BGA Digital Signal Processors (DSPs) 259

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-TS101SAB1Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32			GRID ARRAY		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm			27 mm		YES	64			260	SINGLE	27 mm			CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B625	3			YES	YES	e1
SM32C6713BGDPM30EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	125 Cel		4	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2		CMOS		1.26 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e0
AD14160LKB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	3.3	GRID ARRAY	BGA452,36X36,50	4.75 V	85 Cel			0 Cel	TIN LEAD	BOTTOM	5.08 mm		524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	2200 mA	5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
AD14160BB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	GRID ARRAY	BGA452,36X36,50	4.75 V	100 Cel			-40 Cel	TIN LEAD	BOTTOM	5.08 mm		524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	3400 mA	5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
AD14160KB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	GRID ARRAY	BGA452,36X36,50	4.75 V	85 Cel			0 Cel	TIN LEAD	BOTTOM	5.08 mm		524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	3400 mA	5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
ADSP-21161NCCAZ100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.85 mm		32768	17 mm		YES	48	27.5 MHz		260	MULTIPLE	17 mm			CMOS	965 mA	1.8 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
ADSP-21161NYCAZ110	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.85 mm		32768	17 mm		YES	48	27.5 MHz			MULTIPLE	17 mm			CMOS	965 mA	1.8 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
OMAPL137BZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		13		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm			17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm			CMOS		1.3 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
OMAPL137BZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		13		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm			17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm			CMOS		1.3 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6421ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		22	32	1.05/1.2,1.8/3.3	GRID ARRAY	BGA376,22X22,40	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		12288	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 450MHZ	YES	8	600 MHz	30	260	MULTIPLE	23 mm			CMOS		1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		NO	NO	e1
ADSP-21060LAB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel			-40 Cel	TIN LEAD SILVER	BOTTOM	2.7 mm		131072	23 mm		YES	48	40 MHz		225	MULTIPLE	23 mm			CMOS	600 mA	3.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e0
ADSP-21060LKB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel			0 Cel	TIN LEAD SILVER	BOTTOM	2.7 mm		131072	23 mm		YES	48	40 MHz	30	225	MULTIPLE	23 mm			CMOS	600 mA	3.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e0
ADSP-21061LKB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	PGA225,15X15	3.15 V	85 Cel			0 Cel	TIN LEAD SILVER	BOTTOM	2.57 mm		32768	23 mm		YES	48	40 MHz	30	225	MULTIPLE	23 mm			CMOS	480 mA	3.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e0
ADSP-21062KB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V		32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel			0 Cel	TIN LEAD SILVER	BOTTOM	2.7 mm		65536	23 mm		YES	48	40 MHz		225	MULTIPLE	23 mm			CMOS	850 mA	5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e0
ADSP-21062LAB-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel			-40 Cel	TIN LEAD SILVER	BOTTOM	2.7 mm		65536	23 mm		YES	48	40 MHz		225	MULTIPLE	23 mm			CMOS	600 mA	3.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e0
ADSP-21160MKB-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel			0 Cel	TIN LEAD SILVER	BOTTOM	2.49 mm		131072	27 mm		YES	64	80 MHz		225	MULTIPLE	27 mm			CMOS	1410 mA	2.5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e0
TMS320C6211GFN150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA272,20X20,50	1.71 V	90 Cel			0 Cel		BOTTOM	2.32 mm		1024	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	150 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm			CMOS		1.8 V		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6711GFN150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.8 V	90 Cel			0 Cel		BOTTOM	2.32 mm		17408	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	149.25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm			CMOS		1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6712GFN100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V						BOTTOM	2.32 mm		16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm			CMOS		1.8 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6201GJC200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	90 Cel		4	0 Cel	TIN LEAD	BOTTOM	3.5 mm		16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	35 mm	2		CMOS		1.8 V	4	Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e0
TMS320C6201GJCA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel		4	-40 Cel	TIN LEAD	BOTTOM	3.5 mm		16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	35 mm	2		CMOS		1.8 V	4	Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e0
TMS320C6201GJL200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,40	1.71 V	90 Cel			0 Cel	TIN LEAD	BOTTOM	3.8 mm		16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm			CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e0
TMS320C6201GJLA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,40	1.71 V	105 Cel		4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm		16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2		CMOS		1.8 V	4	Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e0
ADSP-TS201SYBPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm			25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm			CMOS		1.05 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
