MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel		-40 Cel		QUAD	4.1 mm			28 mm						28 mm		CMOS		1.2 V				.5 mm		S-PQFP-G208	3
TDA8029HL/C207,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES				1.8/5,3/5	FLATPACK	QFP32,.35SQ,32		90 Cel		-40 Cel		QUAD									260						Other Microprocessor ICs			.8 mm		S-PQFP-G32	1	Not Qualified
MFRC53001T/0FE,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				5	SMALL OUTLINE	SOP32,.4		85 Cel		-25 Cel		DUAL									250				40 mA	5 V	Other Microprocessor ICs			1.27 mm		R-PDSO-G32	3	Not Qualified
TDA8026ET/C2,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel	TIN SILVER COPPER	BOTTOM								30	260				260 mA	3.3 V	Other Microprocessor ICs			.8 mm		S-PBGA-B64	2	Not Qualified		e1
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel		BOTTOM									260				260 mA	3.3 V	Other Microprocessor ICs			.8 mm		S-PBGA-B64	2	Not Qualified
TDA8026ET/C2,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel		BOTTOM									260				260 mA	3.3 V	Other Microprocessor ICs			.8 mm		S-PBGA-B64	2	Not Qualified
MF0ICU1001W/S7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel		-25 Cel																	Other Microprocessor ICs							Not Qualified
MF0ICU1001W/U7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel		-25 Cel																	Other Microprocessor ICs							Not Qualified
MF0ICU1101W/U7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel		-25 Cel																	Other Microprocessor ICs							Not Qualified
MF0ICU1101W/S7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel		-25 Cel																	Other Microprocessor ICs							Not Qualified
TDA8035HN/C1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel		-25 Cel		QUAD	1 mm			5 mm					260	5 mm		CMOS	220 mA	3.3 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
MFRC52301HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	QUAD								30	260				10 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified		e4
MFRC52301HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	QUAD								30	260				10 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified		e4
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD								30	260				100 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD								30	260				100 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
MFRC63102HN,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD								30	260				20 mA	5 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
MFRC63102HN,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA	5 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
MFRC63102HN,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA	5 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
MFRC63102HN,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA	5 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD								30	260				20 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
SLRC61002HN,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD													20 mA		Other Microprocessor ICs			.5 mm		S-PQCC-N32		Not Qualified
PR601HL/C1,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				3.3,5	FLATPACK	QFP100,.63SQ,20		70 Cel		-25 Cel		QUAD															Other Microprocessor ICs			.5 mm		S-PQFP-G100		Not Qualified
MF0UL1101DUD,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel		-20 Cel																	Other Microprocessor ICs							Not Qualified
MF0UL1101DUF,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel		-20 Cel																	Other Microprocessor ICs							Not Qualified
MF0UL2101DUD,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel		-20 Cel																	Other Microprocessor ICs							Not Qualified
MF0UL2101DUF,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel		-20 Cel																	Other Microprocessor ICs							Not Qualified
SL2MOS5301EV,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT						PLASTIC/EPOXY						MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)																					Other Microprocessor ICs							Not Qualified
SL2MOS5401EV,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT						PLASTIC/EPOXY						MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)																					Other Microprocessor ICs							Not Qualified
TMS320DM335CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		8192	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors			.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		8192	13 mm				30	260	13 mm		CMOS		1.3 V	Digital Signal Processors			.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		8192	13 mm			32	30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
OMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V				TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP			30	260	16 mm		CMOS		1 V	Other Microprocessor ICs			.8 mm		S-PBGA-B361	3	Not Qualified		e1
CC2571RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm			6 mm			0	30	260	6 mm		CMOS		3 V	Other uPs/uCs/Peripheral ICs		SPI; UART	.5 mm		S-PQCC-N40	3	Not Qualified		e4
CC2571RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm			6 mm			0	30	260	6 mm		CMOS		3 V	Other uPs/uCs/Peripheral ICs		SPI; UART	.5 mm		S-PQCC-N40	3	Not Qualified		e4
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		8192	13 mm			32	30	260	13 mm		CMOS		1.35 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
CC2540F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		8	6 mm		COMPARATORS, TIMER(4)		30	260	6 mm	8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs		SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4	21
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm			5 mm	ALSO OPERATES AT 5V SUPPLY					5 mm		CMOS		3.3 V				.65 mm		S-PQCC-N20				e3
OMAPL132BZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V				TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP			30	260	16 mm		CMOS		1 V	Other Microprocessor ICs			.8 mm		S-PBGA-B361	3	Not Qualified		e1
OMAPL132BZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V				TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.2 V TYP			30	260	16 mm		CMOS		1 V	Other Microprocessor ICs			.8 mm		S-PBGA-B361	3	Not Qualified		e1
TMS320DM6441BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		32	1.05/1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		20480	16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP		48	30	260	16 mm		CMOS		1.05 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
TMS320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		20480	16 mm			48	30	260	16 mm		CMOS		1.2 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
CC2543RHMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm			5 mm				30	260	5 mm		CMOS		3 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	3	Not Qualified		e4
CC2543RHMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm			5 mm				30	260	5 mm		CMOS		3 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	3	Not Qualified		e4
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN	QUAD		131072						30	260		8192	CMOS	150 mA		Microcontrollers	FLASH		.5 mm		S-PQCC-N40	3	Not Qualified	24 rpm	e3
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm				30	260	13 mm		CMOS		1.35 V				.65 mm		S-PBGA-B338	3			e1
R3910-CFAB-E1B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.