BALL Digital Signal Processors (DSPs) 1,179

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320C6424ZDUQ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

20480

23 mm

YES

32

30 MHz

30

260

MULTIPLE

23 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWT4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

81920

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWT5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

81920

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWT6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

81920

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWT7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWTQ5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

81920

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C6424ZWTQ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

YES

32

30 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320DM6431ZDU3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

32

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.71 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

16384

23 mm

YES

32

30 MHz

30

260

MULTIPLE

23 mm

5

CMOS

1.8 V

72

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

YES

NO

e1

TMS320DM6433ZWT5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

30

260

MULTIPLE

16 mm

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320C5421GGUA200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

19

GRID ARRAY, LOW PROFILE, FINE PITCH

4.75 V

85 Cel

0 Cel

BOTTOM

1.4 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

5 V

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

YES

YES

TMS320C6418GTSA500

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

288

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.2,3.3

GRID ARRAY

BGA288,22X22,40

1.36 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.8 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

30 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B288

4

Not Qualified

YES

NO

e0

TMS320DM640AZNZA4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY

BGA548,26X26,40

1.14 V

TIN SILVER COPPER

BOTTOM

2.8 mm

4096

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

30

260

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

TMS320DM643AZDK5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

548

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

20

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA548,26X26,32

1.14 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.8 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

30

260

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

TMS320DM647ZUT9

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

19 mm

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

YES

32

900 MHz

30

245

MULTIPLE

19 mm

8

CMOS

1.2 V

64

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

YES

NO

e1

8

TMS320F28015ZGMA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.89 V

16

AEC-Q100

0

32

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA100,10X10,32

1.71 V

85 Cel

C28X

3

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

3072

10 mm

ALSO REQUIRES 3.3V SUPPLY

YES

0

100 MHz

30

260

MULTIPLE

10 mm

10

12288

CMOS

230 mA

1.8 V

YES

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B100

3

Not Qualified

YES

NO

e1

16

TMS32C6205DZHKA200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

288

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.57 V

8

32

32

1.5,3.3,5

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA288,19X19,32

1.43 V

105 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

200 MHz

30

260

MULTIPLE

16 mm

2

CMOS

1.5 V

4

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B288

3

Not Qualified

YES

NO

e1

8

TMS32C6414EZLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6415EZLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS32C6416EZLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

260

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320DM6435ZDU6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZDU7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZDUQ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZWT5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

81920

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZWT6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

81920

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZWT7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZWTL

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

8

TMS320DM6435ZWTQ5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

81920

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

TMS320DM6435ZWTQ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

13

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

20480

YES

32

30

260

MULTIPLE

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

NO

NO

e1

8

ADSP-BF522BBCZ-3A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

30

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF522BBCZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

30

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF522KBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF522KBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF523KBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

533 rpm

YES

YES

e1

ADSP-BF523KBCZ-6A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

30

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

600 rpm

YES

YES

e1

ADSP-BF523KBCZ-6

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

Not Qualified

600 rpm

YES

YES

ADSP-BF524BBCZ-3A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

30

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF524BBCZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

30

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF524KBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF524KBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF525BBCZ-5A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

260

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

533 rpm

YES

YES

e1

ADSP-BF525KBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

533 rpm

YES

YES

e1

ADSP-BF525KBCZ-6A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

600 rpm

YES

YES

e1

ADSP-BF525KBCZ-6

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

600 rpm

YES

YES

e1

ADSP-BF526BBCZ-3A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF526BBCZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, FINE PITCH

BGA208,20X20,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

17 mm

YES

16

50 MHz

MULTIPLE

17 mm

CMOS

1.8 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B208

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF526KBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

300 rpm

YES

YES

e1

ADSP-BF526KBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF527KBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,23X23,20

1.7 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

16

50 MHz

30

260

MULTIPLE

12 mm

CMOS

1.8 V

Microprocessors

.5 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

533 rpm

YES

YES

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.