NXP Semiconductors Power Management ICs 465

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MCZ33903DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33903DS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33904D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33904D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33904D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33904D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33905DD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33905DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33905DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MCZ33905DS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm	5.5 V		e3	40	260		11 mm	YES
MC34VR5100A0EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	8			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V			40	260		7 mm	YES
MC34VR5100A0EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	8			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V		e3	40	260		7 mm	YES
MC34VR5100A1EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	8			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V		e3	40	260		7 mm	YES
MC33PF3001A6ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V		40	260		7 mm	YES
MC33PF3001A6ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V		40	260		7 mm	YES
MC33PF3001A7ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V		40	260		7 mm	YES
MC33PF3001A7ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED	1	10			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm	2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V		40	260		7 mm	YES
MMPF0100FBANESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FBANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FCAEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FCAEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FCANESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FCANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FDAEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MMPF0100FDAEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260		8 mm	YES
MWCT1011AVLH	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MWCT1013AVLH	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC32PF3000A8EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3						e3	40	260
MC32PF3000A8EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3						e3	40	260
MC34PF3000A8EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3						e3	40	260
MC34PF3000A8EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3						e3	40	260
MC32PF4210A0ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY	1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V			40	260	+2.4V	8 mm	YES
MC32PF1550A1EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY	1	7			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm	2.5 V		e4	40	260	+6.5V	5 mm	YES
TEA19031AQT/1J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	10	SOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	5			GULL WING	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-25 Cel		DUAL	R-PDSO-G10	1		1.75 mm	3.9 mm					260		6.2 mm	NO
TEA19051BAAT/1J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	14	SOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	8			GULL WING	5 V	SMALL OUTLINE		1.27 mm	105 Cel	-20 Cel		DUAL	R-PDSO-G14	1	21 V	1.75 mm	3.9 mm	2.9 V				260		8.65 mm	NO
MC33PF8100A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8101A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	1	9			NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
TEA19032CABT/1J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	10	SOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1			GULL WING	5 V	SMALL OUTLINE	SOP10,.24	1.27 mm	105 Cel	-20 Cel		DUAL	R-PDSO-G10	1	21 V	1.75 mm	3.9 mm	0 V				260		6.2 mm	YES
MC33FS5502Y0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	1	4		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm			e3	40	260	+7.5V	8 mm	YES
MC33FS5502Y0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	1	4		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm			e3	40	260	+7.5V	8 mm	YES
MC33FS5502Y3ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	1	4		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm			e3	40	260	+7.5V	8 mm	YES
MC33VR5500V0ESR2	NXP Semiconductors											AEC-Q100								TIN			3						e3	40	260
MC33VR5500V1ES	NXP Semiconductors											AEC-Q100								TIN			3						e3	40	260
MC33VR5500V0ES	NXP Semiconductors											AEC-Q100								TIN			3						e3	40	260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.