BALL Digital Signal Processors (DSPs) 1,179

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320F28235ZJZQR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	BGA	SQUARE	PLASTIC/EPOXY		YES	1.995 V		AEC-Q100	16			GRID ARRAY		1.805 V	125 Cel	C28X		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM	2.05 mm		15 mm		YES	32	35 MHz	30	260	MULTIPLE	15 mm		69632	CMOS		1.9 V	6	YES					1 mm	FIXED POINT	S-PBGA-B176	3	YES	NO	e1
TMS32C5517AZCHA20R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			21			GRID ARRAY, LOW PROFILE, FINE PITCH		.998 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		10 mm		YES	16		30	260	MULTIPLE	10 mm			CMOS		1.05 V							.65 mm	FIXED POINT	S-PBGA-B196	3	YES	NO	e1
ADSP-21566BBCZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-21566KBCZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400		YES	YES
ADSP-21567BBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-21567KBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-21569BBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400		YES	YES
ADSP-21569BBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-21569KBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-21569KBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel			0 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400		YES	YES
ADSP-21569WCBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400		YES	YES
TMS320VC5402AGWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY	BGA144,13X13,32	1.55 V	100 Cel		4	-40 Cel	TIN LEAD		BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	20	220	MULTIPLE	12 mm	2		CMOS	.8 mA	1.6 V	6				MROM		.8 mm	FIXED POINT	R-PBGA-B144	3	YES	YES	e0	16
TMS320VC5402AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.65 V	16		23	16		GRID ARRAY	BGA144,13X13,32	1.55 V	100 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2		CMOS	.8 mA	1.6 V	6				MROM		.8 mm	FIXED POINT	R-PBGA-B144	3	YES	YES	e1	16
ADSP-21567BBCZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel			-40 Cel			BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10		CMOS		1 V					FLASH		.8 mm	FLOATING POINT	S-PBGA-B400	3	YES	YES
ADSP-BF701BBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	200 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF701KBCZ-1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	100 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF701KBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	200 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm		YES	0	200 MHz	30	260	MULTIPLE	12 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
SM320F28335GHHAEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.995 V	16		20	32	1.9,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.805 V	125 Cel	C28X	8	-55 Cel	TIN LEAD		BOTTOM	1.4 mm	34816	12 mm		YES	32	150 MHz	20	235	MULTIPLE	12 mm	3	69632	CMOS	315 mA	1.9 V	6	YES	5	Digital Signal Processors	FLASH		.8 mm	FLOATING POINT	S-PBGA-B179	1	YES	NO	e0	16
TMS320C6454BCTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V			32			GRID ARRAY, FINE PITCH		1.2125 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.242 mm		24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm			CMOS		1.25 V							.8 mm	FIXED POINT	S-PBGA-B697	4	YES	NO	e1
TMS320C6474FCUN2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14			GRID ARRAY, FINE PITCH			85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12		CMOS			64				MROM		.8 mm	FIXED POINT	S-PBGA-B561	4	YES	NO	e1	8
TMS320C6474FCUN8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14			GRID ARRAY, FINE PITCH			85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12		CMOS			64				MROM		.8 mm	FIXED POINT	S-PBGA-B561	4	YES	NO	e1	8
TMS320C6474FCUNA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14			GRID ARRAY, FINE PITCH			95 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12		CMOS			64				MROM		.8 mm	FIXED POINT	S-PBGA-B561	4	YES	NO	e1	8
TMS320C6474FCUNA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14			GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12		CMOS			64				MROM		.8 mm	FIXED POINT	S-PBGA-B561	4	YES	NO	e1	8
TMS320F2806ZGMSR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		10 mm	ALSO REQUIRES 3.3V SUPPLY	YES	0	100 MHz	30	260	MULTIPLE	10 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B100	3	YES	NO	e1
TMS320C5545AZQW10R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	118	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.24 V	70 Cel			-10 Cel	TIN SILVER COPPER		BOTTOM	1 mm		7 mm		YES	0	12 MHz	30	260	MULTIPLE	7 mm			CMOS		1.3 V							.5 mm	FIXED POINT	S-PBGA-B118	3	YES	NO	e1
TMS320C5545AZQW10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	118	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.24 V	70 Cel			-10 Cel	TIN SILVER COPPER		BOTTOM	1 mm		7 mm		YES	0	12 MHz	30	260	MULTIPLE	7 mm			CMOS		1.3 V							.5 mm	FIXED POINT	S-PBGA-B118	3	YES	NO	e1
TMS320C6652CZH6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, FINE PITCH			85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm			CMOS									.8 mm	FLOATING POINT	S-PBGA-B625	3	YES	NO	e1
TMS320C6652CZHA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm			CMOS									.8 mm	FLOATING POINT	S-PBGA-B625	3	YES	NO	e1
TMS320C6654CZH7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, FINE PITCH			85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm			CMOS									.8 mm	FLOATING POINT	S-PBGA-B625	3	YES	NO	e1
TMS320C6654CZHA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm			CMOS									.8 mm	FLOATING POINT	S-PBGA-B625	3	YES	NO	e1
SM320C6457CGMHS	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	688	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V			14			GRID ARRAY		1.067 V	100 Cel			-55 Cel	TIN LEAD		BOTTOM			23 mm		YES	32		20	220	SINGLE	23 mm	4		CMOS		1.1 V	72				MROM			FIXED POINT	S-PBGA-B688	4	YES	NO	e0	8
SM320C6748EGWTS3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			23			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel			-55 Cel	TIN LEAD		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES AT 1.1V, 1.2V AND 1.3V NOMINAL SUPLY	YES	16	30 MHz	20	220	SINGLE	16 mm	8		CMOS		1 V	80						.8 mm	FLOATING POINT	S-PBGA-B361	3	YES	NO	e0
TMS320C5545AZQW06	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	118	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.998 V	70 Cel			-10 Cel	TIN SILVER COPPER		BOTTOM	1 mm		7 mm		YES	0		30	260	MULTIPLE	7 mm			CMOS		1.05 V							.5 mm	FIXED POINT	S-PBGA-B118	3	YES	NO	e1
ADSP-21587BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel			BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.1 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
ADSP-21587KBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel			0 Cel			BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.1 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
DFDF2812ZHHAR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16		19	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.81 V	85 Cel	C28X	3	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	18432	12 mm	1.8V NOMINAL AVAILBALE @135MHZ	YES	16	35 MHz	30	260	MULTIPLE	12 mm	8	36864	CMOS	230 mA	1.9 V		YES			OTPROM		.8 mm	FIXED POINT	S-PBGA-B179	3	YES	NO	e1	16
TNETV2665FIBZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.