SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
TDA8007BHL/C4,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel		-40 Cel		QUAD	1.6 mm		7 mm				260	7 mm		CMOS	315 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G48	1	Not Qualified
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
CC2545RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		7 mm		0	30	260	7 mm		CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; UART; USART	.5 mm		S-PQCC-N48	3	Not Qualified		e4
CC2545RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		7 mm		0	30	260	7 mm		CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; UART; USART	.5 mm		S-PQCC-N48	3	Not Qualified		e4
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES				CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE	0	30	260	4 mm		CMOS				I2C; SPI	.5 mm		S-PQCC-N24	2			e4
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm		CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM369ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm		CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM369ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm		CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM369ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32	30	260	13 mm		CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel		0 Cel		BOTTOM	1.5 mm		13 mm					13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.5 mm		13 mm					13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.5 mm		13 mm					13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel		BOTTOM	1.5 mm		13 mm					13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm		23 mm					23 mm		CMOS		1 V			1 mm		S-PBGA-B484
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		23 mm					23 mm		CMOS		1 V			1 mm		S-PBGA-B484
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		23 mm					23 mm		CMOS		1 V			1 mm		S-PBGA-B484
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		23 mm					23 mm		CMOS		1 V			1 mm		S-PBGA-B484
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		23 mm					23 mm		CMOS		1 V			1 mm		S-PBGA-B484
XC7Z030-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676	4			e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z100-1FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.1 mm		35 mm					35 mm		CMOS		1 V			1 mm		S-PBGA-B1156
XC7Z100-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.1 mm		35 mm					35 mm		CMOS		1 V			1 mm		S-PBGA-B1156
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
CP3SP33SMR/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm			30	260	10 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers		.8 mm		S-PBGA-B144	3	Not Qualified	96 rpm	e1
TCI6636K2HDAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm			30	245	40 mm		CMOS		1 V			1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm			30	245	40 mm		CMOS		1 V			1 mm		S-PBGA-B1517	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.