8192 DRAM 707

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT47H64M8SH-25EAIT:H

Micron Technology

DDR2 DRAM

INDUSTRIAL

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

150 mA

67108864 words

4,8

YES

COMMON

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

.8 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

400 MHz

8 mm

536870912 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.01 Amp

4,8

10 mm

W972GG6KB25I

Winbond Electronics

DDR2 DRAM

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

134217728 words

4,8

YES

COMMON

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

.8 mm

95 Cel

128MX16

128M

-40 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

400 MHz

8 mm

2147483648 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.05 Amp

4,8

12.5 mm

.4 ns

MT48LC32M8A2P-7E:G

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

150 mA

33554432 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

.0025 Amp

1,2,4,8

22.22 mm

5.4 ns

AS4C512M16D3L-12BCN

Alliance Memory

DDR3L DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

536870912 words

8

YES

COMMON

1.35

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX16

512M

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

800 MHz

9 mm

Not Qualified

8589934592 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

.011 Amp

8

14 mm

.225 ns

AS4C512M16D3L-12BIN

Alliance Memory

DDR3L DRAM

INDUSTRIAL

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

536870912 words

8

YES

COMMON

1.35

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX16

512M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

800 MHz

9 mm

Not Qualified

8589934592 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

.011 Amp

8

14 mm

.225 ns

MT8HTF12864AZ-667H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1480 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

30.5 mm

333 MHz

2.7 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

.45 ns

MT8JTF12864AZ-1G4G1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3920 mA

134217728 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

30.5 mm

667 MHz

2.7 mm

Not Qualified

8589934592 bit

1.425 V

AUTO/SELF REFRESH; WD-MAX

.096 Amp

133.35 mm

MT40A2G4TRF-093E:A

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

70 mA

2147483648 words

8

YES

COMMON

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,6X13,32

.8 mm

95 Cel

2GX4

2G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1067.2 MHz

9.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

.055 Amp

8

11.5 mm

MT41K512M8DA-107AIT:P

Micron Technology

DDR3L DRAM

INDUSTRIAL

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

146 mA

536870912 words

8

YES

COMMON

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

3-STATE

512MX8

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

934.57 MHz

8 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

30

260

.011 Amp

8

10.5 mm

MT8KTF25664HZ-1G4M1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1640 mA

268435456 words

YES

COMMON

1.35

1.35

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

ZIG-ZAG

1

R-XZMA-N204

1.45 V

30.15 mm

667 MHz

3.8 mm

Not Qualified

17179869184 bit

1.283 V

AUTO/SELF REFRESH; WD-MAX

.096 Amp

67.6 mm

MT47H512M4THN-25E:H

Micron Technology

DDR2 DRAM

OTHER

63

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

217 mA

536870912 words

YES

COMMON

1.8

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B63

1.9 V

1.2 mm

400 MHz

8 mm

Not Qualified

2147483648 bit

1.7 V

AUTO/SELF REFRESH

.014 Amp

10 mm

MT40A1G8WE-075E:B

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

63 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,6X13,32

.8 mm

95 Cel

1GX8

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1333.33 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

.046 Amp

8

12 mm

MT40A1G8WE-075EAIT:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

182 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

3-STATE

1GX8

1G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1333 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.025 Amp

8

12 mm

MT40A2G4WE-075E:B

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

58 mA

2147483648 words

8

YES

COMMON

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,6X13,32

.8 mm

95 Cel

2GX4

2G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1333.33 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

.041 Amp

8

12 mm

MT40A512M16JY-075E:B

Micron Technology

DDR4 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

105 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,6X16,32

.8 mm

95 Cel

512MX16

512M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1333.33 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.05 Amp

8

14 mm

MT8KTF25664HZ-1G6K1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1248 mA

268435456 words

YES

COMMON

1.35

1.35

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

ZIG-ZAG

1

R-XZMA-N204

1.45 V

30.15 mm

800 MHz

3.8 mm

Not Qualified

17179869184 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX

.096 Amp

67.6 mm

MT40A1G8WE-083EAAT:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

184 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

105 Cel

3-STATE

1GX8

1G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.027 Amp

8

12 mm

MT40A512M16JY-075EAIT:B

Micron Technology

DDR4 DRAM

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

262 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

512MX16

512M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1333 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.025 Amp

