NXP Semiconductors Power Management ICs 465

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Adjustable Threshold
MC34PF3001A1EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A1EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A2EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A2EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A3EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A3EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A4EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A4EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A5EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A5EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A6EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A6EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A7EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
MC34PF3001A7EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260	7 mm	YES
NXQ1TXL5/101J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	1	2		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32	1	5.25 V	.85 mm	5 mm	3.4 V	SEATED HEIGHT-NOM			260	5 mm	NO
MMPF0100F6AZESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260	8 mm	YES
MMPF0100F6AZES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260	8 mm	YES
PTN5150HHXMP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VQCCN	SQUARE	YES	PLASTIC/EPOXY	1	1		NO LEAD	3.3 V	CHIP CARRIER, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N12	3	5.5 V	.4 mm	1.6 mm	2.7 V				260	1.6 mm	NO
PTN5150HHXZ	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VQCCN	SQUARE	YES	PLASTIC/EPOXY	1	1		NO LEAD	3.3 V	CHIP CARRIER, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N12		5.5 V	.4 mm	1.6 mm	2.7 V					1.6 mm	NO
MC33PF3000A0ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC32PF3000A7EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V	e3	40	260	7 mm	YES
MC32PF3000A7EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V	e3	40	260	7 mm	YES
MC33PF3000A0ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A3ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A3ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A4ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A4ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A5ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A5ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A6ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A6ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A7ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC33PF3000A7ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V		40	260	7 mm	YES
MC34PF3000A7EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V	e3	40	260	7 mm	YES
MC34PF3000A7EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	12	MOS	NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V	e3	40	260	7 mm	YES
MCZ33903D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DP3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DP5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DP5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES
MCZ33903DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260	11 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.