BALL Digital Signal Processors (DSPs) 1,179

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6743CZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY	BGA256,16X16,40					TIN SILVER COPPER	BOTTOM		8192						30	260				CMOS			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified			e1
TMS320C6415TBCLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm	ALSO REQUIRES 3.3V SUPPLY; SEATED HEIGHT-MAX ALSO AVAILABLE IN 3.15 MM	YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V		20	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.1 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6414TBCLZW8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32					TIN SILVER COPPER	BOTTOM		4096						30	260				CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified			e1
TMS320C6416TBCLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6416TBCLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6416TBCLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6416TBCLZD1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
OMAPL138BZCEA3R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V				TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	SINGLE	13 mm		CMOS	1.2 V		Other uPs/uCs/Peripheral ICs		.65 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified	YES	NO	e1
OMAPL138BZWTA3R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		23		1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V				TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	SINGLE	16 mm		CMOS	1.2 V		Other uPs/uCs/Peripheral ICs		.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified	YES	NO	e1
TMS320C6455BCTZ2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V		20	32	1.25	GRID ARRAY, HEAT SINK/SLUG	BGA697,29X29,32	1.2125 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	245	MULTIPLE	24 mm	4	CMOS	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320C6455BCTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V		20	32	1.25	GRID ARRAY, HEAT SINK/SLUG	BGA697,29X29,32	1.2125 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	245	MULTIPLE	24 mm	4	CMOS	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320DM647CUT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32					TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified			e1
TMS320DM647CUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		8192			YES	32	900 MHz	30	245	MULTIPLE		8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648CUT1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32					TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified			e1
TMS320DM648CUT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		8192	19 mm		YES	32	720 MHz	30	245	MULTIPLE	19 mm	8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648CUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		8192	19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm	8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648CUTA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		8192	19 mm		YES	32	800 MHz	30	245	MULTIPLE	19 mm	8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648CUTD7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		8192	19 mm		YES	32	720 MHz	30	245	MULTIPLE	19 mm	8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648CUTD9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	14	32	1.2,1.8,3.3	GRID ARRAY	BGA529,23X23,32	1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		8192	19 mm		YES	32	900 MHz	30	245	MULTIPLE	19 mm	8	CMOS	1.2 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B520	4	Not Qualified	YES	NO	e1	8
TMS320DM648ZUTD1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32					TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified			e1
TMS320DM8165SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8165SCYG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8165SCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8167SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8167SCYG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8167SCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168CCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168CCYG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168CCYGA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32	27 MHz	NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168CCYGH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168CCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168SCYG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168SCYGA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320DM8168SCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS	1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
ADSP-TS203SBBPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel		0 Cel		BOTTOM	3.1 mm	131072	25 mm		YES	32		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	25 mm		CMOS	1.05 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576		Not Qualified	NO	YES
TMS320C6678ACYPA25	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	841	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			24	32	1,1.5,1.8	GRID ARRAY, FINE PITCH	BGA841,29X29,32		100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.39 mm	8192	24 mm		YES	16		30	245	MULTIPLE	24 mm	16	CMOS		80	Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B841	4	Not Qualified	YES	NO	e1
TMS320C6415TBZLZW7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM								30	260				CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified			e1
TMS320C6416TBCLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V		20	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	4096	23 mm		YES	64	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.1 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified	YES	NO	e1	8
TMS320C6747DZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS	1.2 V	40	Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	YES	NO	e1
TMS320C6747DZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		15	32	1.3,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS	1.3 V	40	Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	YES	NO	e1
TMS320C6747DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS	1.2 V	40	Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	YES	NO	e1
TMS320C6747DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		15	32	1.3,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS	1.3 V	40	Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.