BUFFER Logic Gates 277

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74AUP3G07GTX	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	TR, 7 INCH	1.1		SMALL OUTLINE, VERY THIN PROFILE		20.7 ns		.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8	1	3.6 V	.5 mm	1 mm	.8 V			e3	30	260	1.95 mm	AUP/ULP/V
74AUP3G17DCH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	TR, 7 INCH	1.1		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		20.1 ns		.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	3.6 V	1 mm	2 mm	.8 V		SEATED HGT-NOM	e4	30	260	2.3 mm	AUP/ULP/V
74AXP2T3407DCH	Nexperia	BUFFER	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		225 ns		.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	2.75 V	1 mm	2 mm	.7 V		SEATED HGT-NOM	e4	30	260	2.3 mm	AXP
74AXP2T3407GSX	Nexperia	BUFFER	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2		SMALL OUTLINE, VERY THIN PROFILE		225 ns		.35 mm	85 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	R-PDSO-N8	1	2.75 V	.35 mm	1 mm	.7 V			e3	30	260	1.35 mm	AXP
74LVC2G16GFH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		2		1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns		.35 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm	1.65 V				NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74LVC2G16GMH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		2	TR, 7 INCH	1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns		.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
74HC2G16GWH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP		PLASTIC/EPOXY		YES	2	CMOS		1	TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns		.65 mm	125 Cel		-40 Cel	TIN	DUAL		1	6 V	1.1 mm	1.25 mm	2 V			e3	30	260	2 mm	HC/UH
74HC3G16DPH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns		.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	6 V	1.1 mm	3 mm	2 V			e4	30	260	3 mm	HC/UH
74HCT2G16GWH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	6	TSSOP		PLASTIC/EPOXY		YES	2	CMOS		1	TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns		.65 mm	125 Cel		-40 Cel	TIN	DUAL		1	5.5 V	1.1 mm	1.25 mm	4.5 V			e3	30	260	2 mm	HCT
74HCT3G16GDH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		5		SMALL OUTLINE, VERY THIN PROFILE		29 ns		.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8		6 V	.5 mm	2 mm	4.5 V		SEATED HGT-NOM		NOT SPECIFIED	NOT SPECIFIED	3 mm	HCT
74LV07ATPWJ	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		1	TR, 13 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns		.65 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	5.5 V	1.1 mm	4.4 mm	4.5 V			e4	30	260	5 mm	LV/LV-A/LVX/H
74AUP3G16DCH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1	TR, 7 INCH	1.1		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		20.8 ns		.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	3.6 V	1 mm	2 mm	.8 V		SEATED HGHT-NOM	e4	30	260	2.3 mm	AUP/ULP/V
74AUP3G16GFX	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.1		SMALL OUTLINE, VERY THIN PROFILE		20.8 ns		.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	3.6 V	.5 mm	1 mm	.8 V			e3	30	260	1.35 mm	AUP/ULP/V
74LVC1G16GFH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.8		SMALL OUTLINE, VERY THIN PROFILE		11 ns		.35 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm	1.65 V				NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74LVC1G16GMH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	1.8		SMALL OUTLINE, VERY THIN PROFILE		11 ns		.5 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N6	1	5.5 V	.5 mm	1 mm	1.65 V			e3	30	260	1.45 mm	LVC/LCX/Z
74LVC1G16GWH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns		.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	1.65 V			e3	30	260	2.05 mm	LVC/LCX/Z
74LVC3G16DPH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns		.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
74LVC3G16GFX	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS		1		1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns		.35 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-N8	1	5.5 V	.5 mm	1 mm	1.65 V			e3	30	260	1.35 mm	LVC/LCX/Z
74LVC3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.8		CHIP CARRIER, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	1.65 V			e4	30	260	1.6 mm	LVC/LCX/Z
