BALL Digital Signal Processors (DSPs) 1,179

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6454BZTZ2	Texas Instruments			BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32					TIN SILVER COPPER	BOTTOM		32768						30	260				CMOS					Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified				e1
TMS320C6747AZKB3	Texas Instruments		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel		0 Cel		BOTTOM		8192																Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256		Not Qualified
DSP56311VF150B1	Freescale Semiconductor			BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES				24	1.8,3.3	GRID ARRAY	BGA196,14X14,40					TIN LEAD SILVER	BOTTOM		98304						30	220				CMOS					Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified				e0
TMS320C5504AZCH15	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	8	21	32	1.05/1.4,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	262144	10 mm		YES	16	12 MHz	30	260	SINGLE	10 mm	3	CMOS		1.05 V	16		Digital Signal Processors	MROM	.65 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	NO	e1	8
TMS320C6742BZWT2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320C6742BZWTA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320C6746BZCEA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		YES	16	30 MHz	30	260	SINGLE	13 mm		CMOS		1.2 V			Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320C6746BZWT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320C6746BZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS		1.3 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320C6746BZWTA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
OMAPL138BZCEA3E	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		0		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	.95 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	0	50 MHz	30	260	MULTIPLE	13 mm		CMOS		1 V			Other uPs/uCs/Peripheral ICs		.65 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
OMAPL138BZWTD4E	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		0		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	0	50 MHz	30	260	MULTIPLE	16 mm		CMOS		1 V			Other uPs/uCs/Peripheral ICs		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1
TMS320DM8168ACYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V				TIN SILVER COPPER	BOTTOM	3.31 mm	16384	25 mm		YES	16	27 MHz	30	245	MULTIPLE	25 mm		CMOS		1 V			Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified		NO	NO	e1
TMS320C5532AZHH10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8	0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
TMS320C5532AZHHA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8	0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
TMS320C5533AZHH10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8	0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
TMS320C5535AZHH10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8	0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
TMS320C5535AZHHA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	8	0	16	1.05/1.3,1.8/3.3	GRID ARRAY	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	NO	e1	8
ADSP-21366KBCZ-1AR	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm		YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-BF547YBC-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	220	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified	400 rpm	YES	YES
ADSP-BF547YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	400 rpm	YES	YES	e1
TMS320C6455DZTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V				TIN SILVER COPPER	BOTTOM	3.242 mm	32768	24 mm		YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
TMS320C6455DZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V				TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
TMS320C6455DZTZ2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V				TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
DSPIC33EP256MU810T-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
DSPIC33EP512MU810T-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP256GU810T-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP512GU810T-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
DSPIC33EP256MU810-E/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	125 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
DSPIC33EP256MU810-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
DSPIC33EP512MU810-E/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	125 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
DSPIC33EP512MU810-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP256GU810-E/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	125 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP256GU810-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	28672	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP512GU810-E/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	125 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
PIC24EP512GU810-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	53248	10 mm		YES	0	60 MHz				10 mm	9	CMOS	320 mA	3.3 V	15	0	Microcontrollers	FLASH	.8 mm	FLOATING POINT	S-PBGA-B121		Not Qualified		YES		e1	8
SM320C6727BGDHMEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	125 Cel		-55 Cel	TIN LEAD	BOTTOM	2.02 mm	65536	17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	NO	32	250 MHz	20	220	MULTIPLE	17 mm	1	CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3			NO	NO	e0
OMAPL138AZCEA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		0			GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM				ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY	YES	0	300 MHz	30	260	MULTIPLE			CMOS		1.2 V						FLOATING POINT	S-PBGA-B361	3			YES	NO	e1
OMAPL138BZWTA4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		0			GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM				ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY	YES	0	456 MHz	30	260	MULTIPLE			CMOS		1.2 V						FLOATING POINT	S-PBGA-B361	3			YES	NO	e1
TMS320TCI6482BGTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel		0 Cel	TIN LEAD	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e0
TMS320TCI6482BGTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e0
TMS320TCI6482BGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel		0 Cel	TIN LEAD	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e0
TMS320TCI6482BZTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
TMS320TCI6482BZTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
TMS320TCI6482BZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS		1.25 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
GC6016IZEV	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		8		1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.05 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	310 MHz	30	260	MULTIPLE	23 mm		CMOS		1.1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified		YES	NO	e1
TMS320DM8147BCYE0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		8	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	30	250	MULTIPLE	23 mm		CMOS		1.1 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified		YES	NO	e1
TMS320DM8148BCYE0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		8	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		16384	23 mm		YES	16	30 MHz	30	250	MULTIPLE	23 mm		CMOS		1.1 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified		YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.