Square Digital-to-Analog Converters 1,409

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC37J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC37J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5322BRM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSOP10,.5

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

30 s

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD557JP-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.565 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

AD558JP-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

3 µs

25 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

AD558KP-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

3 µs

25 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

AD569JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

6 µs

13 mA

0.04 %

Parallel, Word

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

4 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

AD667JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

25 mA

0.0183 %

Parallel, Word

12 V

±12/±15 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.178 in (4.51 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

AD7225KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

MIL-STD-883

8

5 µs

10 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.506 mm)

Binary, Offset Binary

AD7248AAP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

-5 V

0.353 in (8.9662 mm)

Binary

AD7303BRM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

2 µs

3.5 mA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

0 V

0.118 in (3 mm)

Binary

AD7524KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

0 ns

2 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

AD7528JP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

0 ns

2 mA

0.3906 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

225 °C (437 °F)

0.353 in (8.965 mm)

Binary, Offset Binary

AD7534KP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

MOS

14

1.5 µs

3 mA

0.006 %

Parallel, 8 Bits

12/15,GND/-0.3 V

-.3 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary, Offset Binary

AD7547JP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

AD7548JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

3 mA

2.3438 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

225 °C (437 °F)

0.353 in (8.965 mm)

Offset Binary

AD7568BP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

8

BICMOS

12

3.5 mA

0.0122 %

Serial

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

225 °C (437 °F)

0.653 in (16.5862 mm)

Binary

AD767JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

23 mA

0.0244 %

Serial

15 V

±12/±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

AD7845JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.5062 mm)

Binary, Offset Binary

AD7846JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

AD7846KP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

9 µs

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

ADV101KP50-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

0.3906 %

Parallel, 8 Bits

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

Binary

DAC8413FPC-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

AD5310RBRMZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

10

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5311RBRMZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

10

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5311RBRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

10

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5681RBCPZ-1RL

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

5.005 V

Yes

1

12

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.026 in (0.65 mm)

0.079 in (2 mm)

0 V

0.079 in (2 mm)

Binary

AD5681RBCPZ-RL

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

5.005 V

Yes

1

12

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.026 in (0.65 mm)

0.079 in (2 mm)

0 V

0.079 in (2 mm)

Binary

AD5681RBRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

12

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5682RBCPZ-RL

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

5.005 V

Yes

1

14

0.0061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.026 in (0.65 mm)

0.079 in (2 mm)

0 V

0.079 in (2 mm)

Binary

AD5683RBRMZ-3

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0031 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

ADAU1962WBSTZRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

80

LQFP

Square

Plastic/Epoxy

8.48 V

Yes

1

24

Serial

5 V

Flatpack, Low Profile

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G80

3

0.063 in (1.6 mm)

0.551 in (14 mm)

e3

30 s

260 °C (500 °F)

-8.48 V

0.551 in (14 mm)

Binary

ADAU1962WBSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

80

LQFP

Square

Plastic/Epoxy

8.48 V

Yes

1

24

Serial

5 V

Flatpack, Low Profile

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G80

3

0.063 in (1.6 mm)

0.551 in (14 mm)

e3

30 s

260 °C (500 °F)

-8.48 V

0.551 in (14 mm)

Binary

AD5384BBCZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

14

8 µs

475 μA

0.02441 %

Serial

5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

3 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B100

0.055 in (1.4 mm)

0.394 in (10 mm)

0 V

0.394 in (10 mm)

Binary

AD7845KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.5062 mm)

Binary, Offset Binary

AD7845SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

CMOS

MIL-STD-883 Class B

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.09 in (2.29 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

AD5321BRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

225 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5301BRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

225 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD7628TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

8

0 ns

2.5 mA

0.1953 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD5312BRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSOP10,.5

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

MAX5302CUA

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

400 μA

0.0977 %

Serial

5 V

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5302EUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

400 μA

0.0977 %

Serial

5 V

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

CS4385A-DQZ

Cirrus Logic

Digital to Analog converter

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

7.14 V

Yes

1

24

91 mA

Serial

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

-7.14 V

0.276 in (7 mm)

2's Complement Binary

AD5532ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.