BALL Digital Signal Processors (DSPs) 1,179

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TNETV2664ACLZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2664FIBZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2664FIDZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZDUA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM					YES	32	30 MHz	30	260	MULTIPLE			CMOS		1.2 V					FIXED POINT	S-PBGA-B376	3		YES	NO	e1
TNETV2665ZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665ZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665ZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2666ACLZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2666FIDZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2666INZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2667FIBZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2667FIDZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2667ZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2685FIBZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV2685FIBZUTA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm		YES	32	720 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV2685FIDZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV2685VIDZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV2685ZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TNETV6421INZDU4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		22			GRID ARRAY		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	8	30 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B376	3		YES	NO	e1
TNETV6435INZWTQ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	EMIF ADDRESS BUS 22 AND DATA BUS 8 AVAILABLE	YES	32		30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV6437INZWTQ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	EMIF 22 ADDRESS AND 8 DATA BUS AVAILABLE	YES	32	27 MHz	30	260	MULTIPLE	16 mm		CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
VC55GPSGHH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.55 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	128K	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	2	CMOS		1.6 V			FLASH	.8 mm	FIXED POINT	S-PBGA-B179	3		YES	NO	e0	16
VC55GPSZHH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.55 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	128K	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	2	CMOS		1.6 V			FLASH	.8 mm	FIXED POINT	S-PBGA-B179	3		YES	NO	e1	16
VCBUSAM648T9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14			GRID ARRAY		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM					YES	32	900 MHz	30	245	MULTIPLE			CMOS		1.2 V					FIXED POINT	S-PBGA-B520	4		YES	NO	e1
TMS32C6416DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6414DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS32C6415DGLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V				TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e0
TMS320C6204GHKA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	65536	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	16 mm	2	CMOS	290 mA	1.5 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B288	3	Not Qualified	YES	NO	e0	8
TMS320C6204GLW200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	340	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA340,22X22,32	1.43 V				TIN LEAD	BOTTOM	2.095 mm	16384	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	18 mm		CMOS		1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B340	4	Not Qualified	YES	NO	e0
TMS320VC5470GHKA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	257	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.95 V		23	16	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA257,19X19,32	1.71 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	20	220	MULTIPLE	16 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B257	3	Not Qualified	YES	NO	e0
TMS320VC5471GHKA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	257	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.95 V		23	16	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA257,19X19,32	1.71 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	16 mm	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY	YES	32	100 MHz	20	220	MULTIPLE	16 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B257	3	Not Qualified	YES	NO	e0
ADSP-21065LCCA-240	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		24	32	3.3	GRID ARRAY	BGA196,14X14,40	3.13 V				TIN LEAD SILVER	BOTTOM	1.9 mm	17408	15 mm		YES	32	30 MHz		240	MULTIPLE	15 mm		CMOS		3.3 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified	NO	YES	e0
TMSDVC5416GGUR160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		23	32	1.6,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel		-40 Cel		BOTTOM	1.4 mm	131072	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	20 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.6 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified	YES	YES
TMS32C6203BGNZA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,50	1.43 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	524288	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS		1.5 V	4	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C54CSTGGU	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16	1.5,3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	100 Cel	4	0 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	14.7456 MHz	20	220	MULTIPLE	12 mm	2	CMOS		1.5 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	YES	YES	e0	16
TMS320DM642GNZ500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V				TIN LEAD	BOTTOM	2.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz			MULTIPLE	27 mm		CMOS		1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
ADSP-21992YBC	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V		20	16	2.5,3.3	GRID ARRAY	BGA196,14X14,40	2.375 V	125 Cel		-40 Cel	TIN LEAD	BOTTOM	1.85 mm	16384	15 mm		YES	16	150 MHz		240	MULTIPLE	15 mm		CMOS		2.5 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
TMS320C6412GDK500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V				TIN LEAD	BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz			MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320C6412GDK600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V				TIN LEAD	BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320C6412GNZ500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V				TIN LEAD	BOTTOM	2.8 mm	262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz			MULTIPLE	27 mm		CMOS		1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320DM648ZUTD7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	720 MHz	30	245	MULTIPLE	19 mm	8	CMOS		1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	YES	NO	e1	8
TMS320DM648ZUTD9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	900 MHz	30	245	MULTIPLE	19 mm	8	CMOS		1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	YES	NO	e1	8
TMS320DM640GNZ400	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V				TIN LEAD	BOTTOM	2.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz			MULTIPLE	27 mm		CMOS		1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
TMS320DM641GDK600	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V				TIN LEAD	BOTTOM	2.8 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz			MULTIPLE	23 mm		CMOS		1.4 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified	YES	NO	e0
SM32C6414DGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
SM32C6415DGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm		CMOS		1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified	YES	NO
SM320C6201GJCA20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	32	22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.5 mm	65536	35 mm		YES	32	50 MHz	NOT SPECIFIED	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4	Digital Signal Processors	FLASH	1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
SM320C6701GJCA12EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	167 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.