Ball Digital-to-Analog Converters 152

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9739ABBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC34H84IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

CMOS

16

820 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC34H84IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

CMOS

16

820 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD5668BCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9737ABBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

11

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9737ABBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

11

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC34SH84IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1500 MHz

1

16

165 mA

Parallel, Word

3.3 V

1.25,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Binary

DAC3482IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

450 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC3484IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

650 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC3484IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

650 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9119BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

11

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9119BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

11

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9129BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

AD9129BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9129BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9129BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

AD5535BKBCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-PBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

1 V

0.591 in (15 mm)

Binary

AD5535BKBC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B124

0.067 in (1.7 mm)

0.591 in (15 mm)

No

1 V

0.591 in (15 mm)

Binary

AD5664RBCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.066 in (1.665 mm)

e1

30 s

260 °C (500 °F)

0.088 in (2.245 mm)

Binary

AD5668BCBZ-1-500R7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

DAC37J82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC37J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC37J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC37J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5384BBCZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

14

8 µs

475 μA

0.02441 %

Serial

5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

3 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B100

0.055 in (1.4 mm)

0.394 in (10 mm)

0 V

0.394 in (10 mm)

Binary

AD5532ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5516ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5516ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-5 V

0.472 in (12 mm)

Binary

AD5398ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD5821ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD9734BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

10

0.0488 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9734BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

10

0.0488 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9735BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

12

0.0366 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9735BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

12

0.0366 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5378ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

5 V

Yes

1

Bipolar

14

30 µs

0.0183 %

Serial, Parallel, Word

5 V

3/5,±12/±15 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-3.5 V

0.512 in (13 mm)

Binary

AD5378ABC

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

5 V

Yes

1

Bipolar

14

30 µs

0.0183 %

Serial, Parallel, Word

5 V

3/5,±12/±15 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e0

240 °C (464 °F)

-3.5 V

0.512 in (13 mm)

Binary

AD5821BCBZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD5821BCBZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD5371BBCZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

20 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

DAC5670IGDJ

Texas Instruments

Digital to Analog converter

Industrial

Ball

252

HBGA

Square

Plastic/Epoxy

4.1 V

Yes

1

14

650 mA

0.0458 %

Parallel, Word

3.3 V

3.3 V

Grid Array, Heat Sink/Slug

BGA252,16X16,40

Other Converters

3.5 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B252

4

0.08 in (2.02 mm)

0.669 in (17 mm)

No

e0

30 s

260 °C (500 °F)

2.5 V

0.669 in (17 mm)

Complementary Binary

AD5669RBCBZ-1-R5

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9739BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary

AD9739BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary

AD9739BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.