| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
0.097 % |
Parallel, Word |
3 V |
Flatpack, Low Profile, Fine Pitch |
11 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G48 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
With programmable PLL |
e0 |
-1 V |
0.276 in (7 mm) |
Binary |
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|
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.1 V |
Yes |
75 kHz |
1 |
CMOS |
10 |
12.5 µs |
350 μA |
0.0977 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
12.5 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold Silver |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2.4 V |
Yes |
1 |
CMOS |
8 |
9 ns |
167 mA |
0.4688 % |
Parallel, 8 Bits |
5 V |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
5 ns |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
20 s |
220 °C (428 °F) |
0 V |
0.276 in (7 mm) |
Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
BICMOS |
MIL-STD-883 |
12 |
12 mA |
0.0366 % |
Parallel, Word |
5 V |
5/±15 V |
-5 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
BICMOS |
MIL-STD-883 |
12 |
12 mA |
0.0366 % |
Parallel, Word |
5 V |
5/±15 V |
-5 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
5 V |
Yes |
1 |
BIMOS |
MIL-STD-883 Class B |
16 |
6 µs |
26 mA |
0.04 % |
Parallel, Word |
12 V |
±12 V |
-12 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
4 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
-5 V |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
Yes |
83 kHz |
1 |
8 |
10 µs |
1.4 mA |
0.097 % |
Serial |
5 V |
3/5 V |
Chip Carrier |
LCC24,.16SQ,20 |
Other Converters |
7 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Quad |
S-PQCC-N24 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
260 °C (500 °F) |
0.157 in (4 mm) |
Binary |
|||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
Yes |
83 kHz |
1 |
10 |
10 µs |
1.4 mA |
0.048 % |
Serial |
5 V |
3/5 V |
Chip Carrier |
LCC24,.16SQ,20 |
Other Converters |
7 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Quad |
S-PQCC-N24 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
260 °C (500 °F) |
0.157 in (4 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
Parallel, 8 Bits |
5 V |
Chip Carrier |
190 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
3.2 V |
Yes |
1 |
CMOS |
12 |
20 µs |
1.35 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
9 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
3.2 V |
Yes |
102 kHz |
1 |
CMOS |
12 |
20 µs |
1.35 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
3.41 V |
Yes |
1 |
CMOS |
24 |
Serial |
5 V |
3.3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
400 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
2's Complement Binary |
|||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2.4 V |
Yes |
1 |
CMOS |
10 |
9 ns |
142 mA |
0.1172 % |
Parallel, Word |
3.3 V |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
5 ns |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
Offset Binary |
|||||||||||||||
|
|
Asahi Kasei Microdevices |
Digital to Analog converter |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
2.95 V |
Yes |
1 |
32 |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
-2.95 V |
0.276 in (7 mm) |
2's Complement Binary |
||||||||||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
9 V |
Yes |
8 |
BICMOS |
14 |
0.0244 % |
Parallel, Word |
14 V |
-9,5,14 V |
-9 V |
Flatpack |
QFP44,.5SQ,32 |
Other Converters |
22 µs |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
1 |
0.094 in (2.388 mm) |
0.394 in (10.0075 mm) |
No |
e0 |
245 °C (473 °F) |
-7 V |
0.394 in (10.0075 mm) |
Offset Binary |
|||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
3.41 V |
Yes |
1 |
CMOS |
24 |
Serial |
5 V |
3.3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
2's Complement Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
74 |
LBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
14 |
32 µs |
0.0122 % |
Serial |
5 V |
±4.75/±13.2,3/5,5 V |
Grid Array, Low Profile |
BGA74,11X11,40 |
Other Converters |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B74 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
No |
e0 |
240 °C (464 °F) |
-2.5 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
74 |
LBGA |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
BICMOS |
14 |
32 µs |
0.0122 % |
Serial |
5 V |
±4.75/±13.2,3/5,5 V |
Grid Array, Low Profile |
BGA74,11X11,40 |
Other Converters |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B74 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
No |
e0 |
240 °C (464 °F) |
-5 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
BIMOS |
MIL-STD-883 Class B |
12 |
10 µs |
0.0183 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
Chip Carrier |
LCC44,.65SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.545 mm) |
No |
e0 |
0.651 in (16.545 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
BIMOS |
MIL-STD-883 Class B |
12 |
10 µs |
19 mA |
0.0244 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
0.135 in (3.43 mm) |
0.645 in (16.385 mm) |
No |
e0 |
0.645 in (16.385 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
12 |
5 µs |
12 mA |
0.0244 % |
Parallel, Word |
12 V |
12/15,GND/-12/-15 V |
-12 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.506 mm) |
No |
e0 |
225 °C (437 °F) |
-5 V |
0.453 in (11.506 mm) |
Binary |
|||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
14 |
200 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
14 |
200 μA |
0.0061 % |
Serial |
3 V |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
3 V |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0031 % |
Serial |
3 V |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
3 V |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
16 |
200 μA |
0.0061 % |
Serial |
3 V |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
|||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1 |
AEC-Q100 |
24 |
Serial |
3.3 V |
Flatpack |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.472 in (12 mm) |
Binary |
||||||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1.2 V |
Yes |
1 |
CMOS |
8 |
Serial |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.5 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1.2 V |
Yes |
1 |
CMOS |
8 |
Serial |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.5 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1.2 V |
Yes |
1 |
CMOS |
10 |
Serial |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.5 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1.2 V |
Yes |
1 |
CMOS |
12 |
Serial |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.5 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1.2 V |
Yes |
1 |
CMOS |
14 |
Serial |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.5 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
32 |
LQFP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
16 |
10 µs |
0.0046 % |
Parallel, Word |
5 V |
5/±5 V |
-5 V |
Flatpack, Low Profile |
QFP32,.35SQ,32 |
Other Converters |
8 µs |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G32 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
-2.5 V |
0.276 in (7 mm) |
Binary |
||||||||||||||||||||
|
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
3.6 V |
Yes |
1 |
CMOS |
16 |
7 µs |
0.0244 % |
Serial |
3 V |
3.3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.11,20 |
Other Converters |
4 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
200 MHz |
1 |
12 |
90 mA |
0.0488 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-.8 V |
0.276 in (7 mm) |
Binary, 2's Complement Binary |
|||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
3.41 V |
Yes |
1 |
CMOS |
24 |
46 mA |
Serial |
5 V |
3.3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
2's Complement Binary |
|||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
15 V |
Yes |
125 kHz |
1 |
16 |
6 µs |
4 mA |
0.0015 % |
Serial |
16.5 V |
±10.8/±18,3/5 V |
-16.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-15 V |
0.276 in (7 mm) |
Binary, 2's Complement Binary |
|||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
15 V |
Yes |
125 kHz |
1 |
16 |
6 µs |
4 mA |
0.0015 % |
Serial |
16.5 V |
±10.8/±18,3/5 V |
-16.5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Quad |
S-PQCC-N40 |
2 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e4 |
260 °C (500 °F) |
-15 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
15 V |
Yes |
125 kHz |
1 |
16 |
6 µs |
4 mA |
0.0015 % |
Serial |
16.5 V |
±10.8/±18,3/5 V |
-16.5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Quad |
S-PQCC-N40 |
2 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e4 |
260 °C (500 °F) |
-15 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.