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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

SI8250-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

SI8251-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

TMS320DM6467CZUT7

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM365ZCE21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM365ZCE30

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM365ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMX320DM365BZCE

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

0 Cel

BOTTOM

1.3 mm

8192

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.2 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B338

Not Qualified

TMS320DM6467TZUT1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TZUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

PSD854F2V-90M

STMicroelectronics

COMMERCIAL

GULL WING

52

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3

FLATPACK

QFP52,.52SQ

70 Cel

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

QUAD

2359296 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.635 mm

S-PQFP-G52

Not Qualified

e4

.0001 Amp

.00000009 ns

PSD854F2V-90J

STMicroelectronics

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

3.3

CHIP CARRIER

LDCC52,.8SQ

70 Cel

0 Cel

Matte Tin (Sn)

N

QUAD

2359296 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J52

Not Qualified

e3

.0001 Amp

.00000009 ns

TMS320DM6433ZDU4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

376

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA376,22X22,40

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

20480

23 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

260

23 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

e1

LH79520N0M000B1

NXP Semiconductors

COMMERCIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

70 Cel

0 Cel

QUAD

Other uPs/uCs/Peripheral ICs

.4 mm

S-PQFP-G176

Not Qualified

LH7A400N0E000B3A

NXP Semiconductors

COMMERCIAL

BALL

256

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA256,16X16,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B256

Not Qualified

LH7A404N0E000B0A

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

DM355SDZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DM355SDZCEA216

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355CZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM355DZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

TMX320DM355ZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

BOTTOM

1.3 mm

32768

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

Not Qualified

SM32DM355GCEM216EP

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

1.3 mm

8192

13 mm

32

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

e0

TMS320DM6441AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.05 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

XA7Z010-1CLG225Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

125 Cel

-40 Cel

TIN SILVER COPPER

N

BOTTOM

1.5 mm

13 mm

13 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B225

3

Not Qualified

e1

XA7Z010-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z010-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XA7Z020-1CLG484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

125 Cel

-40 Cel

TIN SILVER COPPER

N

BOTTOM

1.6 mm

19 mm

30

260

19 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B484

3

Not Qualified

e1

XA7Z030-1FBG484I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY

BGA484,22X22,40

Tin/Silver/Copper (Sn/Ag/Cu)

N

BOTTOM

2.54 mm

23 mm

30

250

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e1

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY

BGA484,22X22,40

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

N

BOTTOM

2.54 mm

23 mm

30

250

23 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B484

4

Not Qualified

e1

TMS320DM6446BZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TDA8002CG/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP32,.28SQ,20

3 V

85 Cel

-25 Cel

TIN

QUAD

1.6 mm

5 mm

5 mm

CMOS

140 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G32

3

Not Qualified

e3

TDA8007BHL/C2,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

SILVER

QUAD

1.6 mm

7 mm

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e4

TDA8007BHL/C3,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

7 mm

30

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e3

FT245BM

FTDI

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK, LOW PROFILE

4.35 V

70 Cel

0 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

250

7 mm

CMOS

5 V

.8 mm

S-PQFP-G32

3

Not Qualified

e0

TCI6630K2LCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.