SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
TMS320C6747DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			15		32	1.3,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		8192	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	4		CMOS			1.3 V	40			Digital Signal Processors			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6747DZKBT3R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES						32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40		105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM				8192								30	260					CMOS							Digital Signal Processors			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified				e1
TMS320C6747DZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			15		32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		8192	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	4		CMOS			1.2 V	40			Digital Signal Processors			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6455DZTZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V			0		32	1.25	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.242 mm		8192	24 mm			YES		0		30	260	MULTIPLE	24 mm			CMOS			1.2 V				Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
ADSP-21469BBC-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			24		32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	85 Cel			-40 Cel			BOTTOM		1.8 mm		163840	19 mm			YES		8	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	19 mm			CMOS		10 mA	1.05 V				Digital Signal Processors			1 mm	FLOATING POINT	S-PBGA-B324		Not Qualified		NO	YES
DSPIC33EP512GP506-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		3	-40 Cel	MATTE TIN		QUAD		1 mm		49152	9 mm			YES		0	60 MHz	40	260		9 mm	5		CMOS		55 mA	3.3 V	4			Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES		e3	8
DSPIC33EP512MC206-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		3	-40 Cel	MATTE TIN		QUAD		1 mm		49152	9 mm			YES		0	60 MHz	40	260		9 mm	5		CMOS		55 mA	3.3 V	4			Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES		e3	8
DSPIC33EP512MC504-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	3 V	125 Cel		3	-40 Cel	MATTE TIN		QUAD		1.2 mm		49152	10 mm			YES		0	60 MHz				10 mm	5		CMOS		55 mA	3.3 V	4			Digital Signal Processors		FLASH	.8 mm	FIXED POINT	S-PQFP-G44		Not Qualified		YES		e3	8
DSPIC33EP512MC506T-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		3	-40 Cel	MATTE TIN		QUAD		1 mm		49152	9 mm			YES		0	60 MHz	40	260		9 mm	5		CMOS		55 mA	3.3 V	4			Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES		e3	8
TMS320F28335ZJZQR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.995 V	16	AEC-Q100	22		32	1.9,3.3	GRID ARRAY, FINE PITCH	BGA176,14X14,40	1.805 V	125 Cel	C28X	8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM		2.05 mm		68	15 mm			YES		32	150 MHz	NOT SPECIFIED	260	MULTIPLE	15 mm	21	69632	CMOS		315 mA	1.9 V	6	YES		Digital Signal Processors		FLASH	.5 mm	FLOATING POINT	S-PBGA-B176	3	Not Qualified		YES	NO	e1	16
OMAPL137DZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15			1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		499712	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	3		CMOS			1.2 V	40			Other Microprocessor ICs			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		15			1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		499712	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	3		CMOS			1.3 V	40			Other Microprocessor ICs			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15			1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		499712	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	3		CMOS			1.2 V	40			Other Microprocessor ICs			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		15			1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		499712	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	3		CMOS			1.3 V	40			Other Microprocessor ICs			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15			1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm		499712	17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm	3		CMOS			1.2 V	40			Other Microprocessor ICs			1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
SM32C6416TBGLZA8EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			32		32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		4	-40 Cel	TIN LEAD		BOTTOM		3.25 mm		4096	23 mm			YES		32	100 MHz	20	220	MULTIPLE	23 mm	3		CMOS			1.2 V	64			Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
SM32C6416TBGLZI1EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			32		32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	85 Cel		4	-40 Cel	TIN LEAD		BOTTOM		3.25 mm		4096	23 mm			YES		32	100 MHz	20	220	MULTIPLE	23 mm	3		CMOS			1.2 V	64			Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
TMS320C6454BCTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V	8		32		32	1.25,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		3.242 mm		8192	24 mm			YES		32	50 MHz	30	245	MULTIPLE	24 mm	4		CMOS			1.25 V	64			Digital Signal Processors		MROM	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1	8
TMS320C6472ECTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		14		32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		3.242 mm		8192	24 mm			YES		32	50 MHz	30	245	MULTIPLE	24 mm	14		CMOS			1 V	64			Digital Signal Processors		MROM	.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified		YES	NO	e1	8
DSPIC33EP512GM706-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1.2 mm		49152	10 mm			YES		0	60 MHz			MULTIPLE	10 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified		YES	YES	e3	24
DSPIC33EP512GM706-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		49152	9 mm			YES		0	60 MHz	40	260	MULTIPLE	9 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES	YES	e3	24
DSPIC33EP512GM706-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	NO	16	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	DSPIC33	5	-40 Cel	MATTE TIN	YES	QUAD	YES	1.2 mm	524288	49152	10 mm	0		YES	BOR, COMPARATOR(5), DMA(4), POR, PWM(12), QEI(2), RTC, TIMER(13), WDT	0	60 MHz			MULTIPLE	10 mm	15	49152	CMOS	30-Ch 12-Bit	60 mA	3.3 V	4	YES	6	Digital Signal Processors	CAN(2), I2C(2), SPI(3), UART(4)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified	70 rpm	YES	YES	e3	24	53
DSPIC33EP512GM710-E/PF	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	100	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP100,.63SQ	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1.2 mm		49152	14 mm			YES		0	60 MHz	40	260	MULTIPLE	14 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
