| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
15 |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
4.5 V |
125 Cel |
4 |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
50 MHz |
MULTIPLE |
0 |
CMOS |
200 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
15 |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
4.75 V |
70 Cel |
4 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
24.576 MHz |
MULTIPLE |
0 |
CMOS |
90 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
15 |
16 |
5 |
FLATPACK |
SPQFP100,.9SQ |
4.75 V |
70 Cel |
4 |
0 Cel |
TIN LEAD |
QUAD |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
24.576 MHz |
MULTIPLE |
0 |
CMOS |
90 mA |
5 V |
0 |
0 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
15 |
16 |
5 |
FLATPACK |
SPQFP100,.9SQ |
4.75 V |
70 Cel |
4 |
0 Cel |
TIN LEAD |
QUAD |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
32.768 MHz |
MULTIPLE |
0 |
CMOS |
90 mA |
5 V |
0 |
0 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
38535Q/M;38534H;883B |
15 |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
4.5 V |
125 Cel |
4 |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
24.576 MHz |
MULTIPLE |
0 |
CMOS |
100 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P100 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
3 |
-40 Cel |
TIN LEAD |
QUAD |
512 |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
12.5 MHz |
MULTIPLE |
1 |
CMOS |
45 mA |
5 V |
0 |
2 |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
FLATPACK |
QFP80,.7SQ |
4.5 V |
85 Cel |
3 |
-40 Cel |
TIN LEAD |
QUAD |
512 |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
12.5 MHz |
MULTIPLE |
1 |
CMOS |
45 mA |
5 V |
0 |
2 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
16 |
14 |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
4.5 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
512 |
16-BIT SIGMA-DELTA ADC AND DAC; 8/16 BIT PARALLEL HOST INTERFACE PORT; SINGLE CYCLE INSTR EXECUTION |
NO |
24 |
13 MHz |
MULTIPLE |
1 |
CMOS |
90 mA |
5 V |
0 |
2 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P144 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
16 |
14 |
16 |
5 |
FLATPACK |
QFP100,.7X.9 |
4.5 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
512 |
16-BIT SIGMA-DELTA ADC AND DAC; 8 BIT PARALLEL HOST INTERFACE PORT; SINGLE CYCLE INSTR EXECUTION |
NO |
24 |
13 MHz |
MULTIPLE |
1 |
CMOS |
90 mA |
5 V |
0 |
2 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
R-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
PIN/PEG |
223 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
24 |
32 |
5 |
GRID ARRAY |
PGA223,18X18 |
4.5 V |
125 Cel |
4 |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
SINGLE CYCLE INSTR EXECUTION; 100 MFLOPS PEAK; 66 MFLOPS SUSTAINED; ADDRESSING OF PAGE MODE DRAM |
YES |
48 |
20 MHz |
MULTIPLE |
1 |
CMOS |
370 mA |
5 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P223 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
1024 |
CMOS |
5 V |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P144 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
FLAT |
308 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
32 |
32 |
3.3 |
FLATPACK, GUARD RING |
TPAK308,3.0SQ,25 |
3.15 V |
100 Cel |
-40 Cel |
GOLD |
QUAD |
4.064 mm |
524288 |
52.07 mm |
YES |
48 |
40 MHz |
MULTIPLE |
52.07 mm |
CMOS |
2120 mA |
3.3 V |
Digital Signal Processors |
.635 mm |
FLOATING POINT |
S-CQFP-F308 |
Not Qualified |
NO |
YES |
e4 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
2200 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
100 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
3400 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
3400 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
68 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.45 mm |
256 |
24.18 mm |
NO |
24 |
20 MHz |
MULTIPLE |
24.18 mm |
CMOS |
31 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
68 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
16 |
3.3 |
CHIP CARRIER |
LDCC68,1.0SQ |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.45 mm |
256 |
24.18 mm |
NO |
24 |
13.824 MHz |
MULTIPLE |
24.18 mm |
CMOS |
14 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
R-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
PIN/PEG |
100 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
16 |
14 |
16 |
5 |
GRID ARRAY |
PGA100M,13X13 |
4.5 V |
85 Cel |
1 |
-40 Cel |
TIN LEAD |
PERPENDICULAR |
4.29 mm |
512 |
33.53 mm |
20 MIPS; 8/16 BIT PARALLEL HOST INTERFACE PORT; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
20 MHz |
MULTIPLE |
33.53 mm |
1 |
CMOS |
60 mA |
5 V |
0 |
2 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P100 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
16 |
14 |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
85 Cel |
1 |
-40 Cel |
GOLD |
PERPENDICULAR |
4.17 mm |
512 |
27.885 mm |
NO |
24 |
25 MHz |
MULTIPLE |
27.885 mm |
1 |
CMOS |
38 mA |
5 V |
0 |
2 |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
14 |
16 |
3.3 |
CHIP CARRIER |
LDCC68,1.0SQ |
3 V |
70 Cel |
1 |
0 Cel |
TIN LEAD |
QUAD |
4.45 mm |
512 |
24.18 mm |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
10.24 MHz |
MULTIPLE |
24.18 mm |
1 |
CMOS |
20 mA |
3.3 V |
0 |
2 |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
