Other Function Interface ICs

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
2744429	Phoenix Contact	INTERFACE CIRCUIT	OTHER	UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO	30 V	1		HYBRID			24 V	MICROELECTRONIC ASSEMBLY		18 V		70 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X
ADUM6423ABRNZ5-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	5.5 V	1					5 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	4.5 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6424ABRNZ3	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	3 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6424ABRNZ3-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	3 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6424ABRNZ5-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	5.5 V	1					5 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	4.5 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6421AWBRNZ5-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100		5 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	4.5 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6423ABRNZ3	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	3 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6424ABRNZ5	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	5.5 V	1					5 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	4.5 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
ADUM6423ABRNZ3-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	3 V	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm					10.3 mm
2988117	Phoenix Contact	DIGITAL I/O MODULE	INDUSTRIAL	GULL WING	64		SQUARE		PLASTIC/EPOXY	YES	3.63 V	1					3.3 V			2.97 V		85 Cel	-40 Cel		QUAD	S-PQFP-G64
ISOS141FDBQTSEP	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SSOP	RECTANGULAR	30k Rad(Si)	PLASTIC/EPOXY	YES	5.5 V	4	4				2.5 V	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.25 V	.635 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	1.75 mm	3.895 mm		e4	30	260	4.905 mm
V62/21610-01XE	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SSOP	RECTANGULAR	30k Rad(Si)	PLASTIC/EPOXY	YES	5.5 V	4	4				2.5 V	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.25 V	.635 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	1.75 mm	3.895 mm		e4	30	260	4.905 mm
ISOS141FDBQSEP	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SSOP	RECTANGULAR	30k Rad(Si)	PLASTIC/EPOXY	YES	5.5 V	4	4				2.5 V	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	2.25 V	.635 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	1.75 mm	3.895 mm		e4	30	260	4.905 mm
ADN4624BRNZ	Analog Devices	DIGITAL ISOLATOR		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	1.9 V	1					1.8 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	1.7 V	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm		e3	30	260	10.3 mm
ADN4624BRNZ-RL	Analog Devices	DIGITAL ISOLATOR		GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES	1.9 V	1					1.8 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.4	1.7 V	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm		e3	30	260	10.3 mm
PI6ULS5V9617BUEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE		PLASTIC/EPOXY	YES	5.5 V	1		CMOS			.95 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.6 V	.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	IT ALSO REQUIRES 2.2 TO 5.5 V				3 mm
TC9595XBG(EL)	Toshiba	INTERFACE CIRCUIT		BALL	80		SQUARE		PLASTIC/EPOXY	YES		1													BOTTOM	S-PBGA-B80
PTN38003AEWY	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	36	HVFLGA	RECTANGULAR		PLASTIC/EPOXY	YES	1.9 V	1					1.8 V	GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC36,.08X.24,16	1.7 V	.4 mm	85 Cel	-20 Cel		BOTTOM	R-PBGA-N36	3	.677 mm	2.1 mm				260	6 mm
TUSB216RWBTQ1	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	12	VQCCN	SQUARE		PLASTIC/EPOXY	YES	6.5 V	1	1		AEC-Q100	36 mA	5 V	CHIP CARRIER, VERY THIN PROFILE	LCC12,.06SQ,16	2.3 V	.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm		e4		260	1.6 mm
ISO6721RFBQDRQ1	Texas Instruments	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	5.5 V	2	2	CMOS	AEC-Q100		1.8 V	SMALL OUTLINE		1.71 V	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	2	1.75 mm	3.895 mm	ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V	e4		260	4.905 mm
SN75LVPE5421RUAR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	42	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	4	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N42	2	.8 mm	3.5 mm		e4		260	9 mm
SN75LVPE5421RUAT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	42	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	4	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N42	2	.8 mm	3.5 mm		e4		260	9 mm
SN75LVPE5412RUAT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	42	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	4	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N42	2	.8 mm	3.5 mm		e4		260	9 mm