DSPIC33EP512GM710-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	100	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP100,.55SQ,16	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1.2 mm		49152	12 mm			YES		0	60 MHz	40	260	MULTIPLE	12 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.4 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
DSPIC33EP512GM710-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel		5	-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm		49152	10 mm			YES		0	60 MHz			MULTIPLE	10 mm	13		CMOS		60 mA	3.3 V	4		4	Digital Signal Processors		FLASH	.8 mm	FIXED POINT	S-PBGA-B121		Not Qualified		YES	YES	e1	8
ADSP-BF525ABCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19		32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES		16	50 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF592BCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V					32	1.3,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.7 V	85 Cel			-40 Cel			QUAD		1 mm			9 mm		ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES			50 MHz	30	260	MULTIPLE	9 mm			CMOS			1.8 V				Microprocessors			.5 mm	FIXED POINT	S-XQCC-N64	3	Not Qualified	200 rpm	YES	YES
SM320F28335PTPS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	1.995 V			20		32	1.9,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.805 V	150 Cel	C28X	8	-55 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		17408	24 mm		ALSO REQUIRES 3.3 V SUPPLY	YES		32	100 MHz	30	260	MULTIPLE	24 mm	13	69632	CMOS		350 mA	1.9 V	6	YES		Digital Signal Processors		OTPROM	.5 mm	FLOATING POINT	S-PQFP-G176	4	Not Qualified		YES	NO	e4	16
XOMAPL137DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			15				GRID ARRAY		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.05 mm			17 mm			YES		16	30 MHz	30	260	SINGLE	17 mm			CMOS			1.2 V							1 mm	FLOATING POINT	S-PBGA-B256	3			YES	NO	e1
ADSP-21477BCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24		40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	85 Cel			-40 Cel	MATTE TIN		QUAD		.9 mm		2097152	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors			.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3
ADSP-21477KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24		40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel			0 Cel	MATTE TIN		QUAD		.9 mm		2097152	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors			.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3
ADSP-21477KSWZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24		40	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.14 V	70 Cel			0 Cel	MATTE TIN		QUAD		1.6 mm		2097152	14 mm			YES		16	16.67 MHz			MULTIPLE	14 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-21478BCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24		40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	85 Cel			-40 Cel			QUAD		.9 mm		3145728	12 mm			YES		16	16.67 MHz	30	260	MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES		8
ADSP-21478KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24		40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel			0 Cel	Matte Tin (Sn) - annealed		QUAD		.9 mm		3145728	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
ADSP-21479KBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24		40	1.1,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm		5242880	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21479KBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24		40	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm		5242880	12 mm			YES		16	16.67 MHz	30	260	MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21479KBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24		40	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm		5242880	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21479KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8		24		40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel			0 Cel	Matte Tin (Sn) - annealed		QUAD		.9 mm		5242880	12 mm			YES		16	16.67 MHz			MULTIPLE	12 mm	1		CMOS			1.2 V	65		1	Digital Signal Processors		FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
DSPIC33EP128GM304-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	8 mm			YES		0	60 MHz			MULTIPLE	8 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.65 mm	FIXED POINT	S-PQCC-N44		Not Qualified		YES	YES	e3	24
DSPIC33EP128GM306-E/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	9 mm			YES		0	60 MHz	40	260	MULTIPLE	9 mm	13		CMOS		60 mA	3.3 V	4		4	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES	YES	e3	8
DSPIC33EP128GM306-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1.2 mm		16384	10 mm			YES		0	60 MHz	40	260	MULTIPLE	10 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQFP-G64	3	Not Qualified		YES	YES	e3	24
DSPIC33EP128GM306-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	9 mm			YES		0	60 MHz	40	260	MULTIPLE	9 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES	YES	e3	24
DSPIC33EP128GM306-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	NO	16	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel		5	-40 Cel	MATTE TIN	YES	QUAD	YES	1.2 mm	131072	16384	10 mm	0		YES	BOR, COMPARATOR(5), DMA(4), POR, PWM(12), QEI(2), RTC, TIMER(13), WDT	0	60 MHz			MULTIPLE	10 mm	15	16384	CMOS	30-Ch 12-Bit	60 mA	3.3 V	4	YES	6	Digital Signal Processors	I2C(2), I2S, IRDA, LIN, SMBUS, SPI(3), UART(4)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified		YES	YES	e3	24	53
DSPIC33EP128GM306T-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	9 mm			YES		0	60 MHz	40	260	MULTIPLE	9 mm	13		CMOS		60 mA	3.3 V	4		4	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES	YES	e3	8
DSPIC33EP128GM306T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1.2 mm		16384	10 mm			YES		0	60 MHz			MULTIPLE	10 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified		YES	YES	e3	24
DSPIC33EP128GM604-E/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	125 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	8 mm			YES		0	60 MHz			MULTIPLE	8 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.65 mm	FIXED POINT	S-PQCC-N44		Not Qualified		YES	YES	e3	24
DSPIC33EP128GM604-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	8 mm			YES		0	60 MHz			MULTIPLE	8 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.65 mm	FIXED POINT	S-PQCC-N44		Not Qualified		YES	YES	e3	24
DSPIC33EP128GM706-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		5	-40 Cel	MATTE TIN		QUAD		1 mm		16384	9 mm			YES		0	60 MHz	40	260	MULTIPLE	9 mm	15		CMOS		60 mA	3.3 V	4		6	Digital Signal Processors		FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified		YES	YES	e3	24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.