHz

1

16

0.0031 %

2.5 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.64 mm)

125 °C (257 °F)

-2.4 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

710 ns

R-PDSO-G20

1

0.069 in (1.75 mm)

0.154 in (3.91 mm)

e3

30 s

260 °C (500 °F)

0.341 in (8.66 mm)

AD9656BCPZ-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

4

Yes

2.8 V

125 MHz

1

16

0.0153 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.8 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

25 ns

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD9656BCPZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

4

Yes

2.8 V

125 MHz

1

16

0.0153 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.8 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

25 ns

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD9681BBCZ-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

e1

0.394 in (10 mm)

AD9681BBCZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD364RJD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

60

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

25 kHz

1

12

0.024 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

32 µs

R-CDIP-T60

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

AD364RTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

60

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

25 kHz

1

12

0.012 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Sample

Dual

32 µs

R-CDIP-T60

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

AD676JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BIMOS

16

12 mA

0.003 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

1 ms

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD676KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BIMOS

16

12 mA

0.0015 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

1 ms

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7572AAR03

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

3.25 µs

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

0.606 in (15.4 mm)

AD7572AJN03

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

3.25 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7572ALN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.012 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7572JP12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

13 µs

S-PQCC-J28

0.178 in (4.51 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7572SE05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7580AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

7.3 V

50 kHz

1

CMOS

10

10 mA

0.098 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7580JP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2

Yes

7.3 V

50 kHz

1

CMOS

10

10 mA

0.098 %

5 V

Binary

5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-300 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Sample

Quad

18.5 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

AD7672LN05

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

5.2 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7672LP05

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2

Yes

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

5.2 µs

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7672LP10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2

Yes

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

10.4 µs

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD7672TQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7672UQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7871TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

11 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7872TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

11 µs

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.768 in (19.495 mm)

AD7874SE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Plastic/Epoxy

4

Yes

15 V

29 kHz

1

CMOS

MIL-STD-883 Class B

12

18 mA

0.024 %

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

10 V

-55 °C (-67 °F)

Gold

Track

Quad

35 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e4

0.45 in (11.43 mm)

AD7874SQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

15 V

29 kHz

1

CMOS

MIL-STD-883 Class B

12

18 mA

0.024 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

10 V

-55 °C (-67 °F)

Tin Lead

Track

Dual

35 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.52 in (13.2 mm)

No

e0

1.49 in (37.84 mm)

AD7875TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7876TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9005ATM

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

3 V

10 MHz

1

Bipolar

12

55 mA

0.03 %

15 V

Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

DAS1158

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

1

CMOS

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD1334BD

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5 V

28 kHz

1

CMOS

12

0.0244 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1341KZ

Analog Devices

Analog To Digital Converter Subsystem

Commercial

Gull Wing

100

QFP

Square

Ceramic, Metal-Sealed Cofired

16

Yes

10 V

150 kHz

1

BICMOS

16

56 mA

0.0015 %

15 V

Binary, 2's Complement Binary

5,±15 V

-15 V

Flatpack

QFP100,1.7SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-CQFP-G100

0.243 in (6.17 mm)

1.35 in (34.29 mm)

No

e0

1.35 in (34.29 mm)

AD1671JQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.0813 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1674TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

BICMOS

38535Q/M;38534H;883B

12

18 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD574AUD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

12

30 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD570SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883 Class B

8

15 mA

0.195 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD571SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883 Class B

10

15 mA

0.098 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9023AQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.024 V

20 MHz

1

Bipolar

12

240 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.