Analog Devices Digital Signal Processors (DSPs) 466

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF700KCPZ-1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	100 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF700KCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	200 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF701BBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	200 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF701KBCZ-1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	100 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF701KBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	200 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF702BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF702BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF702KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF702KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF703BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF703KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF704BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF704BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF704KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF704KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF705BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF706BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF706KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF706KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel	0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.5 mm	FIXED POINT	S-XQCC-N88	3	YES	YES	e3
ADSP-BF707BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	0	200 MHz	30	260	MULTIPLE	12 mm		CMOS	1.1 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS	1.8 V			.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-2186MKSTZ300R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14	FLATPACK, LOW PROFILE, FINE PITCH		2.37 V	70 Cel	0 Cel		QUAD	1.6 mm		14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS	2.5 V			.5 mm	FIXED POINT	S-PQFP-G100	3	YES	YES
ADSP-21587BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8	CMOS	1.1 V	1	SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
ADSP-21587KBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8	CMOS	1.1 V	1	SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
ADSP-21571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176		YES	YES
ADSP-21571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.15 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-21571CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176		YES	YES
ADSP-21571CSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	100 Cel	-40 Cel		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.15 V			.5 mm	FIXED POINT	S-PQFP-G176		YES	YES
ADSP-21571KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176		YES	YES
ADSP-21571KSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.15 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-21573BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V			.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573BBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V			.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-21573CBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	95 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V			.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-21573KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		16	GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel	0 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES
ADSP-SC570BSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-SC570BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-SC570CSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-SC570CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-SC570KSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3
ADSP-SC570KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS	1.1 V			.5 mm	FIXED POINT	S-PQFP-G176	3	YES	YES	e3

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.