MICROPROCESSOR Microprocessors 124

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
S9S08RNA8W2VTGR	NXP Semiconductors	MICROPROCESSOR																				TIN							40	260										3			e3
S9S08RNA8W2VTG	NXP Semiconductors	MICROPROCESSOR																				TIN							40	260										3			e3
S9S08RNA8W2VTJ	NXP Semiconductors	MICROPROCESSOR																				TIN							40	260										3			e3
FS32R274KSK2MMMR	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER							40	260										3			e2
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NSE7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32	40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
AD21489WBCPZ4202	Analog Devices	MICROPROCESSOR		NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1	AEC-Q100	24	40	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	125 Cel	3	-40 Cel		QUAD	.9 mm	5242880	12 mm	YES	16			12 mm	CMOS	500 mA	1.1 V	65		.5 mm	FLOATING POINT	S-XQCC-N88		400 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.