Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
AM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJR	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
MIMXRT1051DVL6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel	TIN SILVER COPPER		BOTTOM		1.43 mm	524288	10 mm		YES	0	24 MHz	40	260	10 mm	CMOS	105 mA		32		29	.65 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e1
MIMXRT1052DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel			BOTTOM		1.43 mm	524288	10 mm		YES	0	24 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	105 mA		32		29	.65 mm	FLOATING-POINT	S-PBGA-B196		600 rpm	YES
AM5706BCBDDAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM				17 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	500 rpm	YES	e1
AM5706BCBDDEAS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
AM5706BCBDDS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
AM5706BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
AM5706BCBDJEAS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
AM5708BCBDJEAS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
AM5708BCBDJS	Texas Instruments	MICROPROCESSOR, RISC																			TIN SILVER COPPER											30	260											3			e1
ADSP-21489KCPZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1	24	40	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	115 Cel	3	0 Cel			QUAD		.9 mm	5242880	12 mm		YES	16		30	260	12 mm	CMOS	500 mA	1.1 V	65			.5 mm	FLOATING POINT	S-XQCC-N88	3	400 rpm	NO
MIMXRT1021DAG5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	13	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.25 V	95 Cel		0 Cel	TIN	YES	QUAD	YES	1.6 mm	262144	20 mm		YES	32	24 MHz	40	260	20 mm	CMOS	90 mA		32	YES	14	.5 mm	FLOATING POINT	S-PQFP-G144	3	500 rpm	YES	e3	96
MIMXRT1062DVJ6A	NXP Semiconductors	MICROCONTROLLER, RISC																			TIN SILVER											40	260											3			e2
MIMXRT1062DVL6A	NXP Semiconductors	MICROCONTROLLER, RISC																			TIN SILVER COPPER											40	260											3			e1
AM5708BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm		17 mm	GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES	YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
ATSAMA5D27C-LD1G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel			BOTTOM		1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51		1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel			BOTTOM		1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51		1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel			BOTTOM		1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51		1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
AM5746ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5746ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5746ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5748ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5748ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5748ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5749ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5749ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
MIMXRT1061DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel		0 Cel	TIN SILVER		BOTTOM		1.52 mm	1048576	12 mm		YES		24 MHz	40	260	12 mm	CMOS	110 mA		32		8	.8 mm	FLOATING POINT	S-PBGA-B196	3	600 rpm	YES	e2
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
STM32MP157AAA3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel			BOTTOM		1.32 mm	724992	18 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448		650 rpm	YES
STM32MP157AAB3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel			BOTTOM		1.29 mm	724992	16 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP157AAB3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel			BOTTOM		1.29 mm	724992	16 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP157AAC3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361		650 rpm	YES
STM32MP157AAD3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	10 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
SAM9X60D1G-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16			.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D5MT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16			.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D6K-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16			.65 mm	FIXED POINT	R-PBGA-B196	3	600 rpm	YES	e1
SAM9X60D6KT-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16			.65 mm	FIXED POINT	R-PBGA-B196	3	600 rpm	YES	e1
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel	0	0 Cel	TIN SILVER COPPER		BOTTOM		1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	110 mA		32		10	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e1
AT91SAM9260B-CU-100	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.65 V	85 Cel	3	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm	8192	15 mm		YES	32	50 MHz			15 mm	CMOS		1.8 V	22			.8 mm	FIXED POINT	S-PBGA-B217		210 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	2	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm	98304	15 mm		YES	32	50 MHz			15 mm	CMOS	73.3 mA	1.2 V	22			.8 mm	FIXED POINT	S-PBGA-B324		240 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.