8

14 mm

MT40A512M16JY-083EAAT:B

Micron Technology

DDR4 DRAM

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

254 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

105 Cel

3-STATE

512MX16

512M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.028 Amp

8

14 mm

MT40A512M16JY-083EAIT:B

Micron Technology

DDR4 DRAM

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

252 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

512MX16

512M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.025 Amp

8

14 mm

MT48LC16M16A2P-6AXIT:G

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

100 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

167 MHz

10.16 mm

268435456 bit

3 V

AUTO/SELF REFRESH

e3

30

260

.0025 Amp

1,2,4,8

22.22 mm

5.4 ns

MT40A1G8WE-083EAIT:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

182 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

3-STATE

1GX8

1G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.025 Amp

8

12 mm

MT40A1G8WE-083EAUT:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

192 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

125 Cel

3-STATE

1GX8

1G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.042 Amp

8

12 mm

MT40A512M16JY-083EAUT:B

Micron Technology

DDR4 DRAM

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

273 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

125 Cel

3-STATE

512MX16

512M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1200 MHz

8 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.042 Amp

8

14 mm

IS43TR16512BL-125KBLI-TR

Integrated Silicon Solution

DDR3L DRAM

INDUSTRIAL

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

95 mA

536870912 words

4,8

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,6X16,32

.8 mm

95 Cel

512MX16

512M

1.283 V

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

800 MHz

10 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

e1

10

260

.055 Amp

4,8

14 mm

IS43TR16128DL-107MBL

Integrated Silicon Solution

DDR3L DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

216 mA

134217728 words

4,8

YES

COMMON

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

128MX16

128M

1.283 V

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

934.58 MHz

9 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH

e1

10

260

.016 Amp

4,8

13 mm

MT41K512M16VRN-107AIT:P

Micron Technology

DDR3L DRAM

INDUSTRIAL

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

SINGLE BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

304 mA

536870912 words

4,8

YES

COMMON

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

512MX16

512M

1.283 V

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

934.57 MHz

8 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

e1

30

260

.022 Amp

4,8

14 mm

MT40A1G16RC-062E:B

Micron Technology

DDR4 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

1GX16

1G

1.14 V

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1600 MHz

10 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

13 mm

MT4VDDT1664HY-335K1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1080 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N200

