SQUARE Digital Signal Processors (DSPs) 2,107

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320DM648CUT7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

720 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

TMS320DM648CUT9

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

900 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

TMS320DM648CUTA8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

800 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

TMS320DM648CUTD7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

720 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

TMS320DM648CUTD9

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

520

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

14

32

1.2,1.8,3.3

GRID ARRAY

BGA529,23X23,32

1.14 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

8192

19 mm

YES

32

900 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B520

4

Not Qualified

YES

NO

e1

8

TMS320DM648ZUTD1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

TIN SILVER COPPER

BOTTOM

8192

30

245

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM8165SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

27 MHz

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYGH

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

ADSP-TS203SBBPZ050

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

32

1.05,1.5,2.5

GRID ARRAY

BGA576,24X24,40

1 V

85 Cel

0 Cel

BOTTOM

3.1 mm

131072

25 mm

YES

32

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

25 mm

CMOS

1.05 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B576

Not Qualified

NO

YES

TMS320C6745DPTPA3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

15

32

FLATPACK, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

24 mm

YES

16

30 MHz

30

260

SINGLE

24 mm

4

CMOS

1.2 V

40

.5 mm

FLOATING POINT

S-PQFP-G176

4

YES

NO

e4

DSPIC33EP512GP806-E/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

3

YES

e3

8

DSPIC33EP512GP806-E/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

40

260

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

3

YES

e3

8

DSPIC33EP512GP806-I/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

3

YES

e3

8

DSPIC33EP512GP806T-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

40

260

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

3

YES

e3

8

DSPIC33EP512MC806-E/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

3

YES

e3

8

DSPIC33EP512MC806T-E/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

3

YES

e3

8

DSPIC33EP512MC806T-E/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

40

260

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

3

YES

e3

8

DSPIC33EP512MC806T-I/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

3

YES

e3

8

DSPIC33EP512MC806T-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

YES

e3

8

PIC24EP512GP806-E/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

1

YES

e3

8

PIC24EP512GP806-I/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

YES

e3

8

PIC24EP512GP806T-E/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

40

260

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

1

YES

e3

8

PIC24EP512GP806T-E/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

125 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

YES

e3

8

PIC24EP512GP806T-I/MR

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1 mm

53248

9 mm

YES

0

60 MHz

9 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQCC-N64

YES

e3

8

PIC24EP512GP806T-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

5

-40 Cel

MATTE TIN

QUAD

1.2 mm

53248

10 mm

YES

0

60 MHz

10 mm

9

CMOS

320 mA

3.3 V

15

0

FLASH

.5 mm

FLOATING POINT

S-PQFP-G64

YES

e3

8

TMS320C6678ACYPA25

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

24

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

8192

24 mm

YES

16

30

245

MULTIPLE

24 mm

16

CMOS

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6415TBZLZW7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

260

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

e1

TMS320C6416TBCLZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.16 V

20

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.05 V

105 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

4096

23 mm

YES

64

75 MHz

30

260

MULTIPLE

23 mm

3

CMOS

1.1 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

8

TMS320C6745DPTP3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

15

32

1.2,1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP176,1.0SQ,20

1.14 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8192

24 mm

YES

16

30 MHz

30

260

SINGLE

24 mm

4

CMOS

1.2 V

40

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G176

4

Not Qualified

YES

NO

e4

TMS320C6745DPTP4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

15

32

1.3,1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP176,1.0SQ,20

1.25 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8192

24 mm

YES

16

30 MHz

30

260

SINGLE

24 mm

4

CMOS

1.3 V

40

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G176

4

Not Qualified

YES

NO

e4

TMS320C6745DPTPD4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

176

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

15

32

1.3,1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP176,1.0SQ,20

1.25 V

70 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8192

24 mm

YES

16

30 MHz

30

260

SINGLE

24 mm

4

CMOS

1.3 V

40

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G176

4

Not Qualified

YES

NO

e4

TMS320C6745DPTPT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

15

32

1.2,1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP176,1.0SQ,20

1.14 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8192

24 mm

YES

16

30 MHz

30

260

SINGLE

24 mm

4

CMOS

1.2 V

40

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G176

4

Not Qualified

YES

NO

e4

TMS320C6747DZKB3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

15

32

1.2,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

4

CMOS

1.2 V

40

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6747DZKB4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

15

32

1.3,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.25 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

4

CMOS

1.3 V

40

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6747DZKBA3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

15

32

1.2,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

4

CMOS

1.2 V

40

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.