RECTANGULAR Other Function uPs,uCs & Peripheral ICs 617

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
JN5169-001-M03-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED		YES	3.6 V					MICROELECTRONIC ASSEMBLY		2 V	85 Cel			-40 Cel			UNSPECIFIED					16 mm								21 mm			CMOS		3.3 V							1.27 mm		R-XXMA-N27
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0	YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3	2400 rpm	YES	e4	8	25
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm						30	260	7 mm			CMOS		3 V							.5 mm		R-XQCC-N40	1
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm						30	260	7 mm			CMOS		3 V							.5 mm		R-XQCC-N40	1
AX-SIP-SFEU-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	NICKEL GOLD PALLADIUM		BOTTOM		.996 mm			7 mm						30	260	9 mm			CMOS		3 V									R-XBCC-B44	3
AX-SIP-SFEU-API-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	NICKEL GOLD PALLADIUM		BOTTOM		.996 mm			7 mm						30	260	9 mm			CMOS		3 V									R-XBCC-B44	3
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	3.6 V		TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel			-40 Cel			UNSPECIFIED		2.11 mm			14.73 mm					48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS		3.3 V									R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	3.6 V		TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel			-40 Cel			UNSPECIFIED		2.11 mm			14.73 mm					48 MHz			21.72 mm			CMOS		3.3 V									R-XXMA-N28
XCZU17EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
AX8052F143-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							260	7 mm			CMOS		3 V							.5 mm		R-PQCC-N40	1			e4
AX8052F143-3-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							260	7 mm			CMOS		3 V							.5 mm		R-PQCC-N40	1			e4
AX8052F131-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC40,.2X.28,20	2.2 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							260	7 mm			CMOS		3 V							.5 mm		R-PQCC-N40	1			e4
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED		YES	3.6 V		TS 16949			MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel			-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm			CMOS		3.3 V							1.27 mm		R-XXMA-N47				e4
ADUCM331WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	18 V		AEC-Q100			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel			-40 Cel			QUAD		1 mm			6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm			CMOS								SPI	.5 mm		S-XQCC-N32
XCZU46DR-1FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-1FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-1FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-2FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-2FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-2FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-2FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1760	4			e1
XCZU46DR-L1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.72 V									R-PBGA-B1760	4			e1
XCZU46DR-L1FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.72 V									R-PBGA-B1760	4			e1
XCZU46DR-L2FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.72 V									R-PBGA-B1760	4			e1
XCZU46DR-L2FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.72 V									R-PBGA-B1760	4			e1
XCZU47DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1156	4			e1
XCZU47DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V					GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.85 V									R-PBGA-B1517	4			e1
XCZU47DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.72 V									R-PBGA-B1156	4			e1
XCZU47DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.72 V									R-PBGA-B1517	4			e1
XCZU47DR-L1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.72 V									R-PBGA-B1156	4			e1
XCZU47DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	240				CMOS		.72 V									R-PBGA-B1517	4			e1
XCZU47DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V					GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM											30	245				CMOS		.72 V									R-PBGA-B1156	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.