BALL Digital Signal Processors (DSPs) 1,179

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6747DZKBT3R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40		105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		8192						30	260					CMOS						Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified				e1
TMS320C6747DZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4		CMOS		1.2 V	40			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6455DZTZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V			0	32	1.25	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	3.242 mm	8192	24 mm		YES	0		30	260	MULTIPLE	24 mm			CMOS		1.2 V				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1
ADSP-21469BBC-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V			24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	85 Cel			-40 Cel			BOTTOM	1.8 mm	163840	19 mm		YES	8	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	19 mm			CMOS	10 mA	1.05 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324		Not Qualified		NO	YES
TMS320F28335ZJZQR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.995 V	16	AEC-Q100	22	32	1.9,3.3	GRID ARRAY, FINE PITCH	BGA176,14X14,40	1.805 V	125 Cel	C28X	8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM	2.05 mm	68	15 mm		YES	32	150 MHz	NOT SPECIFIED	260	MULTIPLE	15 mm	21	69632	CMOS	315 mA	1.9 V	6	YES		Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-PBGA-B176	3	Not Qualified		YES	NO	e1	16
OMAPL137DZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3		CMOS		1.2 V	40			Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		15		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3		CMOS		1.3 V	40			Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3		CMOS		1.2 V	40			Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		15		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3		CMOS		1.3 V	40			Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
OMAPL137DZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		15		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3		CMOS		1.2 V	40			Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
SM32C6416TBGLZA8EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			32	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		4	-40 Cel	TIN LEAD		BOTTOM	3.25 mm	4096	23 mm		YES	32	100 MHz	20	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
SM32C6416TBGLZI1EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V			32	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	85 Cel		4	-40 Cel	TIN LEAD		BOTTOM	3.25 mm	4096	23 mm		YES	32	100 MHz	20	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
TMS320C6454BCTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V	8		32	32	1.25,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.242 mm	8192	24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm	4		CMOS		1.25 V	64			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified		YES	NO	e1	8
TMS320C6472ECTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		14	32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.242 mm	8192	24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm	14		CMOS		1 V	64			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified		YES	NO	e1	8
DSPIC33EP512GM710-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel		5	-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	49152	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	13		CMOS	60 mA	3.3 V	4		4	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B121		Not Qualified		YES	YES	e1	8
ADSP-BF525ABCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		12 mm		YES	16	50 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
XOMAPL137DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			15			GRID ARRAY		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm		17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm			CMOS		1.2 V						1 mm	FLOATING POINT	S-PBGA-B256	3			YES	NO	e1
ADSP-21479KBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.1,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21479KBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz	30	260	MULTIPLE	12 mm	1		CMOS		1.2 V	65		1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-21479KBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
DSPIC33EP128GM710-I/BG	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA121,11X11,32	3 V	85 Cel		5	-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	16384	10 mm		YES	0	60 MHz			MULTIPLE	10 mm	13		CMOS	60 mA	3.3 V	4		4	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B121		Not Qualified		YES	YES	e1	8
ADSP-TS101SAB1Z000	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32			GRID ARRAY		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.5 mm		27 mm		YES	64			260	SINGLE	27 mm			CMOS		1.25 V						1 mm	FLOATING POINT	S-PBGA-B625	3			YES	YES	e1
ADSP-TS101SAB1Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32			GRID ARRAY		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.5 mm		27 mm		YES	64			260	SINGLE	27 mm			CMOS		1.2 V						1 mm	FLOATING POINT	S-PBGA-B625	3			YES	YES	e1
ADSP-TS101SAB2Z000	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32			GRID ARRAY, FINE PITCH		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.5 mm		19 mm		YES	64			260	SINGLE	19 mm			CMOS		1.25 V						.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
ADSP-TS101SAB2Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32		GRID ARRAY, FINE PITCH		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.5 mm		19 mm		YES	64			260	SINGLE	19 mm			CMOS		1.2 V						.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
