XO Clock Oscillators

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Part RoHS Manufacturer Oscillator Type Mounting Feature No. of Terminals Frequency Stability Frequency Adjustment (Mechanical) Aging Package Body Material Maximum Supply Voltage Technology Screening Level Output Load Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Equivalence Code Maximum Rise Time Sub-Category Physical Dimension Minimum Supply Voltage Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Nominal Operating Frequency Maximum Fall Time Maximum Symmetry (%) Manufacturer Series Qualification Maximum Output Low Current Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

ECS-2520S18-384-EN-TR

Ecs International

HCMOS

SURFACE MOUNT

4

15 %

NO

CERAMIC

1.98 V

HCMOS

15 pF

7 mA

1.8 V

5 ms

2.5mm x 2.0mm x 0.9mm

1.62 V

85 Cel

-40 Cel

Gold (Au)

38.4 MHz

5 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

e4

CB3LV-3I-29M491200

Cts

HCMOS/TTL

SURFACE MOUNT

50 %

NO

3.63 V

30 pF

3.3 V

5 ms

7.0mm x 5.0mm x 1.8mm

2.97 V

85 Cel

-40 Cel

GOLD OVER NICKEL

29.4912 MHz

5 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION

e4

MX553BBD156M250

Microchip Technology

HCSL

SURFACE MOUNT

6

50 %

NO

3.63 V

50 OHM

.45 ms

5.0mm x 3.2mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

156.25 MHz

.45 ns

52/48

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX553LBB148M500

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

5.0mm x 3.2mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

148.5 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX554BBG322M265

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

5.0mm x 3.2mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

322.265 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX573ABC212M500-TR

Microchip Technology

CMOS

SURFACE MOUNT

6

50 %

NO

3.63 V

.5 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

212.5 MHz

.5 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR

e3

MX573EBB125M000

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

125 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX574BBD322M265-TR

Microchip Technology

HCSL

SURFACE MOUNT

6

50 %

NO

3.63 V

50 OHM

.45 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

322.265 MHz

.45 ns

52/48

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

e3

MX575ABB50M0000-TR

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

50 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

e3

MX575ABB50M0000

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

50 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX573NBA622M080-TR

Microchip Technology

PECL

SURFACE MOUNT

6

50 %

NO

3.63 V

50 OHM

.35 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

622.08 MHz

.35 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

MX573NBB311M040-TR

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

311.04 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

MX573NBD311M040-TR

Microchip Technology

HCSL

SURFACE MOUNT

6

50 %

NO

3.63 V

50 OHM

.45 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

311.04 MHz

.45 ns

52/48

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

DSC6001HI3B-032K768

Microchip Technology

CMOS

SURFACE MOUNT

4

20 %

NO

3.63 V

10 pF

2 ms

1.6mm x 1.2mm x 0.89mm

1.71 V

85 Cel

-40 Cel

.032768 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; BAG

DSC6003MA3B-032K768

Microchip Technology

CMOS

SURFACE MOUNT

4

20 %

NO

3.63 V

5 pF

3.5 ms

2.0mm x 1.6mm x 0.89mm

1.71 V

125 Cel

-40 Cel

.032768 MHz

3.5 ns

55/45

AEC-Q100; ENABLE/DISABLE FUNCTION; BAG

DSC6183CI2A-032K768

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

CMOS

10 pF

3 mA

2.2 ms

3.2mm x 2.5mm x 0.85mm

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

.032768 MHz

2.2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION

e4

DSC6001HI3B-032K768T

Microchip Technology

CMOS

SURFACE MOUNT

4

20 %

NO

3.63 V

10 pF

2 ms

1.6mm x 1.2mm x 0.89mm

1.71 V

85 Cel

-40 Cel

.032768 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; TR

DSC6003JI2B-032K768

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

5 pF

3.5 ms

2.5mm x 2.0mm x 0.89mm

1.71 V

85 Cel

-40 Cel

GOLD OVER NICKEL

.032768 MHz

3.5 ns

55/45

ENABLE/DISABLE FUNCTION; TUBE

e4

DSC6112JI2B-032K768T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

15 pF

1.5 ms

2.5mm x 2.0mm x 0.89mm

1.71 V

85 Cel

-40 Cel

MATTE TIN

.032768 MHz

1.5 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TR

e3

DSC613RI3A-010U

Microchip Technology

LVCMOS

SURFACE MOUNT

6

20 %

NO

PLASTIC/EPOXY

3.63 V

AEC-Q100; MIL-STD-883

5 pF

6.5 mA

SOLCC6,.08,32

3.5 ms

2.5mm x 2.0mm x 0.89mm

1.71 V

85 Cel

-40 Cel

MATTE TIN

3.5 ns

55/45

MEMS CLOCK GENERATORS AS EXT CLOCK

.002 MHz

100 MHz

NX53D3301Z

Diodes Incorporated

CMOS

SURFACE MOUNT

6

50 %

NO

3.465 V

CMOS

35 OHM

70 mA

3.3 V

.5 ms

5.0mm x 3.2mm x 1.2mm

3.135 V

85 Cel

-40 Cel

133.333333 MHz

.5 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION; TR, 7 INCH

ECS-2520Q-33-260BS-TR

Ecs International

HCMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

3.465 V

AEC-Q200

15 pF

7 mA

3.3 V

LCC4,.08X.1,68/52

10 ms

2.5mm x 2.0mm x 0.8mm

3.135 V

125 Cel

-40 Cel

Gold (Au)

