Analog Devices Digital Signal Processors (DSPs) 466

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code
ADSP-2100SZ	Analog Devices		MILITARY	GULL WING	100	QFP	SQUARE	CERAMIC	YES			16	5	FLATPACK	QFP100,.9SQ		125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	QUAD		0										CMOS	100 mA	5 V	Digital Signal Processors	.635 mm	FIXED POINT	S-XQFP-G100		Not Qualified				e0
ADSP21CSP01KS200	Analog Devices		COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES			16	5	FLATPACK	QFP160,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		8192										CMOS		5 V	Digital Signal Processors	.635 mm	FIXED POINT	S-PQFP-G160		Not Qualified				e0
ADSP-TS201SYBPZ050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.1 mm		25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz	40	260	MULTIPLE	25 mm	CMOS		1.05 V	Digital Signal Processors	1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e1
ADSP-BF535PKBZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	260	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	26			GRID ARRAY		.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	32	40 MHz			MULTIPLE	19 mm	CMOS		1.5 V		1 mm	FIXED POINT	S-PBGA-B260	3	Not Qualified		YES	YES	e1
ADSP-21469BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm	CMOS	10 mA	1.05 V	Digital Signal Processors	1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-21469KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm	CMOS	10 mA	1.05 V	Digital Signal Processors	1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-BF516KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm	CMOS		1.225 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF516KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	30	260	MULTIPLE	12 mm	CMOS		1.4 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF516KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.47 V	19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel	0 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm	CMOS		1.225 V	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-BF516KSWZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.47 V	19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel	0 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm	CMOS		1.4 V	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	400 rpm	YES	YES
ADSP-BF516KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.47 V	19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel	0 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm	CMOS		1.4 V	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES
ADSP-BF536BBCZ3BRL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz	30	260	MULTIPLE	17 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-21060LKSZ-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	3.45 V	32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V	85 Cel	0 Cel	MATTE TIN	QUAD	4.1 mm	4194304	32 mm		YES	48	33.33 MHz			MULTIPLE	32 mm	CMOS		3.3 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G240		Not Qualified		YES	YES	e3
ADSP-21062CSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	100 Cel	-40 Cel	Matte Tin (Sn)	QUAD	4.1 mm	2097152	32 mm		YES	48	40 MHz	30	260	MULTIPLE	32 mm	CMOS		5 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e3
ADSP-21160NCBZ-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	2 V	32	32	1.9,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V			TIN SILVER COPPER	BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz		260	MULTIPLE	27 mm	CMOS		1.9 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		NO	YES	e1
ADSP-21990BSTZ	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	2.625 V	20			FLATPACK, LOW PROFILE, FINE PITCH		2.375 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES	16	160 MHz			MULTIPLE	24 mm	CMOS		2.5 V		.5 mm	FIXED POINT	S-PQFP-G176	1	Not Qualified		YES	YES	e3
ADSP-21362BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21363BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21363KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21363YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V	16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz		260	MULTIPLE	20 mm	CMOS		1 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21364BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21364KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21364YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V	16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz		260	MULTIPLE	20 mm	CMOS		1 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21366BSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm	CMOS		1.2 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21366YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V	16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz			MULTIPLE	20 mm	CMOS		1 V	Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-BF533SBBCZ-5V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V	19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF533SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V	19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBSTZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.45 V	19	32	1.2,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	.8 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	24 mm	CMOS		1.2 V	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES	e3
ADSP-BF533SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V	19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm	CMOS		1.3 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21368KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel	0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm	CMOS		1.3 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21369KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz			MULTIPLE	27 mm	CMOS		1.3 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-BF561SKBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.4185 V	23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	17 mm	CMOS		1.35 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF537BBCZ-5AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	19	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	533 MHz		260	MULTIPLE	12 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF537BBCZ-5BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	19	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	1.2 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	533 MHz		260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF537KBCZ-6AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V	19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	12 mm	CMOS		1.3 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF537KBCZ-6BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V	19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	17 mm	CMOS		1.3 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-2185NKCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V	14			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	70 Cel	0 Cel		BOTTOM	1.4 mm		10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm	CMOS		1.8 V		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES
ADSP21262SKBCZ200R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	12 mm		YES	16	66.67 MHz		260	MULTIPLE	12 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-BF533SBBC400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm	CMOS		1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified	400 rpm	YES	YES	e0
ADSP-BF533SBBZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V	19	32	1.2,1.8/3.3,3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	19 mm	CMOS		1.2 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B169	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	533 MHz		260	MULTIPLE	12 mm	CMOS		1.25 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF561SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.4185 V	23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	12 mm	CMOS		1.35 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF542BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V	22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF544BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V	22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF547BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.43 V	22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS		1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-2104BPZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			16	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	MATTE TIN	QUAD		256							260			CMOS	31 mA	5 V	Digital Signal Processors	1.27 mm	FIXED POINT	S-PQCC-J68	5	Not Qualified				e3

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.