Industrial Digital-to-Analog Converters 2,323

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC38RF85IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF90IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF90IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF89IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

8400 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF89IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

8400 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5767BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

Yes

1

12

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

0.236 in (6 mm)

Binary

AD9171BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

AD9171BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

AD5766BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

10 V

Yes

1

16

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

16 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

-10 V

0.236 in (6 mm)

Binary

AD5758BCPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

10 V

Yes

1

16

0.01 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

115 °C (239 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

-10 V

0.197 in (5 mm)

Binary

HI5731BIBZ-T

Renesas Electronics

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

0 V

Yes

1

BICMOS

12

0.036 %

Parallel, Word

5 V

-5.2 V

Small Outline

SOP28,.4

20 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

-1.25 V

0.705 in (17.9 mm)

Binary

AD9174BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

2

16

Serial

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

Binary

AD9176BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

2's Complement

AD9175BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

2's Complement Binary

AD5423BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

10 V

Yes

1

16

0.006 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

115 °C (239 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

-10 V

0.197 in (5 mm)

Binary

ADV7123KSTZ140-RL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

CMOS

10

72 mA

0.0977 %

Parallel, Word

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

0 V

0.276 in (7 mm)

Binary

AD9166BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1

16

1.033 A

Parallel, Word

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.062 in (1.57 mm)

0.591 in (15 mm)

0.591 in (15 mm)

2's Complement

AD9166BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1

16

1.033 A

Parallel, Word

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.062 in (1.57 mm)

0.591 in (15 mm)

0.591 in (15 mm)

2's Complement

AK4499EQ

Asahi Kasei Microdevices

Digital to Analog converter

Industrial

Gull Wing

128

HTQFP

Rectangular

Plastic/Epoxy

5.25 V

Yes

4

32

Serial, Parallel, Word

5 V

Flatpack, Heat Sink/Slug, Thin Profile

85 °C (185 °F)

-40 °C (-40 °F)

Quad

R-PQFP-G128

4.75 V

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.