Ball Digital-to-Analog Converters 152

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9739BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary

AD9148BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

16

Serial

3.3 V

1.8,3.3 V

Grid Array

BGA196,14X14,32

Other Converters

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

0.051 in (1.3 mm)

0.472 in (12 mm)

No

e1

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9148BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

16

Serial

3.3 V

1.8,3.3 V

Grid Array

BGA196,14X14,32

Other Converters

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.059 in (1.5 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9148BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

16

Serial

3.3 V

1.8,3.3 V

Grid Array

BGA196,14X14,32

Other Converters

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B196

3

0.059 in (1.5 mm)

0.472 in (12 mm)

No

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5379ABC

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,11.4/16.5 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e0

240 °C (464 °F)

-1 V

0.512 in (13 mm)

Binary

AD9789BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1

0.051 in (1.3 mm)

0.472 in (12 mm)

No

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9789BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B164

3

0.051 in (1.3 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9789BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B164

3

0.051 in (1.3 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9789BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1

0.051 in (1.3 mm)

0.472 in (12 mm)

No

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

TLV5608IYE

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

7 µs

21 mA

0.1953 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

AD5384BBC-5

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3/5,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0 V

0.394 in (10 mm)

Binary

TLV5610IYER

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

AD5379ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,±12/±15 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.512 in (13 mm)

Binary

AD9736BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9736BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5532ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5384BBCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

14

0.0244 %

Serial

3 V

Grid Array, Low Profile, Fine Pitch

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

260 °C (500 °F)

0 V

0.394 in (10 mm)

Binary

AD5384BBCZ-5

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

14

8 µs

475 μA

0.02441 %

Serial

5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

3 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.394 in (10 mm)

Binary

AD5516ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5516ABCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-10 V

0.472 in (12 mm)

Binary

AD5535ABCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e1

260 °C (500 °F)

2.5 V

0.591 in (15 mm)

Binary

AD9736BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9736BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5532HSABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5532BBCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

13 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-13 V

0.472 in (12 mm)

Binary

AD5371BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

20 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

30 s

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

TLV5610IYZR

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

BGA

Rectangular

5.1 V

Yes

283 kHz

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-XBGA-B20

0.075 in (1.91 mm)

No

e1

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

AD9174BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

Yes

2

16

1.85 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,31

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

Binary

AD9176BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

2's Complement

AD9175BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

2's Complement Binary

DAC39J82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2800 MHz

1

CMOS

16

Serial

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC39J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2800 MHz

1

CMOS

16

Serial

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC60096IZEB

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LBGA

Square

Plastic/Epoxy

10.5 V

Yes

15 kHz

1

12

65 µs

0.0244 %

Serial

12 V

-12 V

Grid Array, Low Profile

65 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.058 in (1.48 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

-10.5 V

0.591 in (15 mm)

2's Complement Binary

AD9161BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9161BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9162BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9162BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9163BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9163BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9164BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD9164BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

260 °C (500 °F)

0.433 in (11 mm)

2's Complement

AD9164BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.