Other Function Interface ICs

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MADR-009150

M/a-com Technology Solutions

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

GENERAL PURPOSE

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

1 mm

3 mm

e4

3 mm

ISO7720QDQ1

Texas Instruments

DIGITAL ISOLATOR

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

2

CMOS

AEC-Q100

2.5 V

SMALL OUTLINE

SOP8,.25

2.25 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.895 mm

ALSO REQUIRED VCC2 SUPPLY 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

e4

30

260

4.905 mm

ISO7721QDQ1

Texas Instruments

DIGITAL ISOLATOR

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

2

CMOS

AEC-Q100

2.5 V

SMALL OUTLINE

SOP8,.25

2.25 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.895 mm

ALSO REQUIRED VCC2 SUPPLY 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

e4

30

260

4.905 mm

ADUM120N1WBRZ-RL7

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

CMOS

AEC-Q100

1.8 V

SMALL OUTLINE

SOP8,.25

1.7 V

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

3

1.55 mm

3.9 mm

ALSO OPERATES AT 2.5V, 3.3V, 5V NOMINAL SUPPLY

30

260

4.9 mm

ISOW7821DWE

Texas Instruments

DIGITAL ISOLATOR

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

2

CMOS

3.3 V

SMALL OUTLINE

SOP16,.4

3 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e4

30

260

10.3 mm

ISO7761DBQ

Texas Instruments

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

6

6

CMOS

2.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

2.25 V

.635 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G16

2

1.75 mm

3.895 mm

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

e4

30

260

4.905 mm

ISO7761FDBQR

Texas Instruments

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

6

6

CMOS

2.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

2.25 V

.635 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G16

2

1.75 mm

3.895 mm

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

e4

30

260

4.905 mm

ISO7760DBQ

Texas Instruments

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

6

6

CMOS

2.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

2.25 V

.635 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G16

2

1.75 mm

3.895 mm

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

e4

30

260

4.905 mm

DS250DF410ABMR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

DS250DF410ABMT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

TLE8261EXUMA3

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13.5 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

DUAL

R-PDSO-G36

2.55 mm

7.6 mm

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

TLE8262EXUMA3

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13.5 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

DUAL

R-PDSO-G36

2.55 mm

7.6 mm

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

TLE82642EXUMA3

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13.5 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

DUAL

R-PDSO-G36

2.55 mm

7.6 mm

IT ALSO OPERATES AT 3 TO 40V

12.8 mm

TLE8264EXUMA4

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13.5 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

DUAL

R-PDSO-G36

2.55 mm

7.6 mm

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

TLE9222PXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

AEC-Q100

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

4.75 V

.65 mm

Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

DUAL

R-PDSO-G14

2A

1.1 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TLE9260QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9260QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

TLE9262QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE9262QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9263QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

BTS54220LBBAUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

24

HTSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

28 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

5.5 V

3.8 V

.65 mm

13.5 V

DUAL

R-PDSO-N24

1.05 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

9.5 mm

BTS54220LBFAUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

24

HTSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

28 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

5.5 V

3.8 V

.65 mm

13.5 V

DUAL

R-PDSO-N24

1.05 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

9.5 mm

BTS56033LBBAUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

24

HTSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

28 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

5.5 V

3.8 V

.65 mm

13.5 V

DUAL

R-PDSO-N24

1.05 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

9.5 mm

TLE9221SXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

AEC-Q100

5 V

SMALL OUTLINE, SHRINK PITCH

4.75 V

.65 mm

Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

DUAL

R-PDSO-G16

2A

1.99 mm

5.3 mm

OTHER SUPPLY VOLTAGE ARE MIN:5.5, NOM:13.5, MAX:18

NOT SPECIFIED

NOT SPECIFIED

6.2 mm

TLE92623QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE92623QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE92633QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE9222LCXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

AEC-Q100

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

.65 mm

TIN

DUAL

R-PDSO-N14

2A

3 mm

e3

4.5 mm

TLE92633BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE92633BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

ADUM242E0WBRWZ-RL

Analog Devices

DIGITAL ISOLATOR

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

AEC-Q100

1.8 V

SMALL OUTLINE

SOP16,.4

1.7 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e4

30

260

10.3 mm

ADUM242E0WBRWZ

Analog Devices

DIGITAL ISOLATOR

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

AEC-Q100

1.8 V

SMALL OUTLINE

SOP16,.4

1.7 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e4

30

260

10.3 mm

PI4GTL2034LEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

2.3 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

PI4IOE5V9554LE

Diodes Incorporated

INTERFACE CIRCUIT

MATTE TIN

1

e3

30

260

PI3EQX6801ZDEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1.575 V

1

1.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.425 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N20

1

.8 mm

4 mm

ALSO OPERATE WITH 3.3V SUPPLY

e4

30

260

4 mm

ADUM140E1WBRWZ-RL

Analog Devices

DIGITAL ISOLATOR

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

CMOS

AEC-Q100

1.8 V

SMALL OUTLINE

SOP16,.4

1.7 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

IT ALSO OPERATES AT 2.5, 3.3, 5 V

e4

30

260

10.3 mm

UJA1169TK/FZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

20

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.8 V

.5 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-N20

1

1 mm

3.5 mm

e4

30

260

5.5 mm

UJA1169TK/F/3Z

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

UJA1169TK/X/FZ

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

UJA1169TK/XZ

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

PI3EQX1204-CZHE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC42,.14X.35,20

3 V

.5 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N42

.84 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

MC33CD1020AES

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

PR5331C3HN/C370Y

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

PTN5110HQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

PTN5110THQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,8X8,32

2.7 V

.8 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

2

1.2 mm

7 mm

260

7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.