26 MHz

10 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

e4

CA50C2605ILT

Cts

HCMOS

SURFACE MOUNT

4

25 %

NO

CERAMIC

3.465 V

HCMOS

AEC-Q200

15 pF

40 mA

3.3 V

DILCC4,.12

10 ms

5.0mm x 3.2mm x 1.3mm

3.135 V

85 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

26 MHz

10 ns

55/45

8 Amp

ENABLE/DISABLE FUNCTION

626L15626C3T

Cts

LVDS

SURFACE MOUNT

6

20 %

NO

CERAMIC

3.465 V

LVDS

100 OHM

40 mA

3.3 V

.7 ms

2.5mm x 2.0mm x 1.1mm

3.135 V

70 Cel

-20 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

156.25 MHz

.7 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT

CA50C2403IMT

Cts

HCMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

1.89 V

HCMOS

AEC-Q200

15 pF

25 mA

1.8 V

DILCC4,.12

5 ms

5.0mm x 3.2mm x 1.3mm

1.71 V

85 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

24 MHz

5 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

CA50C1473GNT

Cts

HCMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

2.665 V

HCMOS

AEC-Q200

15 pF

30 mA

2.5 V

DILCC4,.12

5 ms

5.0mm x 3.2mm x 1.3mm

2.375 V

105 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

14.7456 MHz

5 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

CA25C2004GLT

Cts

HCMOS

SURFACE MOUNT

4

30 %

NO

CERAMIC

3.465 V

HCMOS

AEC-Q200

15 pF

20 mA

3.3 V

7 ms

2.5mm x 2.0mm x 1.0mm

3.135 V

105 Cel

-40 Cel

GOLD OVER NICKEL

20 MHz

7 ns

55/45

8 Amp

STANDBY; ENABLE/DISABLE FUNCTION

e4

CA70C1473GNT

Cts

HCMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

2.625 V

HCMOS

AEC-Q200

15 pF

30 mA

2.5 V

5 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

105 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

14.7456 MHz

5 ns

55/45

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

e4

643H10003I3R

Cts

HCSL

SURFACE MOUNT

6

50 %

NO

CERAMIC

3.465 V

50 OHM

60 mA

3.3 V

LCC6,.1X.12,75/51

.7 ms

3.2mm x 2.5mm x 0.9mm

3.135 V

85 Cel

-40 Cel

GOLD OVER NICKEL

100 MHz

.7 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT

e4

643H2503G3R

Cts

HCSL

SURFACE MOUNT

6

50 %

NO

CERAMIC

3.465 V

50 OHM

60 mA

3.3 V

LCC6,.1X.12,75/51

.7 ms

3.2mm x 2.5mm x 0.9mm

3.135 V

105 Cel

-40 Cel

GOLD OVER NICKEL

25 MHz

.7 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT

e4

CA20C2504GMT

Cts

HCMOS

SURFACE MOUNT

4

30 %

NO

CERAMIC

1.89 V

HCMOS

AEC-Q200

15 pF

15 mA

1.8 V

LCC4,.06X.08,50/38

7 ms

2.0mm x 1.6mm x 0.8mm

1.71 V

105 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

25 MHz

7 ns

55/45

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

CA20C2404GMT

Cts

HCMOS

SURFACE MOUNT

4

30 %

NO

CERAMIC

1.89 V

HCMOS

AEC-Q200

15 pF

15 mA

1.8 V

LCC4,.06X.08,50/38

7 ms

2.0mm x 1.6mm x 0.8mm

1.71 V

105 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

24 MHz

7 ns

55/45

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

CA20C5004GLT

Cts

HCMOS

SURFACE MOUNT

4

30 %

NO

CERAMIC

3.465 V

HCMOS

AEC-Q200

15 pF

20 mA

3.3 V

LCC4,.06X.08,50/38

7 ms

2.0mm x 1.6mm x 0.8mm

3.135 V

105 Cel

-40 Cel

Gold Flash (Au) - with Nickel (Ni) barrier

50 MHz

7 ns

55/45

8 Amp

STANDBY; ENABLE/DISABLE FUNCTION

CA32C2403HMT

Cts

HCMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

1.89 V

HCMOS

AEC-Q200

15 pF

40 mA

1.8 V

LCC4,.1X.12,83/65

7 ms

3.2mm x 2.5mm x 1.2mm

1.71 V

125 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

24 MHz

7 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

CHT70C1002MNT

Cts

HCMOS

SURFACE MOUNT