NCID9311	Onsemi	INTERFACE CIRCUIT																						MATTE TIN			1				e3	30	260
750-362	Wago	DIGITAL I/O MODULE		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO	31.2 V	1					24 V	MICROELECTRONIC ASSEMBLY		18 V		55 Cel	0 Cel		UNSPECIFIED	R-XXMA-X				ALSO HAVE ANALOG I/O FUNCTIONALITY
WIZ108SR	Wiznet	INTERFACE CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO		1					3.3 V	MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X
TCA9537DGSR	Texas Instruments	INTERFACE CIRCUIT		GULL WING	10	SOP	SQUARE		PLASTIC/EPOXY	YES	5.5 V	1					1.8 V	SMALL OUTLINE		1.65 V	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		e3		260	3 mm
ADAM-6052-D	Advantech	DIGITAL I/O MODULE		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO	30 V	1					24 V	MICROELECTRONIC ASSEMBLY		10 V		70 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X
ADUM4165BRIZ-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	20	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1		CMOS			3.3 V	SMALL OUTLINE	SOP20,.4	3 V	1.27 mm	125 Cel	-55 Cel		DUAL	R-PDSO-G20		2.69 mm	7.5 mm					15.4 mm
ADUM4165BRIZ	Analog Devices	INTERFACE CIRCUIT		GULL WING	20	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1		CMOS			3.3 V	SMALL OUTLINE	SOP20,.4	3 V	1.27 mm	125 Cel	-55 Cel		DUAL	R-PDSO-G20		2.69 mm	7.5 mm					15.4 mm
ADUM4166BRIZ-RL	Analog Devices	INTERFACE CIRCUIT		GULL WING	20	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1		CMOS			3.3 V	SMALL OUTLINE	SOP20,.4	3 V	1.27 mm	125 Cel	-55 Cel		DUAL	R-PDSO-G20		2.69 mm	7.5 mm					15.4 mm
TUSB1142RNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	2				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
TUSB1142IRNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	2				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
TUSB1004RNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	4	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
TUSB1004IRNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	QCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	4	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG		3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
785989-01	National Instruments	ANALOG I/P MODULE		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO		1			ATEX			MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X
TDP1204RNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.16X.24,16	3 V	.4 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
TDP1204IRNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.16X.24,16	3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm		e4		260	6 mm
750-1506	Wago	DIGITAL I/O MODULE		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO		1					5 V	MICROELECTRONIC ASSEMBLY				55 Cel	0 Cel		UNSPECIFIED	R-XXMA-X
TLE9274QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		UNSPECIFIED	YES	28 V	1			AEC-Q100		13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	4.5 V	.5 mm	150 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
2901533	Phoenix Contact	ANALOG I/O MODULE		UNSPECIFIED		XMA	RECTANGULAR		UNSPECIFIED	NO	30.5 V	1			ATEX		24 V	MICROELECTRONIC ASSEMBLY		19.2 V		70 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X		99 mm	17.5 mm	ALSO HAS DIGITAL I/O FUNCTIONALITY				114.5 mm
TMDS1204IRNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.16X.24,16	3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm	IT ALSO OPERATE 3.135 TO 3.465	e4		260	6 mm
TMDS1204RNQT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	1	4				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.16X.24,16	3 V	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm	IT ALSO OPERATE 3.135 TO 3.465	e4		260	6 mm
HDL6M05585	Ablic	ULTRASOUND PULSER		NO LEAD	68	HVQCCN	SQUARE		UNSPECIFIED	YES	5.25 V	1		SOI-CMOS			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	.5 mm	75 Cel	0 Cel		QUAD	S-XQCC-N68		.95 mm	10.2 mm	Operating Supply in Clock mode is 2.4V to 3.6V			260	10.2 mm
PI3EQX501IZAEX	Diodes Incorporated	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	3 V	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N8		.8 mm	2 mm					2 mm
DS320PR810NJXR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	64	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	8	8				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.21X.39,16	3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N64	2	.8 mm	5.5 mm		e4		260	10 mm
DS320PR822NJXT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	64	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	2	8				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.21X.39,16	3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N64	2	.8 mm	5.5 mm		e4		260	10 mm
DS320PR810NJXT	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	64	HVQCCN	RECTANGULAR		PLASTIC/EPOXY	YES	3.6 V	8	8				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.21X.39,16	3 V	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N64	2	.8 mm	5.5 mm		e4		260	10 mm

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.