RECTANGULAR Other Function uPs,uCs & Peripheral ICs 617

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ST33HTPH2028AHD1

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

105 Cel

-40 Cel

DUAL

1.2 mm

4.4 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

CMOS

1.8 V

.65 mm

R-PDSO-G28

ATTPM20P-G3MA1-10-B

Microchip Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

TS 16949

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

1.8 V

70 Cel

0 Cel

DUAL

.6 mm

2 mm

3 mm

CMOS

SPI

.5 mm

R-PDSO-N8

MPFS250TL-FCG1152I

Microchip Technology

SoC FPGA

BALL

1152

RECTANGULAR

PLASTIC/EPOXY

YES

100 Cel

-40 Cel

BOTTOM

CMOS

R-PBGA-B1152

BM83SM1-00TB

Microchip Technology

PROGRAMMABLE RFSoC

NO LEAD

50

XMA

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3.2 V

85 Cel

-40 Cel

UNSPECIFIED

2.5 mm

15 mm

32 mm

CMOS

3.8 V

1 mm

R-XXMA-N50

ATWINC1500-MR210PB1976

Microchip Technology

MICROPROCESSOR CIRCUIT

NO LEAD

28

XMA

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

21.72 mm

CMOS

3.3 V

R-XXMA-N28

ATWINC1500-MR210UB1976

Microchip Technology

MICROPROCESSOR CIRCUIT

NO LEAD

28

XMA

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

21.72 mm

CMOS

3.3 V

R-XXMA-N28

ATWINC1510-MR210PB1976

Microchip Technology

MICROPROCESSOR CIRCUIT

NO LEAD

28

XMA

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

21.72 mm

CMOS

3.3 V

R-XXMA-N28

CC3200MODR1M2AMOBT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

63

BCC

RECTANGULAR

UNSPECIFIED

YES

3.6 V

NO

CHIP CARRIER

2.3 V

70 Cel

-20 Cel

NICKEL GOLD

YES

BOTTOM

NO

2.45 mm

17.5 mm

0

0

30

260

20.5 mm

CMOS

4-Ch 12-Bit

3.3 V

NO

I2C; SPI; UART

1.27 mm

R-XBCC-B63

3

e4

25

CC3000MODT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

46

RECTANGULAR

UNSPECIFIED

YES

4.8 V

MICROELECTRONIC ASSEMBLY

2.7 V

70 Cel

-20 Cel

QUAD

2 mm

13.5 mm

SEATED HGT-NOM

16.3 mm

CMOS

3.6 V

R-XQMA-N46

SP1ML-915

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

16

RECTANGULAR

UNSPECIFIED

NO

3.6 V

MICROELECTRONIC ASSEMBLY

1.8 V

85 Cel

-40 Cel

DUAL

2.5 mm

13.4 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3 V

1.5 mm

R-XDMA-N16

CYTMA525-49FNI25ZZT

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

BALL

49

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY

1.71 V

BOTTOM

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

CMOS

R-PBGA-B49

XCZU9EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU11EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-2FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1517

4

e1

XCZU11EG-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU11EG-3FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU11EG-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU11EG-L1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU11EG-L1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU11EG-L2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU11EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU11EG-L2FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU15EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU15EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU15EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU15EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU15EG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU15EG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU15EG-3FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU15EG-L1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU15EG-L1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XCZU15EG-L2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU17EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU17EG-1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU17EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.