Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1808BZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.3 V			Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
DM3725CBC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3725CBP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3730CBC100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
DM3730CBC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3730CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
DM3730CBP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3730CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
DM3730CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm		24.2 mm		NO	16	20 MHz	30	245	24.2 mm	HCMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3
MC68HC000EI8	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MC68EC000EI10	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	30 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	2	Not Qualified	10 rpm		e3
MC68HC000EI8R2	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
Z8018010PSG	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V		20	8		IN-LINE, SHRINK PITCH	SDIP64,.75	4.5 V	70 Cel	3	0 Cel	MATTE TIN	DUAL	5.01 mm		19.05 mm	DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY	NO	8				57.785 mm	CMOS	60 mA	5 V	2	2		1.778 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	YES	e3
Z8018010FSG	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES			20	8		FLATPACK			70 Cel		0 Cel	MATTE TIN	QUAD	3.1 mm		14 mm	DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY	NO	8				20 mm	CMOS	60 mA	5 V				.8 mm	FIXED POINT	R-PQFP-G80		Not Qualified	10 rpm	YES	e3
Z84C0006PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel	2	-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm	DRAM REFRESH COUNTER	NO	8	6.17 MHz			52.325 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6.17 rpm	YES	e3
Z84C0008PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel	2	-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm	DRAM REFRESH COUNTER	NO	8	8 MHz			52.325 mm	CMOS	40 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	8 rpm	YES	e3
Z84C0010PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16	8		IN-LINE		4.5 V	100 Cel	2	-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm	DRAM REFRESH COUNTER	NO	8	10 MHz			52.325 mm	CMOS	50 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	10 rpm	YES	e3
Z84C0006VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	6.17 MHz	40	260	16.5862 mm	CMOS	30 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	6.17 rpm	YES	e3
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	8 MHz	40	260	16.5862 mm	CMOS	40 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
Z84C0010VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	10 MHz	40	260	16.5862 mm	CMOS	50 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	10 rpm	YES	e3
KMPC8270CZUQLDA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY, LOW PROFILE		1.45 V					BOTTOM	1.65 mm		37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO
MVF50NN152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
MVF50NS152CMK50R	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
MVF60NN152CMK40	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
MVF60NN152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
MVF60NS152CMK40	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
MVF60NS152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
SVF312R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.16 V	85 Cel		-40 Cel	TIN	QUAD	1.6 mm		24 mm		YES	0		40	260	24 mm	CMOS		1.23 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
SVF322R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									40	260											3				e3
SVF331R3K2CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									40	260											3				e3
SVF332R3K2CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									40	260											3				e3
SVF511R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF512R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF521R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF522R2K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF522R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF531R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF532R2K2CMK4R	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
SVF532R3K2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5706BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.