Industrial Digital-to-Analog Converters 2,323

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9152BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

.347 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

.23 V

0.315 in (8 mm)

Binary, 2's Complement Binary

DAC1282AIPWR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

256 kHz

1

24

100 µs

8.5 mA

Serial

2.5 V

-2.5 V

Small Outline, Thin Profile, Shrink Pitch

100 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G24

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

-2.5 V

0.307 in (7.8 mm)

Binary

DAC1282AIPW

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

256 kHz

1

24

100 µs

8.5 mA

Serial

2.5 V

-2.5 V

Small Outline, Thin Profile, Shrink Pitch

100 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G24

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

-2.5 V

0.307 in (7.8 mm)

Binary

AD9154BCPAZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

3.37 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

2 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9154BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

3.37 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

2 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9144BCPAZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9144BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9135BCPAZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

11

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9135BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

11

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9136BCPAZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9136BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC60096IZEB

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LBGA

Square

Plastic/Epoxy

10.5 V

Yes

15 kHz

1

12

65 µs

0.0244 %

Serial

12 V

-12 V

Grid Array, Low Profile

65 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.058 in (1.48 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

-10.5 V

0.591 in (15 mm)

2's Complement Binary

ADV7343WBSTZ-RL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

AEC-Q100

11

0.0244 %

Serial

1.8 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

0 V

0.394 in (10 mm)

2's Complement

ADV7343WBSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

AEC-Q100

11

0.0244 %

Serial

1.8 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

0 V

0.394 in (10 mm)

2's Complement

AD9161BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9161BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9162BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9162BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9163BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9163BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9164BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9164BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

260 °C (500 °F)

0.433 in (11 mm)

2's Complement

AD9164BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9164BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9164BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

260 °C (500 °F)

0.315 in (8 mm)

2's Complement

AD9164BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

260 °C (500 °F)

0.315 in (8 mm)

2's Complement

AD8842ARZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

4 V

Yes

1

CMOS

8

0.3906 %

Serial

5 V

-5 V

Small Outline

5.4 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

e3

260 °C (500 °F)

-4 V

0.606 in (15.4 mm)

Offset Binary

DAC38RF82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF83IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF83IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF86IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF87IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF87IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF93IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF93IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF96IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF96IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF97IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF80IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.76 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF80IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.76 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF85IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.