BGA Digital Signal Processors (DSPs) 259

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320DM642AZNZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.8 mm

4096

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

NOT SPECIFIED

260

MULTIPLE

27 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

ADSP-BF561SBBZ600

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

297

BGA

SQUARE

PLASTIC/EPOXY

YES

1.4185 V

23

32

1.2,2.5/3.3

GRID ARRAY

BGA297,26X26,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.43 mm

27 mm

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

YES

32

600 MHz

260

MULTIPLE

27 mm

CMOS

1.35 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B297

3

Not Qualified

600 rpm

YES

YES

e1

ADSP-BF561SKBZ500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

297

BGA

SQUARE

PLASTIC/EPOXY

YES

1.375 V

23

32

1.2,2.5/3.3

GRID ARRAY

BGA297,26X26,40

.8 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.43 mm

27 mm

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

YES

32

500 MHz

260

MULTIPLE

27 mm

CMOS

1.25 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B297

3

Not Qualified

500 rpm

YES

YES

e1

ADSP-BF561SKBZ600

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

297

BGA

SQUARE

PLASTIC/EPOXY

YES

1.4185 V

23

32

1.2,2.5/3.3

GRID ARRAY

BGA297,26X26,40

.8 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.43 mm

27 mm

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

YES

32

600 MHz

260

MULTIPLE

27 mm

CMOS

1.35 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B297

3

Not Qualified

600 rpm

YES

YES

e1

TMS320C6711DZDP250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.47 V

22

32

1.4,3.3

GRID ARRAY

BGA272,20X20,50

1.33 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.57 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

250 MHz

30

260

MULTIPLE

27 mm

2

CMOS

1.4 V

16

Digital Signal Processors

FLASH

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e1

TMS320DM640AGNZA4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.14 V

TIN LEAD

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

20

220

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e0

TMS320DM640AZNZ4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.14 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

30

260

MULTIPLE

27 mm

3

CMOS

1.2 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

TMS320DM641AZNZ5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.14 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

30

260

MULTIPLE

27 mm

3

CMOS

1.2 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

TMS320DM641AZNZ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

30

260

MULTIPLE

27 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

ADSP-TS201SYBP-050

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

32

1.05,1.5,2.5

GRID ARRAY

BGA576,24X24,40

1 V

105 Cel

-40 Cel

BOTTOM

3.1 mm

25 mm

ALSO REQUIRES 2.5V SUPPLY

YES

64

125 MHz

225

MULTIPLE

25 mm

CMOS

1.05 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B576

3

Not Qualified

NO

YES

TMS32C6711DZDPA167

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.2,3.3

GRID ARRAY

BGA272,20X20,50

1.14 V

105 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

2.57 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

167 MHz

30

260

MULTIPLE

27 mm

2

CMOS

1.2 V

16

Digital Signal Processors

FLASH

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e1

TMS320F28235ZJZQR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

176

BGA

SQUARE

PLASTIC/EPOXY

YES

1.995 V

AEC-Q100

16

GRID ARRAY

1.805 V

125 Cel

C28X

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

2.05 mm

15 mm

YES

32

35 MHz

30

260

MULTIPLE

15 mm

69632

CMOS

1.9 V

6

YES

1 mm

FIXED POINT

S-PBGA-B176

3

YES

NO

e1

TMS320VC5402AGWS16

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

144

BGA

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1.65 V

16

23

16

GRID ARRAY

BGA144,13X13,32

1.55 V

100 Cel

4

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

16384

12 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

16

20 MHz

20

220

MULTIPLE

12 mm

2

CMOS

.8 mA

1.6 V

6

MROM

.8 mm

FIXED POINT

R-PBGA-B144

3

YES

YES

e0

16

TMS320VC5402AZWS16

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

144

BGA

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1.65 V

16

23

16

GRID ARRAY

BGA144,13X13,32

1.55 V

100 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

12 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

16

20 MHz

30

260

MULTIPLE

12 mm

2

CMOS

.8 mA

1.6 V

6

MROM

.8 mm

FIXED POINT

R-PBGA-B144

3

YES

YES

e1

16

SM320C6457CGMHS

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

688

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.133 V

14

GRID ARRAY

1.067 V

100 Cel

-55 Cel

TIN LEAD

BOTTOM

23 mm

YES

32

20

220

SINGLE

23 mm

4

CMOS

1.1 V

72

MROM

FIXED POINT

S-PBGA-B688

4

YES

NO

e0

8

ADSP-SC594KBPZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

GRID ARRAY

BGA400,20X20,32

.95 V

125 Cel

0 Cel

BOTTOM

1.75 mm

655360

17 mm

2MB Large on-chip Level 2 (L2) SRAM Available

YES

0

30 MHz

MULTIPLE

17 mm

16

CMOS

1 V

6

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

8

ADSP-21593KBPZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

GRID ARRAY

BGA400,20X20,32

.95 V

125 Cel

0 Cel

BOTTOM

1.75 mm

655360

17 mm

2MB Large on-chip Level 2 (L2) SRAM Available

YES

0

30 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

16

CMOS

1 V

6

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

8

ADSP-21591KBPZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

GRID ARRAY

BGA400,20X20,32

.95 V

125 Cel

0 Cel

BOTTOM

1.75 mm

655360

17 mm

1MB Large on-chip Level 2 (L2) SRAM Available

YES

0

30 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

16

CMOS

1 V

6

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

8

ADSP-21593KBPZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

GRID ARRAY

BGA400,20X20,32

.95 V

125 Cel

0 Cel

BOTTOM

1.75 mm

655360

17 mm

2MB Large on-chip Level 2 (L2) SRAM Available

YES

0

30 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

16

CMOS

1 V

6

FLASH

.8 mm

FLOATING POINT

S-PBGA-B400

YES

YES

8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.