MICROPROCESSOR Microprocessors 124

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
ADSP-21488BSWZ-3B	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21488BSWZ-4A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
ADSP-21488BSWZ-4B	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
ADSP-21488KSWZ-3A1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-4A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
ADSP-21488KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
ADSP-21489BSWZ-3A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21489BSWZ-3B	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz	30	260	24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21489BSWZ-4A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
ADSP-21489BSWZ-4B	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
ADSP-21489KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21489KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21489KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
AM3874BCYE100	Texas Instruments	MICROPROCESSOR	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
AM3874BCYE80	Texas Instruments	MICROPROCESSOR	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
ADSP-21488BSWZ-3A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
TMS320C6474FCUN	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	30	245	23 mm	CMOS		1.1 V	64		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e1
ADSP-21488KSWZ-4B1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	NO	e3
ADSP-21489KSWZ-5B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		450 rpm	NO	e3
ADSP-BF606BBCZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF606KBCZ-4	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF607BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF607KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel		BOTTOM	1.5 mm		19 mm		YES		60 MHz	NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349		Not Qualified	500 rpm	YES
SB80L186EC-13	Intel	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.7 V	70 Cel	9	0 Cel	TIN LEAD	QUAD	1.66 mm	0	14 mm		NO	16	26 MHz			14 mm	CMOS	36 mA	3 V	4	2	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	13 rpm	YES	e0
Z8038018FSC	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V	0	32	32	5	FLATPACK	QFP100,.7X.9	4.75 V	70 Cel	5	0 Cel	TIN LEAD	QUAD	3.1 mm	0	14 mm	DYNAMIC BUS SIZING; DRAM REFRESH CONTROLLER	NO	16	18 MHz		240	20 mm	CMOS		5 V	0	0	Microprocessors	.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	18 rpm	YES	e0
30026-13	National Semiconductor	MICROPROCESSOR	OTHER	PIN/PEG	320	SPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	2.31 V		32	32		GRID ARRAY, SHRINK PITCH		2.09 V	85 Cel		0 Cel		PERPENDICULAR	3.07 mm		49.595 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.61 MHz			49.595 mm	CMOS		2.2 V				1.27 mm	FLOATING POINT	S-CPGA-P320		Not Qualified	166 rpm	YES
TMS320C6474FGUN2	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	95 Cel		0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS		1.1 V			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1200 rpm	YES	e0
TMS320C6474FGUNA	Texas Instruments	MICROPROCESSOR	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	100 Cel		-40 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS		1.1 V	64		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e0
TMS320C6474FGUN	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	100 Cel		0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS		1.1 V			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e0
TMS320C6474FZUNA	Texas Instruments	MICROPROCESSOR		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V				TIN SILVER COPPER	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	30	245	23 mm	CMOS		1.1 V			Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e1
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
XOMAP3525BCBB	Texas Instruments	MICROPROCESSOR		BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		0		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V					BOTTOM	.9 mm		12 mm		YES	0	19.2 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.8 V			Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515		Not Qualified	600 rpm	YES
XOMAP3530BCBB	Texas Instruments	MICROPROCESSOR		BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		0		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V					BOTTOM	.9 mm		12 mm		YES	0	19.2 MHz			12 mm	CMOS		1.8 V			Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515		Not Qualified	600 rpm	YES
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
XAM3517ZCN	Texas Instruments	MICROPROCESSOR		BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V					BOTTOM	1.3 mm		17 mm		YES	16	26 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.2 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491		Not Qualified	600 rpm	YES
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm		24.2 mm		NO	16	20 MHz	30	245	24.2 mm	HCMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.