TMS320C6727BGDH300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel			0 Cel	TIN LEAD	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	20	220	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e0	8
TMS320C6727BZDH275	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e1	8
TMS320C6727BZDH300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e1	8
TMSDC6727BZDHA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e1	8
TMS320DM642AZNZA5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.36 V	105 Cel		4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.8 mm		16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	27 mm	3		CMOS		1.4 V	64	Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320C6202BZNZ250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	90 Cel		4	0 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	30	260	MULTIPLE	27 mm	2		CMOS		1.5 V	4	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified		YES	NO	e1	8
SM32C6713BGDPS20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		22	32	1.3,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	105 Cel		4	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm		65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2		CMOS		1.26 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e0
V62/04603-03XA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		22	32	1.3,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	105 Cel		4	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm		65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2		CMOS		1.26 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e0
TMS32C6211BZFNA150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V	105 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	2.32 mm			27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	150 MHz	30	260	MULTIPLE	27 mm	2		CMOS		1.8 V	16	Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256	4	Not Qualified		YES	NO	e1
ADSP-BF535PKBZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	260	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		26			GRID ARRAY		.95 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm			19 mm		YES	32	40 MHz			MULTIPLE	19 mm			CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B260	3	Not Qualified		YES	YES	e1
ADSP-21469BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm		163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm			CMOS	10 mA	1.05 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-21469KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm		163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm			CMOS	10 mA	1.05 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-21160NCBZ-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V		32	32	1.9,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V					TIN SILVER COPPER	BOTTOM	2.49 mm		131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz		260	MULTIPLE	27 mm			CMOS		1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		NO	YES	e1
TMS320C6727BGDH350	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel			0 Cel	TIN LEAD	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	20	220	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e0	8
TMS320C6727BZDH350	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e1	8
TMSDC6727BGDHA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	2.02 mm		262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	20	220	MULTIPLE	17 mm			CMOS		1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e0	8
ADSP-BF561SBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm			17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm			CMOS		1.25 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm			17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm			CMOS		1.25 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm			17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	17 mm			CMOS		1.35 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
MC56F8367VVFE	Freescale Semiconductor	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V		24	16	2.5,3.3	GRID ARRAY	BGA160,14X14,40	2.25 V	105 Cel	56800E		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	524288		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	120 MHz	40	260	MULTIPLE	15 mm		36864	CMOS		2.5 V		Microcontrollers	FLASH	1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	60 rpm	YES	YES	e1
ADSP-BF533SBBZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,1.8/3.3,3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm			19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	19 mm			CMOS		1.2 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B169	3	Not Qualified	400 rpm	YES	YES	e1
TMS320F28232ZJZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	176	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.89 V	16	20	32	1.9,3.3	GRID ARRAY	BGA176,14X14,40	1.71 V	85 Cel		8	-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		52	15 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	100 MHz	30	260	MULTIPLE	15 mm	19		CMOS	315 mA	1.8 V	6	Digital Signal Processors	FLASH	1 mm	FIXED POINT	S-PBGA-B176	3	Not Qualified		YES	NO	e1	16
TMS320F28232ZJZQ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		20	32	1.9,3.3	GRID ARRAY	BGA176,14X14,40	1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm			15 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	100 MHz	30	260	MULTIPLE	15 mm			CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B176	3	Not Qualified		YES	NO	e1
TMS320F28232ZJZS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		20	32	1.9,3.3	GRID ARRAY	BGA176,14X14,40	1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm			15 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	100 MHz	30	260	MULTIPLE	15 mm			CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B176	3	Not Qualified		YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.