Analog Devices Digital Signal Processors (DSPs) 466

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF532SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBBCZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21060KBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V		32	32	5	GRID ARRAY	BGA225,15X15,50	4.75 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm	131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm		CMOS		2.5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e1
ADSP-2187NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	32768	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2187NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	32768	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2188MKSTZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.89 V		14			FLATPACK, LOW PROFILE, FINE PITCH		2.61 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	75 MHz	30	260	MULTIPLE	14 mm		CMOS		2.75 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2188NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	57344	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2189NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	49152	14 mm		NO	24	40 MHz		260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2105BPZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14			CHIP CARRIER		4.5 V	85 Cel	1	-40 Cel	Matte Tin (Sn)	QUAD	4.45 mm	512	24.18 mm		NO	24	20 MHz	40	260	MULTIPLE	24.18 mm	1	CMOS	31 mA	5 V	0	1			1.27 mm	FIXED POINT	S-PQCC-J68	5	Not Qualified		YES	YES	e3
ADSP-21060KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1	32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	MATTE TIN	QUAD	4.1 mm	4M	32 mm	40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	40 MHz		260	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21060LABZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	4194304	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21060LKSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.45 V	1	32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V	85 Cel	3	0 Cel	MATTE TIN	QUAD	4.1 mm	4M	32 mm		YES	48	40 MHz		260	MULTIPLE	32 mm	1	CMOS	530 mA	3.3 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21061KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	32	32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	85 Cel	3	0 Cel	Matte Tin (Sn)	QUAD	4.1 mm	16384	32 mm		YES	48	40 MHz	40	260	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	6	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		NO	YES	e3
ADSP-21061LKBZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL EXTENDED	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	PGA225,15X15	3.15 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.57 mm	32768	23 mm		YES	48	40 MHz	40	260	MULTIPLE	23 mm		CMOS	480 mA	3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		NO	YES	e1
ADSP-21062KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1	32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	MATTE TIN	QUAD	4.1 mm	2M	32 mm	40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	40 MHz		260	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21062LABZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	225	BGA	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	GRID ARRAY	BGA225,15X15,50	3.15 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.7 mm	2097152	23 mm		YES	48	40 MHz		260	MULTIPLE	23 mm		CMOS		3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B225	3	Not Qualified		YES	YES	e1
ADSP-21062LCSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY		YES	3.45 V		32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V	100 Cel		-40 Cel	MATTE TIN	QUAD	4.1 mm	2097152	32 mm		YES	48	40 MHz		260	MULTIPLE	32 mm		CMOS		3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21062LKSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.45 V	1	32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V	85 Cel	3	0 Cel	MATTE TIN	QUAD	4.1 mm	2M	32 mm		YES	48	40 MHz		260	MULTIPLE	32 mm	1	CMOS	530 mA	3.3 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-2183BSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		14			FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	20 MHz		260	MULTIPLE	20 mm		CMOS		3.3 V					.5 mm	FIXED POINT	R-PQFP-G128	3	Not Qualified		YES	YES	e3
ADSP-2184BSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		14			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2184LBSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	MATTE TIN	QUAD	1.6 mm	2048	14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-2185LBSTZ-210	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-2186BSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	8196	14 mm		NO	24	20 MHz	30	260	MULTIPLE	14 mm		CMOS		5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2186NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-TS201SABPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm		CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-TS201SABPZ060	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64				MULTIPLE	25 mm		CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-TS202SABPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32			GRID ARRAY		1 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-TS203SABPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm	131072	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	32	125 MHz	40	260	MULTIPLE	25 mm		CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-2185MKCAZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			GRID ARRAY, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm		NO	24	37.5 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V					.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-2186MKCAZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			GRID ARRAY, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm		NO	24	37.5 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V					.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-2191MBCAZ-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	32768	10 mm		YES	16	100 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-2191MKCAZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22			GRID ARRAY, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		10 mm		YES	16	100 MHz	40	260	MULTIPLE	10 mm		CMOS		2.5 V					.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-BF561SBBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21262SBBCZ150	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	12 mm		YES	16	50 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21262SKBC-200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32	16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	65536	12 mm		YES	16	200 MHz		240	MULTIPLE	12 mm	3	CMOS		1.2 V	22		Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0	32
ADSP-2101BPZ-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	1	-40 Cel	Matte Tin (Sn)	QUAD	4.45 mm	512	24.18 mm		NO	24	25 MHz	40	260	MULTIPLE	24.18 mm	1	CMOS	38 mA	5 V	0	2	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68	5	Not Qualified		YES	YES	e3
ADSP-21065LKCAZ-264	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		24	32	3.3	GRID ARRAY	BGA196,14X14,40	3.13 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm	17408	15 mm		YES	32	33.33 MHz	30	260	MULTIPLE	15 mm		CMOS		3.3 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		NO	YES	e1
ADSP-2189NBCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm		CMOS		1.8 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-2189NKCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm		CMOS		1.8 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-21065LCCAZ-240	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		24	32	3.3	GRID ARRAY	BGA196,14X14,40	3.13 V					BOTTOM	1.9 mm	17408	15 mm		YES	32	30 MHz		260	MULTIPLE	15 mm		CMOS		3.3 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		NO	YES
ADSP-21992BSTZ	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.625 V		20	16		FLATPACK, LOW PROFILE, FINE PITCH		2.375 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES	16	160 MHz		260	MULTIPLE	24 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified		YES	YES	e3
ADSP-21160NKBZ-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V		32	32	1.9,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V	85 Cel		0 Cel		BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS		1.9 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400		Not Qualified		NO	YES
ADSP-2186NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF512BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm		CMOS		1.225 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF512BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168		Not Qualified	400 rpm	YES	YES
ADSP-BF512BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz		260	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF512BSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.