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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MIMXRT1021DAF5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	13	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel		TIN	YES	QUAD	YES	1.7 mm	262144	14 mm		YES	32	24 MHz	40	260	14 mm	CMOS	90 mA		32	YES	14	.5 mm	FLOATING POINT	S-PQFP-G100	3	500 rpm	YES	e3	57
LS1043ASE7KQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1000 rpm	YES	e1
LS1043ASE7PQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1400 rpm	YES	e1
LS1043ASE7QQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
LS1043ASN8MQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel				BOTTOM		2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES
MIMXRT1064DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	85 Cel	0			BOTTOM		1.43 mm	1048576	10 mm		YES	0	24 MHz	40	260	10 mm	CMOS	110 mA		32		10	.65 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES
MIMXRT1015DAF5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel	0	TIN		QUAD		1.7 mm	131072	14 mm		YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32		16	.5 mm	FLOATING POINT	S-PQFP-G100	3	500 rpm	YES	e3
BSC9131NSN1KHKB,557	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY, FINE PITCH		.97 V	105 Cel				BOTTOM		1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520		1000 rpm	YES
MIMXRT1051DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel	0	TIN SILVER		BOTTOM		1.52 mm	524288	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	105 mA		32		29	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e2
MC8640HJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel				BOTTOM		2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1250 rpm	NO
MC8640DHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel				BOTTOM		2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1067 rpm	NO
LX2080SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2080SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2160SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2160SC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2080SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120SE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120SE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2080SC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2080SE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2080SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2120SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2160SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2160SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2160SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2160SE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2160SE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2160SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2160SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2080SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2080SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LX2120SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120SC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES	e1
LS1012ASE7HKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel				BOTTOM		.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3	800 rpm	YES
LS1012ASN7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel				BOTTOM		.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
LS1012ASE7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel				BOTTOM		.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
T1040NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1040NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1040NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
P1010NSN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	TIN SILVER		BOTTOM		1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3	800 rpm	NO	e2
P1010NSE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	TIN SILVER		BOTTOM		1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2
P1010NSN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	TIN SILVER		BOTTOM		1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3	533 rpm	NO	e2
P1010NSN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	TIN SILVER		BOTTOM		1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.