Analog Devices Analog-to-Digital Converters 2,314

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

JM38510/14002BXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

30 mA

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD872ASD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

MIL-STD-883 Class B

12

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD671SD-500/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.0977 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD671SD-750/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD678SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

34 mA

0.0488 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9060TZ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

38535Q/M;38534H;883B

10

500 mA

0.1953 %

5 V

Binary

5,-5.2 V

-5 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD9060SZ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

38535Q/M;38534H;883B

10

500 mA

0.2441 %

5 V

Binary

5,-5.2 V

-5 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD871SD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

38535Q/M;38534H;883B

12

150 mA

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD871SE/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

5 MHz

1

BICMOS

38535Q/M;38534H;883B

12

150 mA

5 V

Binary

±5 V

-5 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.545 mm)

No

e0

0.651 in (16.545 mm)

AD5212TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

68 mA

0.0122 %

15 V

Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-CDIP-T24

0.245 in (6.22 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

AD7579SQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

50 kHz

1

CMOS

38535Q/M;38534H;883B

10

10 mA

0.0977 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7579SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

2.5 V

50 kHz

1

CMOS

38535Q/M;38534H;883B

10

10 mA

0.0977 %

5 V

Binary

5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Quad

18.5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD5214TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

68 mA

0.0122 %

15 V

Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-CDIP-T24

0.245 in (6.22 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

AD7582TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

100 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD670SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD670SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

10 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

AD671SD-500

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD671SD-750

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD1671JP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

800 ns

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

30 s

225 °C (437 °F)

0.453 in (11.5062 mm)

AD1671KP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

800 ns

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

AD1671KQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779KD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD670SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

1.27 V

1

Bipolar

8

45 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.28 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD670JP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2

Yes

1.27 V

1

Bipolar

8

45 mA

0.39 %

5 V

Binary

5 V

Chip Carrier

LDCC20,.4SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-1.28 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Quad

10 µs

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

225 °C (437 °F)

0.353 in (8.965 mm)

AD670JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

2

No

1.27 V

1

Bipolar

8

45 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.28 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

10 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

AD573KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

10

0.0488 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

AD573SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

AD573JP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

30 µs

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

225 °C (437 °F)

0.353 in (8.965 mm)

AD573JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

AD573JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

30 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.07 in (27.18 mm)

AD571SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

10

15 mA

0.098 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

AD571JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

10

15 mA

0.098 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

AD570SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

8

15 mA

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD570JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

8

15 mA

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD674BTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BIMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

15 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD774BBD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

8 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD774BTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7878SQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

100 kHz

1

BICMOS

38535Q/M;38534H;883B

12

13 mA

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9.25 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD673SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

8

0.1953 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7886JP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.1 MHz

1

BICMOS

12

35 mA

0.048 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

100 ns

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

AD9066AR-REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

530 mV

60 MHz

2

CMOS

6

120 mA

1.5625 %

5 V

Offset Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

450 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

AD9220AR-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

10 MHz

1

CMOS

12

0.0305 %

5 V

Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

AD9221AR-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1.5 MHz

1

CMOS

12

0.0305 %

5 V

Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

AD2020

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

1

Bipolar

Binary

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

AD7731BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

6

No

1.28 V

1

24

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.28 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7731BRU

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

6

Yes

1.28 V

1

24

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-1.28 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0.307 in (7.8 mm)

AD7731BR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

6

Yes

1.28 V

1

24

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.28 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.