NL17SZ07EDFT2G	Onsemi	BUFFER	MILITARY	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1		1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		12 ns		.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	1.65 V			e3	30	260	2 mm	LVC/LCX/Z
74AUP1T34GX,132	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2		SMALL OUTLINE		33.5 ns		.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm	1.1 V			e4	30	260	.8 mm	AUP/ULP/V
74AXP2G07GN,125	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2		SMALL OUTLINE		82 ns		.3 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N6		2.75 V	.35 mm	.9 mm	.7 V						1 mm	AXP
74AXP2T3407GS,115	NXP Semiconductors	BUFFER	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS		1		1.2		SMALL OUTLINE, VERY THIN PROFILE		225 ns		.35 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-N8		2.75 V	.35 mm	1 mm	.7 V						1.35 mm	AXP
74HC3G34DP-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns		.65 mm	125 Cel		-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V						3 mm	HC/UH
74HCT2G34GV-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE		29 ns		.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm	4.5 V						2.9 mm	HCT
74LVC1G34GV-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	AEC-Q100	1		3.3		SMALL OUTLINE, THIN PROFILE		11 ns		.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.5 mm	1.65 V						2.9 mm	LVC/LCX/Z
NL37WZ16MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	8	USSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	2.3	50 pF	SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH	SOLCC8,.04,20	8.8 ns	24 Amp	.5 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N8	1	5.5 V	.55 mm	1 mm	1.65 V	.01 mA		e4	10	260	1.95 mm	LVC/LCX/Z
NL37WZ16MU3TCG	Onsemi	BUFFER	MILITARY	NO LEAD	8	USSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	CMOS		1	TR	2.3	50 pF	SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH	SOLCC8,.04,14	8.8 ns	24 Amp	.35 mm	125 Cel		-55 Cel		DUAL	R-PDSO-N8	1	5.5 V	.55 mm	1 mm	1.65 V	.01 mA			10	260	1.45 mm	LVC/LCX/Z
MC74VHC1GT50MU2TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6		RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3	50 pF			14.5 ns	8 Amp		125 Cel	3-STATE	-55 Cel		DUAL	R-PDSO-N6		5.5 V			2 V	.04 mA			NOT SPECIFIED	NOT SPECIFIED		AHC/VHC/H/U/V
MC74VHC2G17MU1TCG	Onsemi	BUFFER	MILITARY	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	20.5 ns	8 Amp	.5 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N6		5.5 V	.55 mm	1 mm	2 V	.04 mA		e4			1.45 mm	AHC/VHC
NC7WZ17FHX-L22175	Onsemi	BUFFER		NO LEAD	6	VSOF	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	15.8 ns	32 Amp	.35 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N6		5.5 V	.55 mm	1 mm	1.65 V	100 mA			NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
NL27WZ17DFT2G-L22348	Onsemi	BUFFER		GULL WING	6	TSSOP	RECTANGULAR	UNSPECIFIED	YES	YES	2	CMOS		1	TR	2.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	15.6 ns	32 Amp	.65 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-XDSO-G6	1	5.5 V	1.1 mm	1.25 mm	1.65 V	100 mA		e3	30	260	2 mm	LVC/LCX/Z
MC74VHC1G07DFT1G-L22038	Onsemi	BUFFER		GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.5 ns	8 Amp	.65 mm	125 Cel	OPEN-DRAIN	-55 Cel	MATTE TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	2 V	50 mA		e3	30	260	2 mm	AHC/VHC/H/U/V
NL37WZ17USG-L22190	Onsemi	BUFFER		GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS		1	TR	1.85	50 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	9.2 ns	32 Amp	.5 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	5.5 V	.9 mm	2 mm	1.65 V	100 mA		e3	30	260	2.3 mm	37WZ
MC74VHC1G50P5T5G-L22088	Onsemi	BUFFER		FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.03,14	14.5 ns	8 Amp	.35 mm	125 Cel	3-STATE	-55 Cel		DUAL	R-PDSO-F5		5.5 V	.4 mm	.8 mm	2 V	50 mA					1 mm	AHC/VHC/H/U/V
MC74VHC1G50DFT1G-L22038	Onsemi	BUFFER		GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1	TR	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08	14.5 ns	8 Amp	.65 mm	125 Cel	3-STATE	-55 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm	2 V	50 mA					2 mm	AHC/VHC/H/U/V
TC7SZ07AFSL3J(T	Toshiba	BUFFER		FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		1		1.8	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL5/6,.03,14	12 ns	32 Amp	.35 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	R-PDSO-F5		5.5 V	.5 mm	.8 mm	1.65 V	50 mA					1 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.