ADSP-21478BBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	3145728	12 mm		YES	16	16.67 MHz		260	MULTIPLE	12 mm	1		CMOS		1.2 V	65		1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-21478KBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	3145728	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-21478KBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	3145728	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-21478KBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	3145728	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1		CMOS		1.2 V	65		1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
ADSP-21479BBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		24	40		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz		260	MULTIPLE	12 mm	1		CMOS		1.2 V	65		1		FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3			YES	YES	e1	8
SM320F28335GJZMEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	176	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.995 V			20			GRID ARRAY, FINE PITCH		1.805 V	125 Cel	C28X		-55 Cel	TIN LEAD	YES	BOTTOM	2.05 mm		15 mm		YES	32	150 MHz	20	235	MULTIPLE	15 mm		69632	CMOS		1.9 V	6	YES				.5 mm	FLOATING POINT	S-PBGA-B176	3			YES	NO	e0
TMS320C6727BZDH250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			13			GRID ARRAY, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.02 mm		17 mm		YES	32	25 MHz	30	260	MULTIPLE	17 mm			CMOS		1.2 V						.5 mm	FIXED POINT	S-PBGA-B256	3			NO	NO	e1
SM320C6678ACYPW	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			24			GRID ARRAY, FINE PITCH		.95 V	115 Cel			-55 Cel	TIN SILVER COPPER		BOTTOM	3.39 mm		24 mm		YES	16	312.5 MHz	30	245	SINGLE	24 mm	16		CMOS		1 V	80					.8 mm	FLOATING POINT	S-PBGA-B841	4			YES	NO	e1
TMS320C80GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.465 V	8		32	32	3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA352,26X26,50	3.135 V	85 Cel		4	0 Cel			BOTTOM	1.7 mm	25600	35 mm		YES	64	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm	1		CMOS	2300 mA	3.3 V	0		0	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified		NO	YES
SM32C6713BGDPM30EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	125 Cel		4	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.57 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2		CMOS		1.26 V	16			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e0
AD14160LKB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V			32	32	3.3	GRID ARRAY	BGA452,36X36,50	4.75 V	85 Cel			0 Cel	TIN LEAD		BOTTOM	5.08 mm	524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	2200 mA	5 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
AD14160BB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V			32	32	5	GRID ARRAY	BGA452,36X36,50	4.75 V	100 Cel			-40 Cel	TIN LEAD		BOTTOM	5.08 mm	524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	3400 mA	5 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
AD14160KB-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	452	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V			32	32	5	GRID ARRAY	BGA452,36X36,50	4.75 V	85 Cel			0 Cel	TIN LEAD		BOTTOM	5.08 mm	524288	46.995 mm		YES	48	40 MHz			MULTIPLE	46.995 mm			CMOS	3400 mA	5 V				Digital Signal Processors		1.27 mm	FLOATING POINT	S-CBGA-B452		Not Qualified		YES	YES	e0
ADSP-21161NCCAZ100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.85 mm	32768	17 mm		YES	48	27.5 MHz		260	MULTIPLE	17 mm			CMOS	965 mA	1.8 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
ADSP-21161NYCAZ110	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			24	32	1.8,3.3	GRID ARRAY	BGA225,15X15,40	1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.85 mm	32768	17 mm		YES	48	27.5 MHz			MULTIPLE	17 mm			CMOS	965 mA	1.8 V				Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
OMAPL137BZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V			13		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm			CMOS		1.3 V				Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
OMAPL137BZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V			13		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm			CMOS		1.3 V				Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C5505AZCH15	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.47 V	8		27	16	1.4,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.33 V	70 Cel		2	-10 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	163840	10 mm	ALSO OPERATES AT 60 MHZ WITH 1.05 V SUPPLY	YES	16	150 MHz	30	260	MULTIPLE	10 mm	3		CMOS		1.4 V	16			Digital Signal Processors	MROM	.65 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified		YES	NO	e1	8
TMS320C6421ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			22	32	1.05/1.2,1.8/3.3	GRID ARRAY	BGA376,22X22,40	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	2.48 mm	12288	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 450MHZ	YES	8	600 MHz	30	260	MULTIPLE	23 mm			CMOS		1.2 V				Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		NO	NO	e1
TMS320DM647ZUT1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm	8192	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	1100 MHz	30	245	MULTIPLE	19 mm			CMOS		1.2 V				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		YES	NO	e1
TMS320DM648ZUT1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm	8192	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	1100 MHz	30	245	MULTIPLE	19 mm			CMOS		1.2 V				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		YES	NO	e1
TMS320TCI100BQCLZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			20			GRID ARRAY, FINE PITCH		1.16 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O	YES	64	850 MHz	30	260	MULTIPLE	23 mm			CMOS		1.2 V						.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BQCLZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			20			GRID ARRAY, FINE PITCH		1.16 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O	YES	64	850 MHz	30	260	MULTIPLE	23 mm			CMOS		1.2 V						.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.