OTHER Microprocessors 260

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel	0	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	110 mA		32	10	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e1
66AK2H06BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H06BAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H06BXAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H12BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H12BAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H12BXAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H14BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H14BXAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
TMS320DM8127SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	28	32	GRID ARRAY, FINE PITCH		1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.1 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.2 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
XAM5728AABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5718ABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM3351BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
AM3351BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
X66AK2G02ZBB60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.95 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		.85 V	90 Cel		0 Cel		BOTTOM	1.7 mm		21 mm		YES	32	26 MHz			21 mm	CMOS		.9 V			.8 mm	FLOATING POINT	S-PBGA-B625		600 rpm	YES
MCIMX7S3DVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	95 Cel		0 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V			.4 mm	FLOATING POINT	S-PBGA-B488	3	800 rpm	YES
MCIMX7S3EVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	105 Cel		-20 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V			.4 mm	FLOATING POINT	S-PBGA-B488	3	800 rpm	YES
MCIMX7S5EVM08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel		-20 Cel		BOTTOM	1.42 mm		19 mm	SEATED-HGT CALCULATED	YES	32		40	260	19 mm	CMOS		1 V			.75 mm	FLOATING POINT	S-PBGA-B541	3	800 rpm	YES
AM5726BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
MPC8535AVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783	3	800 rpm	YES	e2
MPC8535BVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783	3	800 rpm	YES	e2
MCIMX7D2DVM12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.42 mm		19 mm		YES	16		40	260	19 mm	CMOS		1.225 V			.75 mm	FLOATING POINT	S-PBGA-B541	3	1200 rpm	YES
DM383AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V			.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
DM383AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V			.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
AM3351BZCE60R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
HPSDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
MTDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
MCIMX6L2DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
MCIMX6L8DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
AM3358BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO HAVING MULTIPLEXED 16 BIT ADDRESS	YES	16	26 MHz	30	260	13 mm	CMOS		1.1 V			.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
66AK2H05DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm		40 mm					30	245	40 mm	CMOS		1 V			1 mm		R-PBGA-B1517	4			e1
T2081NSN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSN8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz			10 mm	CMOS	105 mA		32	29	.65 mm	FLOATING-POINT	S-PBGA-B196		600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.