14 |
16 |
3.3 |
FLATPACK |
QFP80,.7SQ |
3 V |
70 Cel |
1 |
0 Cel |
TIN LEAD |
QUAD |
2.45 mm |
512 |
14 mm |
20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION |
NO |
24 |
10.24 MHz |
MULTIPLE |
14 mm |
1 |
CMOS |
20 mA |
3.3 V |
0 |
2 |
Digital Signal Processors |
.65 mm |
FIXED POINT |
S-PQFP-G80 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
24 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA225,15X15,40 |
1.71 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.85 mm |
32768 |
17 mm |
YES |
48 |
27.5 MHz |
260 |
MULTIPLE |
17 mm |
CMOS |
965 mA |
1.8 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
24 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA225,15X15,40 |
1.71 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.85 mm |
32768 |
17 mm |
YES |
48 |
27.5 MHz |
MULTIPLE |
17 mm |
CMOS |
965 mA |
1.8 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
NO |
YES |
e1 |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
208 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
32 |
1.2,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
1.14 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
65536 |
28 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
55.56 MHz |
30 |
260 |
MULTIPLE |
28 mm |
CMOS |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
NO |
YES |
e3 |
||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
208 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
24 |
32 |
1.3,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
1.25 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
65536 |
28 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
58.34 MHz |
30 |
260 |
MULTIPLE |
28 mm |
CMOS |
1.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
NO |
YES |
e3 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
208 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
24 |
32 |
1.3,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
1.25 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
65536 |
28 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
61.01 MHz |
30 |
260 |
MULTIPLE |
28 mm |
CMOS |
1.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
NO |
YES |
e3 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.43 V |
13 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.188 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
17 mm |
YES |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
17 mm |
CMOS |
1.25 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
Tin/Silver/Copper (Sn/Ag/Cu) |
30 |
260 |
CMOS |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
Tin/Silver/Copper (Sn/Ag/Cu) |
30 |
260 |
CMOS |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
30 |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
PGA225,15X15 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.57 mm |
32768 |
23 mm |
YES |
48 |
40 MHz |
30 |
225 |
MULTIPLE |
23 mm |
CMOS |
480 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA225,15X15,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
65536 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
65536 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL EXTENDED |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
16384 |
32 mm |
YES |
48 |
33 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
595 mA |
5 V |
6 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
NO |
YES |
e0 |
|||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
TIN LEAD |
QUAD |
4.1 mm |
65536 |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
4.1 mm |
2M |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
30 |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
2M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
TIN LEAD |
QUAD |
4.1 mm |
65536 |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
2M |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
4.75 V |
100 Cel |
-40 Cel |
GOLD |
QUAD |
4.2 mm |
131072 |
32 mm |
YES |
48 |
40 MHz |
MULTIPLE |
32 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-CQFP-G240 |
Not Qualified |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
4.75 V |
100 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
4.3 mm |
131072 |
32 mm |
YES |
48 |
33.3 MHz |
MULTIPLE |
32 mm |
CMOS |
745 mA |
5 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-CQFP-G240 |
Not Qualified |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
4.75 V |
100 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
4.3 mm |
131072 |
32 mm |
YES |
48 |
40 MHz |
MULTIPLE |
32 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-CQFP-G240 |
Not Qualified |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.45 V |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
3.15 V |
100 Cel |
-40 Cel |
GOLD |
QUAD |
4.2 mm |
131072 |
32 mm |
YES |
48 |
40 MHz |
MULTIPLE |
32 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-CQFP-G240 |
Not Qualified |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
32 |
32 |
2.5,3.3 |
GRID ARRAY |
BGA400,20X20,50 |
2.37 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.49 mm |
131072 |
27 mm |
YES |
64 |
80 MHz |
225 |
MULTIPLE |
27 mm |
CMOS |
1410 mA |
2.5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B400 |
3 |
Not Qualified |
YES |
YES |
e0 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.