2.7 V

31.9 mm

167 MHz

2.45 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

67.6 mm

.7 ns

AS4C512M16D3LB-12BCN

Alliance Memory

DDR3L DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

470 mA

536870912 words

8

YES

COMMON

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

800 MHz

9 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

.06 Amp

8

13.5 mm

AS4C512M8D4-83BCN

Alliance Memory

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

187 mA

536870912 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1200 MHz

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.04 Amp

8

10.6 mm

MT40A1G8SA-062EAAT:E

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

195 mA

1073741824 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

105 Cel

3-STATE

1GX8

1G

-40 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

7.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.02 Amp

8

11 mm

MT40A256M16LY-062E:FTR

Micron Technology

DDR4 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

312 mA

268435456 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

256MX16

256M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1600 MHz

7.5 mm

4294967296 bit

1.14 V

e1

30

260

.003 Amp

8

13.5 mm

AS4C16M16SA-7TCNTR

Alliance Memory

SYNCHRONOUS DRAM

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

55 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

.8 mm

70 Cel

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G54

3

3.6 V

1.2 mm

143 MHz

10.16 mm

268435456 bit

3 V

AUTO/SELF REFRESH

.02 Amp

1,2,4,8

22.22 mm

5.4 ns

AS4C1G8MD3L-12BCNTR

Alliance Memory

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

125 mA

1073741824 words

4,8

YES

COMMON

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

3-STATE

1GX8

1G

1.283 V

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

800 MHz

9 mm

8589934592 bit

1.283 V

.011 Amp

4,8

13.2 mm

AS4C512M16D3L-12BCNTR

Alliance Memory

DDR3L DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

185 mA

536870912 words

4,8

YES

COMMON

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

512MX16

512M

1.283 V

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

800 MHz

9 mm

8589934592 bit

1.283 V

e1

.011 Amp

4,8

14 mm

AS4C512M16D3L-12BINTR

Alliance Memory

DDR3L DRAM

INDUSTRIAL

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

185 mA

536870912 words

4,8

YES

COMMON

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

3-STATE

512MX16

512M

1.283 V

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

3

1.45 V

1.2 mm

800 MHz

9 mm

8589934592 bit

1.283 V

e1

.011 Amp

4,8

14 mm

AS4C64M16D2A-25BCNTR

Alliance Memory

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

170 mA

67108864 words

4,8

YES

COMMON

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

.8 mm

85 Cel

3-STATE

64MX16

64M

1.7 V

0 Cel

BOTTOM

1

R-PBGA-B84

3

1.9 V

1.2 mm

400 MHz

8 mm

1073741824 bit

1.7 V

AUTO/SELF REFRESH

.01 Amp

4,8

12.5 mm

.4 ns

AS4C32M16SB-7BINTR

Alliance Memory

SYNCHRONOUS DRAM

INDUSTRIAL

54

TFBGA

8192

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

33554432 words

1,2,4,8,FP

YES

COMMON/SEPARATE

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA54,9X9,32

.8 mm

85 Cel

3-STATE

32MX16

32M

3 V

-40 Cel

BOTTOM

1

S-PBGA-B54

3.6 V

1.2 mm

143 MHz

8 mm

536870912 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.008 Amp

1,2,4,8

8 mm

5.4 ns

AS4C32M16SB-7BIN

Alliance Memory

SYNCHRONOUS DRAM

INDUSTRIAL

54

TFBGA

8192

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

33554432 words

1,2,4,8,FP

YES

COMMON/SEPARATE

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA54,9X9,32

.8 mm

85 Cel

3-STATE

32MX16

32M

3 V

-40 Cel

BOTTOM

1

S-PBGA-B54

3.6 V

1.2 mm

143 MHz

8 mm

536870912 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.008 Amp

1,2,4,8

8 mm

5.4 ns

MT40A1G16RC-062EIT:B

Micron Technology

DDR4 DRAM

INDUSTRIAL

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

95 Cel

1GX16

1G

1.14 V

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.26 V

1.2 mm

1600 MHz

10 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

13 mm

MT40A2G8VA-062E:B

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2147483648 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

2GX8

2G

1.14 V

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

10 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

11 mm

MT40A4G4VA-062E:B

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4294967296 words

8

YES

COMMON

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

4GX4

4G

1.14 V

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

10 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

11 mm

MT40A8G4BAF-062E:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

277 mA

8589934592 words

YES

COMMON

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X11,32

.8 mm

95 Cel

8GX4

8G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

10.5 mm

34359738368 bit

1.14 V

11 mm

MT40A4G8BAF-062E:B

Micron Technology

DDR4 DRAM

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

245 mA

4294967296 words

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X11,32

.8 mm

95 Cel

4GX8

4G

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

10.5 mm

34359738368 bit

1.14 V

e1

30

260

11 mm

MT40A512M16LY-062EAAT:E

Micron Technology

DDR4 DRAM

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

275 mA

536870912 words

8

YES

COMMON

1.2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

.8 mm

105 Cel

3-STATE

512MX16

512M

1.14 V

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

3

1.26 V

1.2 mm

1600 MHz

7.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

.02 Amp

8

13.5 mm

MT40A2G8JC-062E:E

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2147483648 words

8

YES

COMMON

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

2GX8

2G

1.14 V

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

9 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

11 mm

MT40A4G4JC-062E:E

Micron Technology

DDR4 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4294967296 words

8

YES

COMMON

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

.8 mm

95 Cel

4GX4

4G

1.14 V

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

1600 MHz

9 mm

17179869184 bit

1.14 V

AUTO/SELF REFRESH

e1

30

260

8

11 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.