MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MSP430F67791IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MSP430F67791IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MSP430F67791IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F67791IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6779IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

25 MHz

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MSP430F6779IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

25 MHz

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6779IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

25 MHz

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6747IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

32

14 mm

0

25 MHz

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6748IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

16

14 mm

0

25 MHz

30

260

14 mm

16384

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

MSP430F6749IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

32

14 mm

0

25 MHz

30

260

14 mm

32768

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

TDA8007BHL/C4,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

CC2545RGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

7 mm

0

30

260

7 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

I2C; SPI; UART; USART

.5 mm

S-PQCC-N48

3

Not Qualified

e4

CC2545RGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

7 mm

0

30

260

7 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

I2C; SPI; UART; USART

.5 mm

S-PQCC-N48

3

Not Qualified

e4

RF430FRL154HCRGER

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

24

VQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, VERY THIN PROFILE

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4 mm

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

0

30

260

4 mm

CMOS

I2C; SPI

.5 mm

S-PQCC-N24

2

e4

SA3291A-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.777 mm

3.68 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

6.35 mm

CMOS

1.25 V

R-XXMA-N32

TMS320DM369ZCEDF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM369ZCED

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM369ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM369ZCE

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

CP3SP33SMR/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

16

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

1.62 V

85 Cel

CR16C

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

10 mm

30

260

10 mm

32768

CMOS

200 mA

1.8 V

Microcontrollers

.8 mm

S-PBGA-B144

3

Not Qualified

96 rpm

e1

TCI6636K2HDAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HDAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HDAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HDAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6638K2KDAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6638K2KDAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6638K2KDAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6638K2KDAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

CP3SP33SMS/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

224

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

16

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA224,15X15,32

1.62 V

85 Cel

CR16C

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

13 mm

32

30

260

13 mm

32768

CMOS

200 mA

1.8 V

Microcontrollers

I2C; I2S; SPI; UART; USB

.8 mm

S-PBGA-B224

3

Not Qualified

96 rpm

e0

M82710-14

Mindspeed Technologies

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

GRID ARRAY

110 Cel

-25 Cel

BOTTOM

CMOS

R-PBGA-B484

MTFC32GJVED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC4GMVEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

MTFC64GJVDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC8GLVEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

SDIO101AIHRE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

260

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

2

SDIO101AIHRZ

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

260

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

2

MTFC16GJDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

MTFC4GLDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

MTFC8GLDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

CP2130-F01-GM

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

QUAD

.8 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

MTFC32GJDED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC64GJDDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC8GLDEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

9LPRS511EGLFT

Integrated Device Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP64,.32,20

70 Cel

0 Cel

TIN

DUAL

260

CMOS

3.3 V

Clock Generators

.5 mm

R-PDSO-G64

1

Not Qualified

e3

TP3465V/63SN

Texas Instruments

MICROPROCESSOR CIRCUIT

MATTE TIN

30

245

CMOS

3

e3

SN74ACT8990FNR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

5

CHIP CARRIER

LDCC44,.7SQ

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

4.57 mm

16.5862 mm

16

30

260

16.5862 mm

CMOS

.45 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J44

3

Not Qualified

e4

SNJ54ACT8990HV

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

68

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-PRF-38535

5

FLATPACK

QFL68,.5SQ,25

4.5 V

125 Cel

-55 Cel

QUAD

3.86 mm

12.51 mm

16

NOT SPECIFIED

NOT SPECIFIED

12.51 mm

CMOS

.45 mA

5 V

Other Microprocessor ICs

.635 mm

S-CQFP-F68

Not Qualified

SNJ54ACT8990GB

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

PIN/PEG

68

PGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

5.5 V

MIL-PRF-38535

5

GRID ARRAY

PGA68,11X11

4.5 V

125 Cel

-55 Cel

TIN LEAD

PERPENDICULAR

3.62 mm

24.38 mm

16

24.38 mm

CMOS

.45 mA

5 V

Other Microprocessor ICs

2.54 mm

S-CPGA-P68

Not Qualified

e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.