4

100 %

NO

CERAMIC

2.625 V

HCMOS

15 pF

30 mA

2.5 V

DILCC4,.2,200

5 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

125 Cel

-55 Cel

GOLD OVER NICKEL

10 MHz

5 ns

55/45

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

e4

HT-MM900A7-7K-EE-50M0000000

Microchip Technology

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

3.3 V

SOLCC4,.1,43

3 ms

2.5mm x 2.0mm x 0.75mm

2.97 V

125 Cel

-40 Cel

50 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

HT-MM900AC-7K-EE-100M000000

Microchip Technology

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

3.3 V

SOLCC4,.1,43

3 ms

2.5mm x 2.0mm x 0.75mm

2.97 V

125 Cel

-55 Cel

100 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

HT-MM900AC-7K-EE-16M0000000

Microchip Technology

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

3.3 V

SOLCC4,.1,43

3 ms

2.5mm x 2.0mm x 0.75mm

2.97 V

125 Cel

-55 Cel

16 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

HT-MM900AC-6F-EE-50M0000000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

3.3 V

DILCC4,.1,83

3 ms

3.2mm x 2.5mm x 0.75mm

2.97 V

125 Cel

-55 Cel

50 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

VCC4-B3F-100M000000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

15 pF

30 mA

3.3 V

DILCC4,.12

2 ms

5mm x 3.2mm x 1.4mm

2.97 V

85 Cel

-40 Cel

GOLD OVER NICKEL

100 MHz

2 ns

45/55

8 Amp

TRI-STATE

e4

VCC4-B3D-24M5760000

Microchip Technology

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

15 pF

20 mA

3.3 V

DILCC4,.12

4 ms

5mm x 3.2mm x 1.4mm

2.97 V

85 Cel

-40 Cel

GOLD OVER NICKEL

24.576 MHz

4 ns

45/55

8 Amp

TRI-STATE

e4

8N4S001FG-1076CDI

Renesas Electronics

LVDS

SURFACE MOUNT

10

50 %

NO

CERAMIC

2.625 V

50 OHM

155 mA

2.5 V

LCC10,.2X.27,100/39

.425 ms

7.0mm x 5.0mm x 1.55mm

2.375 V

85 Cel

-40 Cel

100 MHz

.425 ns

55/45

ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

HX31C5018Q

Diodes Incorporated

LVCMOS

SURFACE MOUNT

4

50 %

NO

2.625 V

AEC-Q200

15 pF

15 mA

2.5 V

LCC4,.1X.12,83/65

2.5 ms

3.2mm x 2.5mm x 1.0mm

2.375 V

105 Cel

-40 Cel

125 MHz

2.5 ns

40/60

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

NX21G0001Q

Diodes Incorporated

LVCMOS

SURFACE MOUNT

4

50 %

NO

3.465 V

AEC-Q200

15 pF

60 mA

3.3 V

LCC4,.08X.1,74/52

3 ms

2.5mm x 2.0mm x 0.8mm

3.135 V

85 Cel

-40 Cel

160 MHz

3 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION

KX1132707Q

Diodes Incorporated

LVCMOS

SURFACE MOUNT

4

25 %

NO

3.465 V

AEC-Q200

15 pF

.03 mA

3.3 V

LCC4,.06X.08,50/38

30 ms

2.0mm x 1.6mm x 0.75mm

3.135 V

85 Cel

-40 Cel

.032768 MHz

30 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION

FN0180035

Diodes Incorporated

LVCMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

15 pF

15 mA

3.3 V

DILCC4,.2,200

7 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

70 Cel

-20 Cel

1.8432 MHz

7 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION

PDF620032J

Diodes Incorporated

LVPECL

SURFACE MOUNT

6

20 %

NO

3.63 V

50 OHM

45 mA

3.3 V

DILCC6,.12

.4 ms

5.0mm x 3.2mm x 1.2mm

2.97 V

85 Cel

-40 Cel

156.25 MHz

.4 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION

PK2500005J

Diodes Incorporated

LVPECL

SURFACE MOUNT

6

25 %

NO

3.63 V

MIL-STD-883

50 OHM

60 mA

3.3 V

LCC6,.1X.13,98/65

.85 ms

3.2mm x 2.5mm x 0.9mm

2.97 V

85 Cel

-40 Cel

25 MHz

.85 ns

45/55

STANDBY; ENABLE/DISABLE FUNCTION

XO Clock Oscillators

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.