RECTANGULAR Other Function uPs,uCs & Peripheral ICs 617

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
AGFA006R16A3E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B1546
AGFA006R16A2E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B1546
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS	3.8 V	1 mm	R-XXMA-N50	1
BM83SM1-00TA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V		MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS	3.8 V	1 mm	R-XXMA-N50	1
2751807	Phoenix Contact	MICROCONTROLLER		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		FLATPACK		4.5 V				QUAD									CMOS	5 V		R-PQFP-G100
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS		1.27 mm	R-PDSO-G8		e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS		1.27 mm	R-PDSO-G8		e4
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS		.5 mm	R-PDSO-N8		e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS		.5 mm	R-PDSO-N8		e4
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS		.5 mm	R-PDSO-N8		e4
ATECC608B-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS		.5 mm	R-PDSO-N8		e4
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	3.8 V		MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel	-40 Cel		UNSPECIFIED	2.4 mm	12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE					15 mm	CMOS	3 V	1.2 mm	R-XXMA-N31	3
TA100-Y230C2X01-00T-VAO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	SMALL OUTLINE	SOP8,.23	2.7 V	125 Cel	-40 Cel		DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS		1.27 mm	R-PDSO-G8
NRF9160-SIBA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SICA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SIBA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
NRF9160-SICA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V	.5 mm	R-XBGA-N127
AGIB027R31B2I1V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	-40 Cel		BOTTOM												R-PBGA-B3184
AGIB027R31B2E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B3184
AGIB022R31B1E2V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B3184
AGIB027R31B2I3V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	-40 Cel		BOTTOM												R-PBGA-B3184
AGIB027R31B3E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B3184
AGFA027R24C2E3E	Intel	SoC FPGA		BALL	2340		RECTANGULAR	PLASTIC/EPOXY	YES						100 Cel	0 Cel		BOTTOM												R-PBGA-B2340
ESP32-WROOM-32E(M113EH3200PH3Q0)	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38
CYW54907KWBGT	Infineon Technologies	SYSTEM ON CHIP		BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED					5.848 mm	CMOS	1.2 V	.2 mm	R-PBGA-B316
ST4SI2M0004TPIFW	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		105 Cel	-40 Cel		DUAL	1 mm	5 mm						6 mm	CMOS		1.27 mm	R-XDSO-N8
ST4SI2M0007AKIFW	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		105 Cel	-40 Cel		DUAL	1 mm	5 mm						6 mm	CMOS		1.27 mm	R-XDSO-N8
CYS0644AFNI-S2D43T	Infineon Technologies	PROGRAMMABLE SoC		BALL	100	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,12X17,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.9025 mm						4.1068 mm	CMOS	1.8 V	.42 mm	R-PBGA-B100
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V				.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V		R-PBGA-B325
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V				.97 V	100 Cel	-40 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V		R-PBGA-B325
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V				.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V		R-PBGA-B325
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V				.97 V	100 Cel	-40 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V		R-PBGA-B325
ESP32-S3-WROOM-1U-N4R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
CYPM1211-42FNXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	2.7 V	105 Cel	-40 Cel		BOTTOM	.55 mm	2.633 mm						3.184 mm	CMOS	3.3 V	.4 mm	R-PBGA-B42
ESP32-WROOM-32UE-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-WROOM-32E(M113EH2800PH3Q0)	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES			MICROELECTRONIC ASSEMBLY						UNSPECIFIED	3.35 mm	18 mm						25.5 mm	CMOS		1.27 mm	R-XXMA-N38
CY8C20055-24SXI	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				1.71 V	85 Cel	-40 Cel		DUAL									CMOS			R-PDSO-G16	3
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.