| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
70 Cel |
512MX72 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
3.8 mm |
38654705664 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
67.6 mm |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
18.9 mm |
3.9 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
69.6 mm |
|||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
268435456 words |
YES |
COMMON |
1.35 |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
Gold (Au) |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
800 MHz |
3.8 mm |
Not Qualified |
17179869184 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX |
e4 |
.096 Amp |
67.6 mm |
||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6150 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
4 mm |
400 MHz |
30.175 mm |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.252 Amp |
133.35 mm |
.45 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6246 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
4 mm |
400 MHz |
17.9 mm |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.252 Amp |
133.35 mm |
||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3016 mA |
536870912 words |
YES |
COMMON |
1.5 |
1.5,3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
3.8 mm |
667 MHz |
30 mm |
Not Qualified |
34359738368 bit |
1.425 V |
AUTO/SELF REFRESH |
.192 Amp |
67.6 mm |
||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1480 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
3.8 mm |
333 MHz |
30.5 mm |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.056 Amp |
67.6 mm |
.45 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1360 mA |
33554432 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N240 |
267 MHz |
Not Qualified |
2147483648 bit |
.5 ns |
|||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1380 mA |
67108864 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
266 MHz |
Not Qualified |
4294967296 bit |
.056 Amp |
.5 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1880 mA |
67108864 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N240 |
200 MHz |
Not Qualified |
4294967296 bit |
.08 Amp |
.6 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1360 mA |
33554432 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N200 |
267 MHz |
Not Qualified |
2147483648 bit |
.028 Amp |
.5 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1856 mA |
134217728 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
266 MHz |
Not Qualified |
8589934592 bit |
.112 Amp |
.5 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3280 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
167 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.08 Amp |
.7 ns |
|||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3240 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
333 MHz |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX72 |
256M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
45 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
244 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1890 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM244,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N244 |
1.9 V |
3.8 mm |
400 MHz |
30 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
82 mm |
.4 ns |
||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1890 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
400 MHz |
30.175 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.063 Amp |
133.35 mm |
.4 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2824 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
3.8 mm |
333 MHz |
30 mm |
Not Qualified |
34359738368 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.128 Amp |
67.6 mm |
.45 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4640 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
167 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.08 Amp |
.7 ns |
||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1940 mA |
67108864 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
200 MHz |
Not Qualified |
4294967296 bit |
.04 Amp |
.7 ns |
|||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
70 Cel |
128MX72 |
128M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
28.73 mm |
3.99 mm |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH; WD-MAX |
e4 |
30 |
260 |
133.35 mm |
|||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
70 Cel |
128MX72 |
128M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
31.9 mm |
4 mm |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH; WD-MAX |
e4 |
30 |
260 |
133.35 mm |
|||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1640 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
4294967296 bit |
.04 Amp |
.7 ns |
|||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4640 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
R-PDMA-N184 |
167 MHz |
Not Qualified |
8589934592 bit |
.08 Amp |
.7 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3280 mA |
33554432 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
2147483648 bit |
.7 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
10440 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N184 |
166 MHz |
Not Qualified |
9663676416 bit |
.7 ns |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1620 mA |
33554432 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
2147483648 bit |
.7 ns |
||||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3645 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
3.18 mm |
167 MHz |
31.75 mm |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.045 Amp |
133.35 mm |
.7 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4080 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
4294967296 bit |
.064 Amp |
.7 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3760 mA |
33554432 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
200 MHz |
Not Qualified |
2147483648 bit |
.032 Amp |
.7 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4080 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
167 MHz |
Not Qualified |
4294967296 bit |
.064 Amp |
.7 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3760 mA |
33554432 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
200 MHz |
Not Qualified |
2147483648 bit |
.032 Amp |
.7 ns |
|||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3645 mA |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
2.7 V |
3.8 mm |
166 MHz |
31.75 mm |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.045 Amp |
67.6 mm |
.7 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3280 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
167 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.032 Amp |
.7 ns |
||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.15 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
30 |
260 |
133.35 mm |
|||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX72 |
128M |
0 Cel |
Gold (Au) |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
30 |
260 |
|||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1680 mA |
67108864 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
65 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
267 MHz |
Not Qualified |
4294967296 bit |
.04 Amp |
.5 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3360 mA |
134217728 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
65 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
R-PDMA-N200 |
333 MHz |
Not Qualified |
8589934592 bit |
.08 Amp |
.45 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1760 mA |
67108864 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
65 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
333 MHz |
Not Qualified |
4294967296 bit |
.04 Amp |
.45 ns |
||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5220 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
166 MHz |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.7 ns |
|||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1728 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
333 MHz |
30 mm |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
.126 Amp |
133.35 mm |
.45 ns |
|||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
3330 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
30.5 mm |
333 MHz |
30.175 mm |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.126 Amp |
133.35 mm |
.45 ns |
|||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.6 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX72 |
128M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
4 mm |
18.29 mm |
Not Qualified |
9663676416 bit |
2.5 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4640 mA |
268435456 words |
COMMON |
1.5,3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
667 MHz |
Not Qualified |
17179869184 bit |
.16 Amp |
||||||||||||||||||||||||||||
|
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3920 mA |
134217728 words |
COMMON |
1.5,3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
R-PDMA-N204 |
667 MHz |
Not Qualified |
8589934592 bit |
.08 Amp |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.